公开(公告)号：US20190037692A1

公开(公告)日：2019-01-31

申请号：US16147324

申请日：2018-09-28

Applicant: NHK SPRING CO., LTD.

Inventor： Katsumi MIZUNO ,  Kazuhiko KONOMI ,  Yutaka NATSUME

IPC: H05K1/05 ,  H01L23/14 ,  H01L23/373 ,  H01L23/498 ,  H05K1/03

Abstract: A method of manufacturing a circuit board laminate including a metal substrate, an insulating layer disposed on at least one surface of the metal substrate, and a metal foil disposed on the insulating later, the method including: forming, on at least one of the metal substrate and the metal foil, a film that includes a composition containing a bisphenol cyanate resin, a novolac cyanate resin and an inorganic filler; obtaining a laminate by joining the metal substrate and the metal foil to face each other with the film interposed therebetween; and heating the laminate at a temperature higher than 200° C. to form a crosslinked copolymer consisting of the bisphenol cyanate resin and the novolac cyanate resin in the film, and to obtain the insulating layer comprising the crosslinked copolymer.

公开(公告)号：US20150118509A1

公开(公告)日：2015-04-30

申请号：US14589531

申请日：2015-01-05

Applicant: NHK SPRING CO., LTD.

Inventor： Katsumi MIZUNO ,  Kazuhiko KONOMI ,  Yutaka NATSUME

IPC: H05K1/05 ,  H05K1/03

CPC classification number: H05K1/056 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49894 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0373 ,  H05K2201/0209 ,  Y10T428/31678 ,  H01L2924/00

Abstract: Disclosed is a circuit board laminate including a metal substrate, an insulating layer disposed on at least one surface of the metal substrate and a metal foil disposed on the insulating layer. Characteristically, the insulating layer contains a crosslinked copolymer of bisphenol cyanate resin and novolac cyanate resin and an inorganic filler.

Abstract translation: 公开了一种电路板层叠体，其包括金属基板，设置在金属基板的至少一个表面上的绝缘层和设置在绝缘层上的金属箔。 特征在于，绝缘层含有双酚氰酸酯树脂和酚醛清漆氰酸酯树脂的交联共聚物和无机填料。