公开(公告)号：US20250100081A1

公开(公告)日：2025-03-27

申请号：US18898606

申请日：2024-09-26

Applicant: NICHIA CORPORATION

Inventor： Norifumi SASAOKA ,  Takashi KAWAMATA

IPC: B23K26/384 ,  B23K26/0622 ,  B23K101/40 ,  H01L21/48

Abstract: A method of producing a substrate includes: providing a ceramic substrate having a first surface and a second surface that is located opposite the first surface; irradiating a first part of the first surface with a first laser light having a first pulse width to perform ablation of the first part of the ceramic substrate; and irradiating a second part of either the first surface or the second surface with a second laser light having a second pulse width, which is longer than the first pulse width, the second part being located apart from the first part in a plan view to perform thermal processing of a third part including the first part and the second part. Upon removal of the third part and a part enclosed by the third part, an aperture that extends from the first surface to the second surface is formed in the ceramic substrate.

公开(公告)号：US20250096054A1

公开(公告)日：2025-03-20

申请号：US18830590

申请日：2024-09-11

Applicant: NICHIA CORPORATION

Inventor： Eiko MINATO ,  Atsushi HOSOKAWA ,  Akiko NAGAE ,  Takashi KAWAMATA

IPC: H01L23/15 ,  C04B41/00 ,  C04B41/45 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/90 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

Abstract: A wiring substrate includes a ceramic substrate having an upper surface, a lower surface, and a lateral surface. The lower surface includes a first lower surface and a second lower surface inward from the first lower surface. The lateral surface includes a first lateral surface and a second lateral surface inward from the first lateral surface. The wiring substrate includes a first wiring having a thickness of 80% or more of a height from the second lower surface to the first lower surface and disposed in contact with the second lower surface and the second lateral surface. A lateral surface of the first wiring is exposed from the first lateral surface. A main surface of 50% or more of a surface area of a lower surface of the first wiring is substantially parallel to the second lower surface and is disposed inward from the first lower surface.

公开(公告)号：US20240355987A1

公开(公告)日：2024-10-24

申请号：US18637994

申请日：2024-04-17

Applicant: NICHIA CORPORATION

Inventor： Masaaki KATSUMATA ,  Eiko MINATO ,  Takashi KAWAMATA ,  Atsushi HOSOKAWA

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/20

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/20 ,  H01L2933/0066

Abstract: A wiring substrate includes a base body, a metal member, and an insulating member. The base body is insulating and has a first surface and a second surface on an opposite side to the first surface. The base body includes a groove portion provided on a second surface side, and a through hole connecting the first surface and a bottom surface of the groove portion. The metal member is disposed in the groove portion on the bottom surface side of the groove portion and in the through hole away from an opening of the groove portion. The insulating member is disposed so as to close the opening of the groove portion.

公开(公告)号：US20240092701A1

公开(公告)日：2024-03-21

申请号：US18468650

申请日：2023-09-15

Applicant: NICHIA CORPORATION

Inventor： Masaaki KATSUMATA ,  Eiko MINATO ,  Takashi KAWAMATA ,  Akiko NAGAE

IPC: C04B41/51 ,  C04B37/00 ,  C04B41/00 ,  C04B41/45 ,  C04B41/53 ,  H01L33/62

CPC classification number: C04B41/5183 ,  C04B37/006 ,  C04B41/0072 ,  C04B41/4521 ,  C04B41/5307 ,  H01L33/62 ,  C04B2237/12 ,  H01L2933/0066

Abstract: A method for manufacturing a ceramic sintered body substrate includes of disposing a first metal paste on a surface of a ceramic substrate, and of firing the ceramic substrate on which the first metal paste is disposed. In the disposing the first metal paste, the first metal paste contains a plurality of first metal powders, a plurality of active metal powders, and a plurality of inorganic fillers excluding metals, and in the firing the ceramic substrate, a firing temperature is equal to or higher than a melting point of the first metal powders.