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公开(公告)号：US20220158061A1
公开(公告)日：2022-05-19
申请号：US17588882
申请日：2022-01-31
Applicant: NICHIA CORPORATION
Inventor： Masato FUJITOMO , Hiroto TAMAKI , Shinji NISHIJIMA , Yuichiro TANDA , Tomohide MIKI
Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
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公开(公告)号：US20220349531A1
公开(公告)日：2022-11-03
申请号：US17868677
申请日：2022-07-19
Applicant: NICHIA CORPORATION
Inventor： Yuichiro TANDA , Toshio MATSUSHITA
IPC: F21K9/232 , H01L33/62 , F21V9/32 , F21V9/38 , F21V13/14 , F21V9/30 , H05B33/04 , F21V29/70 , F21K9/235 , F21V3/02 , F21V19/00 , F21V31/00 , H01L25/075 , H01L33/50
Abstract: A light emitting device including a bulb having a side surface, a board elongated longer in a first direction than in a second direction perpendicular to the first direction, and a plurality of light emitting elements mounted on the board. Each of the plurality of light emitting elements has an upper surface and a lower surface opposite to the upper surface, where the lower surface is mounted on the board. The device includes a plurality of sets of metal plates and leads electrically connected to the plurality of light emitting elements, and a wavelength conversion member covering the light emitting elements and a portion of each of the metal plates. The board, the light emitting elements, the sets of metal plates and leads, and the wavelength conversion member are disposed in the bulb. The upper surface of each of the light emitting elements faces the side surface of the bulb.
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公开(公告)号：US20150129923A1
公开(公告)日：2015-05-14
申请号：US14603148
申请日：2015-01-22
Applicant: NICHIA CORPORATION
Inventor： Masato FUJITOMO , Hiroto TAMAKI , Shinji NISHIJIMA , Yuichiro TANDA , Tomohide MIKI
IPC: H01L33/62 , H01L31/0203 , H01L33/52 , H01L31/02
CPC classification number: H01L33/62 , H01L24/97 , H01L25/167 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01012 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2224/85 , H01L2924/00012
Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
Abstract translation: 一种制造光半导体器件的方法，包括在支撑衬底上形成彼此分开设置的多个第一和第二导电构件; 提供由第一和第二导电构件之间的光阻树脂形成的基底构件; 将光学半导体元件安装在第一和/或第二导电构件上; 通过由半透明树脂形成的密封构件覆盖光学半导体元件; 并且在去除支撑衬底之后获得单独的光学半导体器件。
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公开(公告)号：US20190123253A1
公开(公告)日：2019-04-25
申请号：US16222581
申请日：2018-12-17
Applicant: NICHIA CORPORATION
Inventor： Masato FUJITOMO , Hiroto TAMAKI , Shinji NISHIJIMA , Yuichiro TANDA , Tomohide MIKI
Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
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公开(公告)号：US20130200778A1
公开(公告)日：2013-08-08
申请号：US13831797
申请日：2013-03-15
Applicant: NICHIA CORPORATION
Inventor： Yuichiro TANDA , Toshio MATSUSHITA
IPC: H05B33/04
CPC classification number: F21K9/232 , F21K9/235 , F21V3/02 , F21V9/30 , F21V19/006 , F21V29/70 , F21V31/005 , F21Y2101/00 , F21Y2115/10 , F21Y2115/30 , H01L25/0753 , H01L33/501 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/54 , H01L33/62 , H01L2224/32225 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2924/01004 , H01L2924/0102 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H05B33/04 , H01L2924/00 , H01L2924/00012
Abstract: A light emitting device includes a board, a light emitting element, and a transparent member. The light emitting element is mounted on the board. The transparent member seals the light emitting element. The transparent member is disposed around a periphery of the board and the light emitting element. The transparent member comprises a phosphor therein.
Abstract translation: 发光器件包括板，发光元件和透明构件。 发光元件安装在板上。 透明构件密封发光元件。 透明构件设置在基板和发光元件的周围。 透明构件包括其中的荧光体。
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Patent Agency Ranking
公开(公告)号：US20130064260A1
公开(公告)日：2013-03-14
申请号：US13672713
申请日：2012-11-09
Applicant: NICHIA CORPORATION
Inventor： Yuichiro TANDA , Toshio MATSUSHITA
CPC classification number: F21K9/232 , F21K9/235 , F21V3/02 , F21V9/30 , F21V19/006 , F21V29/70 , F21V31/005 , F21Y2101/00 , F21Y2115/10 , F21Y2115/30 , H01L25/0753 , H01L33/501 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/54 , H01L33/62 , H01L2224/32225 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2924/01004 , H01L2924/0102 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H05B33/04 , H01L2924/00 , H01L2924/00012
Abstract: Broad light emission is provided and additionally heat conductivity is increased to improve reliability. A light emitting device comprises a light emitting element, a pair of conductor members, a transparent board and a transparent member. The conductor members are spaced away from each other at an interval in a side-surface direction of the light emitting element and are electrically connected to the light emitting element. The transparent board supports the light emitting element and the pair of conductive members. The transparent member is located on the transparent board and seals the light emitting element and the pair of conductor members. The pair of conductor members are provided with a pair of metal plates that are secured thereon. The pair of metal plates project from the transparent member in directions different from each other.
Abstract translation: 提供广泛的发光，并且增加热导率以提高可靠性。 发光装置包括发光元件，一对导体构件，透明板和透明构件。 导体构件在发光元件的侧面方向上以间隔彼此间隔开并且电连接到发光元件。 透明板支撑发光元件和一对导电构件。 透明构件位于透明板上并密封发光元件和一对导体构件。 一对导体构件设置有固定在其上的一对金属板。 一对金属板从透明构件以彼此不同的方向突出。
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公开(公告)号：US20200141542A1
公开(公告)日：2020-05-07
申请号：US16727924
申请日：2019-12-27
Applicant: NICHIA CORPORATION
Inventor： Yuichiro TANDA , Toshio MATSUSHITA
IPC: F21K9/232 , H01L33/50 , H01L25/075 , F21V31/00 , F21V19/00 , F21V3/02 , F21K9/235 , F21V29/70 , H05B33/04 , F21V9/30 , H01L33/62
Abstract: A light emitting device includes a plurality of leads and a board having a first surface on a first surface side thereof and a second surface on a second surface side thereof, the second surface being an opposite side to the first surface. Light emitting elements are mounted on a first surface of a board. A wavelength conversion member is formed unitarily with a transparent member and covers the light emitting elements. The wavelength conversion member has a first end and a second end. The wavelength conversion member is disposed at a first surface side and a second surface side and is elongated in a longitudinal direction when viewed in a plan view of the first surface side of the board. A first metal plate protrudes at the first end of the wavelength conversion member. A second metal plate protrudes at the second end of the wavelength conversion member.
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公开(公告)号：US20140042488A1
公开(公告)日：2014-02-13
申请号：US14059243
申请日：2013-10-21
Applicant: NICHIA CORPORATION
Inventor： Masato FUJITOMO , Hiroto TAMAKI , Shinji NISHIJIMA , Yuichiro TANDA , Tomohide MIKI
IPC: H01L33/48 , H01L31/0203
CPC classification number: H01L33/62 , H01L24/97 , H01L25/167 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01012 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2224/85 , H01L2924/00012
Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
Abstract translation: 一种制造光半导体器件的方法，包括在支撑衬底上形成彼此分开设置的多个第一和第二导电构件; 提供由第一和第二导电构件之间的光阻树脂形成的基底构件; 将光学半导体元件安装在第一和/或第二导电构件上; 通过由半透明树脂形成的密封构件覆盖光学半导体元件; 并且在去除支撑衬底之后获得单独的光学半导体器件。
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公开(公告)号：US20190113182A1
公开(公告)日：2019-04-18
申请号：US16211140
申请日：2018-12-05
Applicant: NICHIA CORPORATION
Inventor： Yuichiro TANDA , Toshio MATSUSHITA
IPC: F21K9/232 , F21V3/02 , F21V9/30 , F21V19/00 , F21V29/70 , F21K9/235 , H05B33/04 , H01L25/075 , H01L33/50 , H01L33/62 , F21V31/00
Abstract: A light emitting device includes light emitting elements mounted on a first surface of a board, and a common-lead region disposed on the first surface of the board between the first light emitting element and the second light emitting element. A wavelength conversion member covers the light emitting elements and the common-lead region. The wavelength conversion member has a first end and a second end. A first metal plate protrudes at the first end of the wavelength conversion member. A second metal plate protrudes at the second end of the wavelength conversion member. The first light emitting element is connected to the common-lead region via the first wire and is electrically connected to the first metal plate via the second wire. The second light emitting element is connected to the common-lead region via the third wire and is electrically connected to the second metal plate via the fourth wire.
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公开(公告)号：US20180006205A1
公开(公告)日：2018-01-04
申请号：US15692542
申请日：2017-08-31
Applicant: NICHIA CORPORATION
Inventor： Masato FUJITOMO , Hiroto TAMAKI , Shinji NISHIJIMA , Yuichiro TANDA , Tomohide MIKI
CPC classification number: H01L33/62 , H01L24/97 , H01L25/167 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01012 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2224/85 , H01L2924/00012
Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
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