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    LIGHT EMITTING DEVICE
    2.
    发明申请
    LIGHT EMITTING DEVICE 有权

    公开(公告)号：US20210280754A1

    公开(公告)日：2021-09-09

    申请号：US17314045

    申请日：2021-05-07

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Yuichi YAMADA

    IPC: H01L33/54

    Abstract: A light emitting device includes at least one light emitting element and at least one light transmissive sealing member. Each of the at least one light emitting element has a bottom surface electrically connected to a conductor wiring and a top surface opposite to the bottom surface in a height direction along a height of the light emitting device. The at least one light transmissive sealing member covers the at least one light emitting element, respectively. Each of the at least one light transmissive sealing member has a projection shape with a height in the height direction and a width in a width direction perpendicular to the height direction. The height is greater than the width. Each of the at least one light transmissive sealing member includes a wavelength conversion member.

    LIGHT-EMITTING DEVICE AND INTEGRATED LIGHT-EMITTING DEVICE
    3.
    发明申请
    LIGHT-EMITTING DEVICE AND INTEGRATED LIGHT-EMITTING DEVICE 审中-公开

    公开(公告)号：US20200318808A1

    公开(公告)日：2020-10-08

    申请号：US16784616

    申请日：2020-02-07

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Yuichi YAMADA

    IPC: F21V7/00 ,  H01L33/62 ,  H01L33/54 ,  H01L33/50

    Abstract: A light-emitting device includes: a base member that comprises conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5.

    LIGHT EMITTING DEVICE
    4.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开

    公开(公告)号：US20200313043A1

    公开(公告)日：2020-10-01

    申请号：US16897435

    申请日：2020-06-10

    Applicant: NICHIA CORPORATION

    Inventor： Yuichi YAMADA ,  Motokazu YAMADA

    IPC: H01L33/44 ,  H01L33/46 ,  H01L33/38 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62

    Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate, the light emitting element having an upper surface and a lateral surface; a reflecting layer located on the upper surface of the light emitting element; a first light-transmissive member having a first surface in contact with the lateral surface of the light emitting element, and a second surface that is inclined toward the substrate in a direction outward from the light emitting element; and a second light-transmissive member in contact with the second surface and covering the light emitting element. A refractive index of the first light-transmissive is smaller than a refractive index of the second light-transmissive member.

    LIGHT EMITTING DEVICE
    5.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开
    发光装置

    公开(公告)号：US20160190405A1

    公开(公告)日：2016-06-30

    申请号：US14968897

    申请日：2015-12-15

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Yuichi YAMADA

    IPC: H01L33/54 ,  H01L33/50 ,  H01L25/075 ,  H01L33/62 ,  H01L33/58

    CPC classification number: H01L33/54 ,  H01L33/508 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: A light emitting device includes a base, at least one light emitting element, and a light transmissive sealing member. The base has a conductor wiring. The at least one light emitting element is mounted on the base. The at least one light emitting element is electrically connected to the conductor wiring. The light transmissive sealing member includes a light diffusion material. The light transmissive sealing member covers the at least one light emitting element. The light transmissive sealing member has a projection shape. The projection shape has a substantially circular bottom surface facing the base and a height in a light axis direction of the at least one light emitting element. The height is greater than a diameter of the substantially circular bottom surface.

    Abstract translation: 发光器件包括基底，至少一个发光元件和透光密封元件。 底座有导线。 至少一个发光元件安装在基座上。 所述至少一个发光元件电连接到所述导体布线。 透光密封构件包括光漫射材料。 透光密封构件覆盖至少一个发光元件。 透光密封构件具有突出形状。 突起形状具有面向基部的大致圆形的底面和至少一个发光元件的光轴方向的高度。 高度大于基本圆形的底面的直径。

    LIGHT EMITTING DEVICE
    8.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开
    发光装置

    公开(公告)号：US20160343918A1

    公开(公告)日：2016-11-24

    申请号：US15160444

    申请日：2016-05-20

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Tomonori OZAKI ,  Shinsaku IKUTA ,  Yuichi YAMADA

    IPC: H01L33/54 ,  H01L33/56 ,  H01L33/50 ,  H01L33/58

    Abstract: A light emitting device includes a light emitting element; a sealing resin covering the light emitting element; and a light diffusing material contained in the sealing resin. When a difference in refractive index at 10° C. between the sealing resin and the light diffusing material is Δn1 and a difference in refractive index at 50° C. between the sealing resin and the light diffusing material is Δn2, a ratio of Δn2 to Δn1 is in a range of 95% to 105%.

    Abstract translation: 发光器件包括发光元件; 覆盖发光元件的密封树脂; 以及包含在密封树脂中的光漫射材料。 当密封树脂和光扩散材料之间在10℃的折射率差为Δn1时，密封树脂和光漫射材料之间的折射率差在50℃是Δn2，Δn2与 Δn1在95％至105％的范围内。

    LED PACKAGE AND INTEGRATED LIGHT EMITTING DEVICE
    9.
    发明申请
    LED PACKAGE AND INTEGRATED LIGHT EMITTING DEVICE 有权

    公开(公告)号：US20250056942A1

    公开(公告)日：2025-02-13

    申请号：US18932321

    申请日：2024-10-30

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Yuichi YAMADA ,  Shinsaku IKUTA ,  Takeshi TAMURA

    IPC: H01L33/60 ,  F21V3/06 ,  F21Y105/16 ,  F21Y115/10 ,  H01L33/54

    Abstract: An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.

    LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING LIGHT EMITTING DEVICE, PLANAR LIGHT SOURCE, AND LIQUID CRYSTAL DISPLAY DEVICE
    10.
    发明申请
    LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING LIGHT EMITTING DEVICE, PLANAR LIGHT SOURCE, AND LIQUID CRYSTAL DISPLAY DEVICE 有权

    公开(公告)号：US20220069177A1

    公开(公告)日：2022-03-03

    申请号：US17459132

    申请日：2021-08-27

    Applicant: NICHIA CORPORATION

    Inventor： Yuichi YAMADA ,  Takeshi TAMURA

    IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60 ,  G02F1/13357

    Abstract: A method of manufacturing a light emitting device includes: providing a first member comprising: a base, a plurality of phosphor frames positioned on the base, the plurality of phosphor frames including a first phosphor frame and a second phosphor frame that is adjacent to the first phosphor frame, and a light transmissive member, a portion of which is disposed between the first phosphor frame and the second phosphor frame; disposing a first light emitting element in the first phosphor frame and a second light emitting element in the second phosphor frame, wherein: each light emitting element has an emission face and an electrode forming face located opposite to the emission face, each light emitting element comprises an electrode located on its electrode forming face, and each light emitting element is disposed such that its emission face faces the base; and cutting the light transmissive member.

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