公开(公告)号：US11490464B2

公开(公告)日：2022-11-01

申请号：US16598100

申请日：2019-10-10

Applicant: NHK SPRING CO., LTD.

Inventor： Toshihiko Hanamachi ,  Kenji Sekiya ,  Go Takahara ,  Naoya Aikawa ,  Yuta Kisara ,  Arata Tatsumi

IPC: H05B3/18 ,  H05B3/28 ,  H05B3/30 ,  H05B3/48 ,  H01C1/03 ,  H05B3/10 ,  H01L21/67

Abstract: A heather unit including a small diameter sheath heater with improved reliability is provided. The heater unit includes a first substrate having a first joint surface and a second substrate having a second joint surface being joined together, a groove arranged on at least one of the first joint surface or the second joint surface, and a sheath heater arranged inside the groove. The sheath heater includes a metal sheath, a heating wire having a band shape, the heating wire arranged with a space within the metal sheath so as to rotate with respect to an axis direction of the metal sheath, an insulating material arranged in the space, and connection terminals arranged at one end of the metal sheath, the connection terminals electrically connected with both ends of the heating wire respectively.

公开(公告)号：US11477858B2

公开(公告)日：2022-10-18

申请号：US16653094

申请日：2019-10-15

Applicant: NHK SPRING CO., LTD.

Inventor： Toshihiko Hanamachi ,  Kenji Sekiya ,  Daisuke Hashimoto ,  Satoshi Hirano ,  Masaru Takimoto ,  Go Takahara ,  Yoshihito Araki ,  Arata Tatsumi ,  Takashi Kawasaki ,  Yuki Toyama ,  Satoshi Anzai

IPC: H05B3/10 ,  H05B3/18 ,  H05B3/48 ,  H05B3/74 ,  H05B3/03

Abstract: A small diameter sheath heater with improved reliability is provided. The sheath heater according to one embodiment of the present invention includes a metal sheath, a heating wire having a band shape, the heating wire arranged with a gap within the metal sheath so as to rotate with respect to an axis direction of the metal sheath, an insulating material arranged in the gap, and connection terminals arranged at one end of the metal sheath, the connection terminals electrically connected with both ends of the heating wire respectively.

公开(公告)号：US20210292911A1

公开(公告)日：2021-09-23

申请号：US17259609

申请日：2019-07-17

Applicant: NHK Spring Co., Ltd. ,  IZUMI TECHNO INC.

Inventor： Toshihiko Hanamachi ,  Shuhei Morota ,  Go Takahara ,  Masaru Takimoto ,  Hibiki Yokoyama ,  Hiroshi Mitsuda ,  Yoshihito Araki ,  Kengo Ajisawa

IPC: C23C28/04

Abstract: A member for a plasma processing device includes: an aluminum base material; and an oxide film formed on the aluminum base material and having a porous structure, the oxide film including a first oxide film formed on a surface of the aluminum base material, a second oxide film formed on the first oxide film, and a third oxide film formed on the second oxide film, wherein the first oxide film is harder than the second oxide film and the third oxide film, and a hole formed in each of the first oxide film, the second oxide film and the third oxide film is sealed.

公开(公告)号：US11201040B2

公开(公告)日：2021-12-14

申请号：US16553988

申请日：2019-08-28

Applicant: NHK SPRING CO., LTD.

Inventor： Go Takahara ,  Toshihiko Hanamachi ,  Arata Tatsumi

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  C23C16/458 ,  C23C14/50 ,  C23C14/54

Abstract: A substrate supporting unit is provided. The substrate supporting unit possesses a shaft, a first heater, and a stage. The first heater is located in the shaft and is configured to heat an upper portion of the shaft. The stage is located over the shaft and includes a first plate, a second plate over the first plate, and a second heater between the first plate and the second plate.

公开(公告)号：US10276410B2

公开(公告)日：2019-04-30

申请号：US13667512

申请日：2012-11-02

Applicant: NHK SPRING CO., LTD.

Inventor： Toshihiro Tachikawa ,  Junichi Miyahara ,  Kazuhiro Yonekura ,  Toshihiko Hanamachi ,  Go Takahara ,  Jun Futakuchiya ,  Daisuke Hashimoto

IPC: H01L21/683 ,  H05B3/68 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate support device formed of a metal and having a high withstand voltage and a high thermal resistance is provided. A substrate support device according to the present invention includes a plate section formed of a metal; a shaft section connected to the plate section and formed of a metal; a heating element provided in the plate section; and an insulating film formed on a first surface of the plate section, the first surface opposite to the shaft section, by ceramic thermal spraying. The substrate support device may further include an insulating film formed on a second surface of the plate section which intersects the first surface of the plate section approximately perpendicularly.

公开(公告)号：US20130134148A1

公开(公告)日：2013-05-30

申请号：US13667512

申请日：2012-11-02

Applicant: NHK Spring Co., Ltd.

Inventor： Toshihiro TACHIKAWA ,  Junichi Miyahara ,  Kazuhiro Yonekura ,  Toshihiko Hanamachi ,  Go Takahara ,  Jun Futakuchiya ,  Daisuke Hashimoto

IPC: H01L21/683 ,  H05B3/68

CPC classification number: H01L21/67103 ,  H01L21/67109 ,  H01L21/68735 ,  H01L21/68785

Abstract: A substrate support device formed of a metal and having a high withstand voltage and a high thermal resistance is provided. A substrate support device according to the present invention includes a plate section formed of a metal; a shaft section connected to the plate section and formed of a metal; a heating element provided in the plate section; and an insulating film formed on a first surface of the plate section, the first surface opposite to the shaft section, by ceramic thermal spraying. The substrate support device may further include an insulating film formed on a second surface of the plate section which intersects the first surface of the plate section approximately perpendicularly.