公开(公告)号：US09894779B2

公开(公告)日：2018-02-13

申请号：US14790669

申请日：2015-07-02

Applicant: NAN YA PCB Corporation

Inventor： Wei-Ta Fu ,  Kuo-Chang Wu ,  Yu-Chih Lin

IPC: H05K1/18 ,  H05K3/42 ,  H05K3/46 ,  H01L23/00

CPC classification number: H05K3/4602 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H05K1/115 ,  H05K1/185 ,  H05K1/188 ,  H05K3/30 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09563 ,  H05K2201/10181 ,  H05K2201/10636 ,  H05K2203/072 ,  H05K2203/1469 ,  Y02P70/611

Abstract: An embedded component substrate and methods for fabricating the same are provided. The embedded component substrate includes a substrate having at least one cavity, a first surface, and a second surface. The embedded component substrate also includes at least one electronic component formed in the at least one cavity. The embedded component substrate also includes a first wiring layer formed in the space between a sidewall of the at least one electronic component and a sidewall of the at least one cavity. The first wiring layer extends from the first surface of the substrate to the sidewall of the at least one cavity, and directly contacts the at least one electronic component.