公开(公告)号：US20170332488A1

公开(公告)日：2017-11-16

申请号：US15666540

申请日：2017-08-01

Applicant: NHK SPRING CO., LTD.

Inventor： Katsumi MIZUNO ,  Daiki IKEDA

IPC: H05K1/05 ,  H05K3/20 ,  H05K1/03 ,  H05K3/44

CPC classification number: H05K1/056 ,  H05K1/0256 ,  H05K1/0263 ,  H05K1/0373 ,  H05K3/103 ,  H05K3/20 ,  H05K3/202 ,  H05K3/44 ,  H05K2201/0137 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2201/1028 ,  H05K2203/0278 ,  H05K2203/1105

Abstract: According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.