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1.发明申请公开(公告)号：US20140022735A1
公开(公告)日：2014-01-23
申请号：US13941630
申请日：2013-07-15
CPC分类号： H05K1/16 , H05K1/0284 , H05K3/34 , H05K3/3442 , H05K2201/09118 , H05K2201/0999 , Y10T29/49144
摘要： For producing a three-dimensional circuit component, an electronic component is mounted on a synthetic resin block. A plurality of electrically-conductive patterns used to establish an electrical connection to the electronic component are formed on the block along a three-dimensional shape of the block. An end of each electrically-conductive patterns is provided with a solder-disposed section. A solder is provided between the solder-disposed section and an opposed surface of the electronic component. The section of each electrically-conductive patterns other than the solder-disposed section and a section on which the electronic component is mounted is internally formed in the block. Since the section of each electrically-conductive patterns other than the section on which the electronic component is mounted is internally formed in the block, the electrically-conductive patterns are not unnecessarily exposed.
摘要翻译： 为了制造三维电路部件，将电子部件安装在合成树脂块上。 用于建立与电子部件的电连接的多个导电图案沿块的三维形状形成在块上。 每个导电图案的端部设置有焊料放置部分。 在焊料设置部分和电子部件的相对表面之间设置焊料。 除了焊料设置部分之外的每个导电图案的部分和安装电子部件的部分内部形成在块中。 由于除了安装电子部件的部分之外的每个导电图案的部分内部形成在块中，所以导电图案不会被不必要地暴露。
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公开(公告)号：US11573144B2
公开(公告)日：2023-02-07
申请号：US17489219
申请日：2021-09-29
发明人： Masashi Ogawa , Atsushi Imai
摘要： A pressure detector includes a first board with a first pressure inlet, a first groove, and a first board electrode; a second board with a second pressure inlet, a second groove, and a second board electrode; and a sensing unit arranged therebetween with a diaphragm. The first groove is in communication with the first pressure inlet so as to prevent the formation of a closed space between the first board and the diaphragm when they contact with each other. The second groove is in communication with the second pressure inlet so as to prevent the formation of a closed space between the second board and the diaphragm when they contact each other.
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公开(公告)号：US09615458B2
公开(公告)日：2017-04-04
申请号：US13941630
申请日：2013-07-15
CPC分类号： H05K1/16 , H05K1/0284 , H05K3/34 , H05K3/3442 , H05K2201/09118 , H05K2201/0999 , Y10T29/49144
摘要： For producing a three-dimensional circuit component, an electronic component is mounted on a synthetic resin block. A plurality of electrically-conductive patterns used to establish an electrical connection to the electronic component are formed on the block along a three-dimensional shape of the block. An end of each electrically-conductive patterns is provided with a solder-disposed section. A solder is provided between the solder-disposed section and an opposed surface of the electronic component. The section of each electrically-conductive patterns other than the solder-disposed section and a section on which the electronic component is mounted is internally formed in the block. Since the section of each electrically-conductive patterns other than the section on which the electronic component is mounted is internally formed in the block, the electrically-conductive patterns are not unnecessarily exposed.
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4.发明授权公开(公告)号：US10151656B2
公开(公告)日：2018-12-11
申请号：US15269169
申请日：2016-09-19
摘要： A pressure sensor includes a pressure sensor element, a joint provided to a target member, and an attachment member that is fitted into the joint through the connection section and connected to the target member. Each of the pressure sensor element and the joint is formed of a material that is not embrittled upon being in contact with a fluid to be measured that embrittles a material, and more rigid than the attachment member. The connection section is subjected to a plastic deformation connection (metal flow). An expensive hydrogen embrittlement resistant material is used for the pressure sensor element and the joint that are brought into contact with the fluid to be measured, and an inexpensive material is used for the attachment member that is not brought into contact with the fluid to be measured, thereby reducing the production cost of the pressure sensor.
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公开(公告)号：US09352958B2
公开(公告)日：2016-05-31
申请号：US14540632
申请日：2014-11-13
发明人： Atsushi Imai , Ryouichi Matsumura
CPC分类号： B81B7/0051 , B81B2201/0264 , G01L19/0084 , G01L19/143 , G01L19/147 , H01H59/0009 , H01L29/0665 , H01L29/0673 , H01L29/84 , H01L2224/48091 , H01L2924/19105 , H01L2924/00014
摘要： A physical quantity measurement sensor includes: a ceramic package including a plate provided with a flow port through which a fluid to be measured flows; an electronic component including a sensing element housed in the package to detect the pressure of the fluid to be measured having flown through the flow port; a terminal provided on an exterior of the package; a lid attached to a wall of the package; and a metal attachment piece used to attach the package to the mount member, the attachment piece being engaged with the mount member while holding the package.
摘要翻译： 物理量测量传感器包括：陶瓷封装，其包括设置有待测流体流过的流动端口的板; 电子部件，其包括容纳在所述封装中的感测元件，以检测已经流过所述流动端口的被测量流体的压力; 设置在所述包装的外部的端子; 附接到包装壁的盖子; 以及用于将所述包装件附接到所述安装构件的金属附件，所述附件在保持所述包装的同时与所述安装构件接合。
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公开(公告)号：US20220107233A1
公开(公告)日：2022-04-07
申请号：US17489219
申请日：2021-09-29
发明人： Masashi Ogawa , Atsushi Imai
摘要： A pressure detector includes a first board provided with a first board electrode, a second board provided with a second board electrode, and a sensing unit provided with a first diaphragm electrode and a second diaphragm electrode. A first board body of the first board is provided with a first pressure inlet penetrating through the first board body and a first groove provided on a surface facing the first diaphragm electrode, the first groove being in communication with the first pressure inlet. A second board body of the second board is provided with a second pressure inlet penetrating through the second board body, and a second groove provided on a surface facing the second diaphragm electrode, the second groove being in communication with the second pressure inlet.
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公开(公告)号：US20170089784A1
公开(公告)日：2017-03-30
申请号：US15269169
申请日：2016-09-19
CPC分类号： G01L7/082 , G01L9/0041 , G01L19/0038 , G01L19/0627 , G01L19/143
摘要： A pressure sensor includes a pressure sensor element, a joint provided to a target member, and an attachment member that is fitted into the joint through the connection section and connected to the target member. Each of the pressure sensor element and the joint is formed of a material that is not embrittled upon being in contact with a fluid to be measured that embrittles a material, and more rigid than the attachment member. The connection section is subjected to a plastic deformation connection (metal flow). An expensive hydrogen embrittlement resistant material is used for the pressure sensor element and the joint that are brought into contact with the fluid to be measured, and an inexpensive material is used for the attachment member that is not brought into contact with the fluid to be measured, thereby reducing the production cost of the pressure sensor.
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公开(公告)号：US20150137281A1
公开(公告)日：2015-05-21
申请号：US14540632
申请日：2014-11-13
发明人： Atsushi Imai , Ryouichi Matsumura
IPC分类号： B81B7/00
CPC分类号： B81B7/0051 , B81B2201/0264 , G01L19/0084 , G01L19/143 , G01L19/147 , H01H59/0009 , H01L29/0665 , H01L29/0673 , H01L29/84 , H01L2224/48091 , H01L2924/19105 , H01L2924/00014
摘要： A physical quantity measurement sensor includes: a ceramic package including a plate provided with a flow port through which a fluid to be measured flows; an electronic component including a sensing element housed in the package to detect the pressure of the fluid to be measured having flown through the flow port; a terminal provided on an exterior of the package; a lid attached to a wall of the package; and a metal attachment piece used to attach the package to the mount member, the attachment piece being engaged with the mount member while holding the package.
摘要翻译： 物理量测量传感器包括：陶瓷封装，其包括设置有待测流体流过的流动端口的板; 电子部件，其包括容纳在所述封装中的感测元件，以检测已经流过所述流动端口的被测量流体的压力; 设置在所述包装的外部的端子; 附接到包装壁的盖子; 以及用于将所述包装件附接到所述安装构件的金属附件，所述附件在保持所述包装的同时与所述安装构件接合。
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