公开(公告)号：US20200243710A1

公开(公告)日：2020-07-30

申请号：US16774565

申请日：2020-01-28

Applicant: NICHIA CORPORATION

Inventor： Hiroyuki TANAKA ,  Yasuo KATO ,  Kazuya MATSUDA

IPC: H01L33/00 ,  H01L25/075

Abstract: A method of manufacturing light emitting devices, the method including: providing a first structure, the providing a first structure including: providing a lead frame, the providing a lead frame including: providing a metal plate having a plurality of pairs of first and second metal parts, each of the first and second metal parts including at least one first region and at least one second region; using an electrodeposition technique, disposing a mask of a resist film on the at least one first region; disposing a first plating containing silver or silver alloy on the at least one second region; and removing the resist film; molding a resin molded body in one piece with the lead frame with parts of a lower surface of the lead frame being exposed, in which, the first structure includes an upper surface defining a plurality of recesses each having an upward-facing surface, at least parts of the first plating being located at the upward-facing surface of each of the plurality of recesses; providing a second structure, the providing a second structure including: disposing at least one light-emitting element on the first plating located at the upward-facing surface of each of the plurality of recesses; and disposing a sealing member covering the at least one light-emitting element in each of the plurality of recesses; and separating the second structure into a plurality of individual light emitting devices.

公开(公告)号：US20200212274A1

公开(公告)日：2020-07-02

申请号：US16720681

申请日：2019-12-19

Applicant: NICHIA CORPORATION

Inventor： Kazuya MATSUDA ,  Yasuo KATO ,  Hiroyuki TANAKA

IPC: H01L33/56 ,  H01L33/62 ,  H01L33/46 ,  H01L33/48

Abstract: A resin package defining a recess includes a first lead having an element-mounting region, a second lead having a wire-connecting region, and a resin body including first to third resin portions. The third resin portion surrounds the element-mounting region. Each of the first and second leads includes a first plating and a second plating covering at least a portion of the first plating. The wire-connecting region is located outward of the third resin portion. The element-mounting region is located on an outermost surface of the second plating. In a top view, the wire-connecting region is located laterally inward of a portion of the second plating of the second lead that has an outermost surface located higher than that of the first plating of the second lead.

公开(公告)号：US20200176649A1

公开(公告)日：2020-06-04

申请号：US16698324

申请日：2019-11-27

Applicant: NICHIA CORPORATION

Inventor： Hiroyuki TANAKA ,  Yasuo KATO ,  Kazuya MATSUDA

IPC: H01L33/56 ,  H01L33/62 ,  H01L33/54

Abstract: A method of manufacturing a light emitting device, including: providing a first structure including: providing a lead frame which includes providing a metal plate including a plurality of pairs of first and second metal parts, each metal part including an upper surface, a lower surface, and an end surface, the end surface of the first metal part and the end surface of the second metal part of each pair are opposite to each other, and a first region including the end surface, and disposing a mask of a resist film on the first region using an electrodeposition technique, disposing a first plated layer containing gold or gold alloy on a second region including the upper surface other than the first region on at least one of the upper surface, the lower surface, and the end surface of each of the first and second metal parts using a plating technique, and removing the resist film, providing a resin molded body molded integrally with the lead frame with parts of a lower surface of the lead frame being exposed, in which the first structure includes an upper surface defining a plurality of recesses each having an upward-facing surface, the first plated layer on the upper surface of the metal part is located at the upward-facing surface of each of the plurality of recesses; providing a second structure, the providing a second structure including; disposing at least one light-emitting element on the upward-facing surface each of the plurality of recesses, disposing a sealing member covering the at least one light-emitting element in each of the plurality of recesses; and separating the second structure into a plurality of discrete light emitting devices.

公开(公告)号：US20140312364A1

公开(公告)日：2014-10-23

申请号：US14255315

申请日：2014-04-17

Applicant: NICHIA CORPORATION

Inventor： Takayoshi WAKAKI ,  Hiroyuki TANAKA

IPC: H01L33/40 ,  H01L33/62

CPC classification number: H01L33/405 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/8592 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A package for a light emitting device includes: a resin portion having a sidewall thereof; a first lead having a reflective layer containing silver, the first lead being embedded in the resin portion such that the reflective layer is exposed inside the sidewall; and a second lead having at least a part of a surface thereof exposed inside the sidewall, the second lead being embedded in the resin portion while being isolated from the first lead, wherein in the first lead, the reflective layer is provided spaced inward apart from a boundary between the first lead and the resin portion, and wherein a separating surface exposed between the boundary and the reflective layer is formed of a surface of metal containing silver in a smaller amount than that of the reflective layer.

Abstract translation: 一种用于发光器件的封装包括：具有侧壁的树脂部分; 具有包含银的反射层的第一引线，所述第一引线嵌入在所述树脂部分中，使得所述反射层暴露在所述侧壁内; 以及第二引线，其表面的至少一部分暴露在所述侧壁内部，所述第二引线被嵌入在所述树脂部分中，同时与所述第一引线隔离，其中在所述第一引线中，所述反射层设置成与 第一引线和树脂部分之间的边界，并且其中暴露在边界和反射层之间的分离表面由比含有反射层的银的金属的表面形成。