公开(公告)号：US20240213429A1

公开(公告)日：2024-06-27

申请号：US18391651

申请日：2023-12-21

Applicant: NICHIA CORPORATION

Inventor： Akiko NAGAE ,  Masaaki KATSUMATA

IPC: H01L33/62 ,  H01L23/00 ,  H05K3/00 ,  H05K3/24 ,  H05K3/40

CPC classification number: H01L33/62 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/0029 ,  H05K3/4061 ,  H01L24/05 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05673 ,  H01L2224/0568 ,  H01L2224/05684 ,  H01L2224/13144 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2933/0066 ,  H05K3/0052 ,  H05K3/243 ,  H05K2203/072 ,  H05K2203/107

Abstract: A manufacturing method for a ceramic sintered compact substrate including preparing a ceramic substrate, bonding dry films to a first surface and a second surface of the ceramic substrate, performing exposure and development, performing etching or blasting through the dry films formed into a predetermined pattern, forming a first recessed portion recessed relative to a first flat surface portion of the first surface and a second recessed portion recessed relative to a second flat surface portion of the second surface, peeling off the dry films, disposing a metal paste, and firing the metal paste to obtain a metal member. In the method, before the first recessed portion and the second recessed portion are formed, a through hole penetrating through the ceramic substrate is formed , and the metal paste is disposed in the first recessed portion, the second recessed portion, and the through hole.

公开(公告)号：US20240092701A1

公开(公告)日：2024-03-21

申请号：US18468650

申请日：2023-09-15

Applicant: NICHIA CORPORATION

Inventor： Masaaki KATSUMATA ,  Eiko MINATO ,  Takashi KAWAMATA ,  Akiko NAGAE

IPC: C04B41/51 ,  C04B37/00 ,  C04B41/00 ,  C04B41/45 ,  C04B41/53 ,  H01L33/62

CPC classification number: C04B41/5183 ,  C04B37/006 ,  C04B41/0072 ,  C04B41/4521 ,  C04B41/5307 ,  H01L33/62 ,  C04B2237/12 ,  H01L2933/0066

Abstract: A method for manufacturing a ceramic sintered body substrate includes of disposing a first metal paste on a surface of a ceramic substrate, and of firing the ceramic substrate on which the first metal paste is disposed. In the disposing the first metal paste, the first metal paste contains a plurality of first metal powders, a plurality of active metal powders, and a plurality of inorganic fillers excluding metals, and in the firing the ceramic substrate, a firing temperature is equal to or higher than a melting point of the first metal powders.

公开(公告)号：US20250096054A1

公开(公告)日：2025-03-20

申请号：US18830590

申请日：2024-09-11

Applicant: NICHIA CORPORATION

Inventor： Eiko MINATO ,  Atsushi HOSOKAWA ,  Akiko NAGAE ,  Takashi KAWAMATA

IPC: H01L23/15 ,  C04B41/00 ,  C04B41/45 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/90 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

Abstract: A wiring substrate includes a ceramic substrate having an upper surface, a lower surface, and a lateral surface. The lower surface includes a first lower surface and a second lower surface inward from the first lower surface. The lateral surface includes a first lateral surface and a second lateral surface inward from the first lateral surface. The wiring substrate includes a first wiring having a thickness of 80% or more of a height from the second lower surface to the first lower surface and disposed in contact with the second lower surface and the second lateral surface. A lateral surface of the first wiring is exposed from the first lateral surface. A main surface of 50% or more of a surface area of a lower surface of the first wiring is substantially parallel to the second lower surface and is disposed inward from the first lower surface.

公开(公告)号：US20250079245A1

公开(公告)日：2025-03-06

申请号：US18797441

申请日：2024-08-07

Applicant: NICHIA CORPORATION

Inventor： Norifumi SASAOKA ,  Shoichi YAMADA ,  Akiko NAGAE

IPC: H01L23/15 ,  H01L21/02 ,  H01L33/62

Abstract: A ceramic substrate including a base having a first surface, a second surface opposite to the first surface, and a through hole having a first opening diameter at the first surface and a second opening diameter at the second surface. The first opening diameter is larger than the second opening diameter. The ceramic substrate also includes at least one solid particle disposed in the through hole, and an electrically-conductive member disposed in the through hole. A thermal conductivity of the at least one solid particle is higher than a thermal conductivity of the electrically-conductive member. The electrically-conductive member is continuous between the first surface and the second surface.