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7 条记录 (耗时 0.013 秒)

    PRESSURE SENSOR
    2.
    发明申请
    PRESSURE SENSOR 审中-公开

    公开(公告)号：US20170089784A1

    公开(公告)日：2017-03-30

    申请号：US15269169

    申请日：2016-09-19

    申请人： NAGANO KEIKI CO., LTD.

    发明人： Nobutaka Yamagishi ,  Naoki Yamashita ,  Atsushi Imai

    IPC分类号： G01L7/08 ,  G01L9/00

    CPC分类号： G01L7/082 ,  G01L9/0041 ,  G01L19/0038 ,  G01L19/0627 ,  G01L19/143

    摘要： A pressure sensor includes a pressure sensor element, a joint provided to a target member, and an attachment member that is fitted into the joint through the connection section and connected to the target member. Each of the pressure sensor element and the joint is formed of a material that is not embrittled upon being in contact with a fluid to be measured that embrittles a material, and more rigid than the attachment member. The connection section is subjected to a plastic deformation connection (metal flow). An expensive hydrogen embrittlement resistant material is used for the pressure sensor element and the joint that are brought into contact with the fluid to be measured, and an inexpensive material is used for the attachment member that is not brought into contact with the fluid to be measured, thereby reducing the production cost of the pressure sensor.

    PHYSICAL QUANTITY MEASURING DEVICE
    3.
    发明申请
    PHYSICAL QUANTITY MEASURING DEVICE 有权
    物理量测量装置

    公开(公告)号：US20160091377A1

    公开(公告)日：2016-03-31

    申请号：US14865568

    申请日：2015-09-25

    申请人： NAGANO KEIKI CO., LTD.

    发明人： Shuji Tohyama ,  Nobutaka Yamagishi ,  Naoki Yamashita ,  Yusuke Midorikawa

    IPC分类号： G01L9/00

    CPC分类号： G01L9/0051 ,  G01L9/0044 ,  G01L9/0055 ,  G01L19/0084

    摘要： A device includes: a sensor module; a housing that houses the sensor module; a connector provided to the housing; a terminal provided to the connector; and an elastic electrically conductive member provided in a space between the sensor module and the connector and interposed between the terminal and a pad. The sensor module includes: a ceramic module body including a diaphragm and a cylindrical portion integral with a periphery of the diaphragm; a detector provided on a flat surface of the diaphragm; and the pad and an electronic component provided on a flat surface of the cylindrical portion radially outwardly adjacent to the flat surface of the diaphragm. The pad is electrically connected to the electrically conductive member.

    摘要翻译： 一种装置包括：传感器模块; 容纳传感器模块的壳体; 连接器，其设置在壳体上; 一个提供给连接器的端子; 以及弹性导电构件，其设置在所述传感器模块和所述连接器之间的空间中并且插入在所述端子和垫之间。 传感器模块包括：陶瓷模块主体，包括隔膜和与隔膜的周边一体的圆柱形部分; 检测器，设置在隔膜的平坦表面上; 并且所述垫和电子部件设置在所述圆筒形部分的平坦表面上，径向向外与所述隔膜的平坦表面相邻。 焊盘电连接到导电构件。

    Pressure sensor configured to detect pressure of fluid to be measured that embrittles material
    4.
    发明授权
    Pressure sensor configured to detect pressure of fluid to be measured that embrittles material 有权

    公开(公告)号：US10151656B2

    公开(公告)日：2018-12-11

    申请号：US15269169

    申请日：2016-09-19

    申请人： NAGANO KEIKI CO., LTD.

    发明人： Nobutaka Yamagishi ,  Naoki Yamashita ,  Atsushi Imai

    IPC分类号： G01L7/08 ,  G01L9/00 ,  G01L19/00 ,  G01L19/06 ,  G01L19/14

    摘要： A pressure sensor includes a pressure sensor element, a joint provided to a target member, and an attachment member that is fitted into the joint through the connection section and connected to the target member. Each of the pressure sensor element and the joint is formed of a material that is not embrittled upon being in contact with a fluid to be measured that embrittles a material, and more rigid than the attachment member. The connection section is subjected to a plastic deformation connection (metal flow). An expensive hydrogen embrittlement resistant material is used for the pressure sensor element and the joint that are brought into contact with the fluid to be measured, and an inexpensive material is used for the attachment member that is not brought into contact with the fluid to be measured, thereby reducing the production cost of the pressure sensor.

    THREE-DIMENSIONAL CIRCUIT COMPONENT, METHOD OF MAKING THE SAME, AND PHYSICAL-QUANTITY MEASURING INSTRUMENT
    5.
    发明申请
    THREE-DIMENSIONAL CIRCUIT COMPONENT, METHOD OF MAKING THE SAME, AND PHYSICAL-QUANTITY MEASURING INSTRUMENT 有权
    三维电路组件及其制造方法和物理量测量仪器

    公开(公告)号：US20140022735A1

    公开(公告)日：2014-01-23

    申请号：US13941630

    申请日：2013-07-15

    申请人： Nagano Keiki Co., Ltd.

    发明人： Nobutaka Yamagishi ,  Naoki Yamashita ,  Atsushi Imai

    IPC分类号： H05K1/16 ,  H05K3/34

    CPC分类号： H05K1/16 ,  H05K1/0284 ,  H05K3/34 ,  H05K3/3442 ,  H05K2201/09118 ,  H05K2201/0999 ,  Y10T29/49144

    摘要： For producing a three-dimensional circuit component, an electronic component is mounted on a synthetic resin block. A plurality of electrically-conductive patterns used to establish an electrical connection to the electronic component are formed on the block along a three-dimensional shape of the block. An end of each electrically-conductive patterns is provided with a solder-disposed section. A solder is provided between the solder-disposed section and an opposed surface of the electronic component. The section of each electrically-conductive patterns other than the solder-disposed section and a section on which the electronic component is mounted is internally formed in the block. Since the section of each electrically-conductive patterns other than the section on which the electronic component is mounted is internally formed in the block, the electrically-conductive patterns are not unnecessarily exposed.

    摘要翻译： 为了制造三维电路部件，将电子部件安装在合成树脂块上。 用于建立与电子部件的电连接的多个导电图案沿块的三维形状形成在块上。 每个导电图案的端部设置有焊料放置部分。 在焊料设置部分和电子部件的相对表面之间设置焊料。 除了焊料设置部分之外的每个导电图案的部分和安装电子部件的部分内部形成在块中。 由于除了安装电子部件的部分之外的每个导电图案的部分内部形成在块中，所以导电图案不会被不必要地暴露。