公开(公告)号：US20180340050A1

公开(公告)日：2018-11-29

申请号：US15803871

申请日：2017-11-06

申请人： NATIONAL CHUNG HSING UNIVERSITY

发明人： Wei-Ping Dow ,  Po-Ting Chen ,  Liang-Jie Lin ,  Hung-Ming Chang ,  Ting-Yun Lin ,  Fang-Yu Lin

IPC分类号： C08J7/12 ,  C23C18/16 ,  H01B5/14

CPC分类号： C08J7/12 ,  C08J7/123 ,  C08J2323/06 ,  C08J2327/06 ,  C08J2367/02 ,  C08J2369/00 ,  C08J2379/08 ,  C23C18/1641 ,  C23C18/1689 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/38 ,  C23F1/00 ,  C23F1/02 ,  G03F7/20 ,  G03F7/30 ,  H01B3/306 ,  H01B3/423 ,  H01B3/441 ,  H01B3/443 ,  H01B5/14

摘要： The method for producing a transparent conductive substrate includes forming metal meshes on a flexible non-conductive substrate with high transmittance. It's unnecessary to use palladium as a catalyst in this method. The metal meshes are in the form of nano/micro wires and the conductive substrate has high transmittance of 80%-90% at visible light wavelengths of 390-750 nm.

公开(公告)号：US10465056B2

公开(公告)日：2019-11-05

申请号：US15803871

申请日：2017-11-06

申请人： NATIONAL CHUNG HSING UNIVERSITY

发明人： Wei-Ping Dow ,  Po-Ting Chen ,  Liang-Jie Lin ,  Hung-Ming Chang ,  Ting-Yun Lin ,  Fang-Yu Lin

IPC分类号： B23B3/00 ,  C08J7/12 ,  C23C18/16 ,  H01B5/14 ,  C23C18/20 ,  C23C18/30 ,  H01B3/30 ,  G03F7/20 ,  G03F7/30 ,  C23F1/00 ,  H01B3/44 ,  H01B3/42 ,  C23F1/02 ,  C23C18/38

摘要： The method for producing a transparent conductive substrate includes forming metal meshes on a flexible non-conductive substrate with high transmittance. It's unnecessary to use palladium as a catalyst in this method. The metal meshes are in the form of nano/micro wires and the conductive substrate has high transmittance of 80%-90% at visible light wavelengths of 390-750 nm.