公开(公告)号：US09685759B2

公开(公告)日：2017-06-20

申请号：US15248318

申请日：2016-08-26

Applicant: NICHIA CORPORATION

Inventor： Naoto Morizumi ,  Takashi Namie ,  Takashi Nakagawa ,  Daisuke Komoda ,  Hiroaki Shozui

IPC: H01S5/02 ,  H01S5/022 ,  H01S5/30 ,  H01S5/00 ,  H01S5/024 ,  F21S8/10

CPC classification number: H01S5/02208 ,  F21S41/14 ,  F21S41/16 ,  F21S41/192 ,  F21S43/13 ,  F21S43/195 ,  H01S5/005 ,  H01S5/02212 ,  H01S5/02272 ,  H01S5/02288 ,  H01S5/02296 ,  H01S5/02469 ,  H01S5/3013

Abstract: A semiconductor laser device includes a base, a semiconductor laser element, a lid, a support member, a wavelength converting member, a holding member, and a buffer material. The lid has a recess formed in an upper portion of the lid, and a through-hole formed in the bottom of the recess. The support member is disposed in the recess and has a through-hole. A diameter of the through-hole of the support member is smaller than that of the through-hole of the lid. A coefficient of thermal expansion of the support member is different from that of the lid. The wavelength converting member is supported in the through-hole of the support member. The holding member is fixed to the lid and holds the support member. The buffer material is disposed in at least a part of a space between the lateral surfaces of the recess and the support member.