公开(公告)号：US20180006205A1

公开(公告)日：2018-01-04

申请号：US15692542

申请日：2017-08-31

Applicant: NICHIA CORPORATION

Inventor： Masato FUJITOMO ,  Hiroto TAMAKI ,  Shinji NISHIJIMA ,  Yuichiro TANDA ,  Tomohide MIKI

IPC: H01L33/62 ,  H01L31/02 ,  H01L33/48 ,  H01L33/52 ,  H01L23/00 ,  H01L31/0203 ,  H01L25/16

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US20190123253A1

公开(公告)日：2019-04-25

申请号：US16222581

申请日：2018-12-17

Applicant: NICHIA CORPORATION

Inventor： Masato FUJITOMO ,  Hiroto TAMAKI ,  Shinji NISHIJIMA ,  Yuichiro TANDA ,  Tomohide MIKI

IPC: H01L33/62 ,  H01L33/52 ,  H01L33/48 ,  H01L31/0203 ,  H01L23/00 ,  H01L31/02

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US20220158061A1

公开(公告)日：2022-05-19

申请号：US17588882

申请日：2022-01-31

Applicant: NICHIA CORPORATION

Inventor： Masato FUJITOMO ,  Hiroto TAMAKI ,  Shinji NISHIJIMA ,  Yuichiro TANDA ,  Tomohide MIKI

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/48 ,  H01L31/0203 ,  H01L31/02 ,  H01L33/52

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US20150129923A1

公开(公告)日：2015-05-14

申请号：US14603148

申请日：2015-01-22

Applicant: NICHIA CORPORATION

Inventor： Masato FUJITOMO ,  Hiroto TAMAKI ,  Shinji NISHIJIMA ,  Yuichiro TANDA ,  Tomohide MIKI

IPC: H01L33/62 ,  H01L31/0203 ,  H01L33/52 ,  H01L31/02

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Abstract translation: 一种制造光半导体器件的方法，包括在支撑衬底上形成彼此分开设置的多个第一和第二导电构件; 提供由第一和第二导电构件之间的光阻树脂形成的基底构件; 将光学半导体元件安装在第一和/或第二导电构件上; 通过由半透明树脂形成的密封构件覆盖光学半导体元件; 并且在去除支撑衬底之后获得单独的光学半导体器件。

公开(公告)号：US20140191278A1

公开(公告)日：2014-07-10

申请号：US14152712

申请日：2014-01-10

Applicant: NICHIA CORPORATION

Inventor： Shinji NISHIJIMA ,  Tomohide MIKI ,  Hiroto TAMAKI

IPC: H01L33/52 ,  H05K5/00

CPC classification number: H05K5/0091 ,  H01L33/486 ,  H01L33/52 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.

Abstract translation: 一种发光器件包括形成由底表面和侧壁限定的凹部的基体，其上表面露出在凹部中并且其下表面形成外表面的导电构件，设置在凹部中的突出部分， 安装在所述凹部中并电连接到所述导电构件的发光元件，以及设置在所述凹部中以覆盖所述发光元件的密封构件。 基体具有由树脂一体形成的底部部分和侧壁部分，侧壁部分的内表面是限定凹部的侧壁，并且具有弯曲部分，并且突出部分靠近 曲面。 通过这种布置，可以获得光提取效率和可靠性优异的薄型和小型发光装置。

公开(公告)号：US20140042488A1

公开(公告)日：2014-02-13

申请号：US14059243

申请日：2013-10-21

Applicant: NICHIA CORPORATION

Inventor： Masato FUJITOMO ,  Hiroto TAMAKI ,  Shinji NISHIJIMA ,  Yuichiro TANDA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L31/0203

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Abstract translation: 一种制造光半导体器件的方法，包括在支撑衬底上形成彼此分开设置的多个第一和第二导电构件; 提供由第一和第二导电构件之间的光阻树脂形成的基底构件; 将光学半导体元件安装在第一和/或第二导电构件上; 通过由半透明树脂形成的密封构件覆盖光学半导体元件; 并且在去除支撑衬底之后获得单独的光学半导体器件。