公开(公告)号：US20140287557A1

公开(公告)日：2014-09-25

申请号：US14295699

申请日：2014-06-04

Applicant: NICHIA CORPORATION

Inventor： Takuya NOICHI ,  Yuichi OKADA

IPC: H01L21/48

CPC classification number: H01L21/4853 ,  H01L23/49582 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/83 ,  H01L33/54 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/83 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/014 ,  H01L2924/00

Abstract: In a semiconductor device including a semiconductor element and a wiring substrate on which the semiconductor element is mounted. The wiring substrate includes an insulating substrate and conductive wiring formed in the insulating substrate and electrically connected to the semiconductor element. The conductive wiring includes an underlying layer formed on the insulating substrate, a main conductive layer formed on the underlying layer, and an electrode layer covering side surfaces of the underlying layer and side surfaces and an upper surface of the main conductive layer. The underlying layer includes an adhesion layer being formed in contact with the insulating substrate and containing an alloy of Ti.

Abstract translation: 在包括半导体元件和其上安装有半导体元件的布线基板的半导体器件中。 布线基板包括绝缘基板和形成在绝缘基板中并与半导体元件电连接的导电布线。 导电布线包括形成在绝缘基板上的下层，形成在下层上的主导电层和覆盖下层和侧表面的侧表面的电极层和主导电层的上表面。 下层包括形成为与绝缘基板接触并且含有Ti合金的粘附层。

公开(公告)号：US20130313695A1

公开(公告)日：2013-11-28

申请号：US13900730

申请日：2013-05-23

Applicant: NICHIA CORPORATION

Inventor： Takuya NOICHI ,  Yuichi OKADA

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L21/4853 ,  H01L23/49582 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/83 ,  H01L33/54 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/83 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/014 ,  H01L2924/00

Abstract: In a semiconductor device including a semiconductor element and a wiring substrate on which the semiconductor element is mounted. The wiring substrate includes an insulating substrate and conductive wiring formed in the insulating substrate and electrically connected to the semiconductor element. The conductive wiring includes an underlying layer formed on the insulating substrate, a main conductive layer formed on the underlying layer, and an electrode layer covering side surfaces of the underlying layer and side surfaces and an upper surface of the main conductive layer. The underlying layer includes an adhesion layer being formed in contact with the insulating substrate and containing an alloy of Ti.

Abstract translation: 在包括半导体元件和其上安装有半导体元件的布线基板的半导体器件中。 布线基板包括绝缘基板和形成在绝缘基板中并与半导体元件电连接的导电布线。 导电布线包括形成在绝缘基板上的下层，形成在下层上的主导电层和覆盖下层和侧表面的侧表面的电极层和主导电层的上表面。 下层包括形成为与绝缘基板接触并且含有Ti合金的粘附层。

公开(公告)号：US20240159375A1

公开(公告)日：2024-05-16

申请号：US18506981

申请日：2023-11-10

Applicant: NICHIA CORPORATION

Inventor： Yuji SATO ,  Takuya NOICHI ,  Masafumi SAKAMOTO

IPC: F21S43/249 ,  F21S43/20 ,  F21S43/239 ,  F21S43/243 ,  F21V9/32

CPC classification number: F21S43/249 ,  F21S43/239 ,  F21S43/243 ,  F21S43/26 ,  F21V9/32

Abstract: A vehicle lamp includes a light guide plate including a plurality of light-exiting portions and a low-luminance portion, which is located between adjacent light-exiting portions and outputs light having luminance lower than luminance of light exiting from the light-exiting portion; a plurality of light sources each emit light having a light emission peak wavelength in a range from 420 nm to 550 nm to enter the light guide plate; and a wavelength conversion member that is disposed on the plurality of light-exiting portions and emits light having a light emission peak wavelength in a range from 540 nm to 700 nm by converting a wavelength of the light exiting from the light-exiting portion.

公开(公告)号：US20160351756A1

公开(公告)日：2016-12-01

申请号：US14726641

申请日：2015-06-01

Applicant: NICHIA CORPORATION

Inventor： Takuya NOICHI ,  Hiroaki KAGEYAMA

IPC: H01L33/50 ,  H01L33/56

CPC classification number: H01L33/38

Abstract: A light emitting device includes a base structure and a light emitting element. The light emitting element includes a first electrode and a second electrode. The first electrode includes a first electrode surface. The second electrode is separately provided from the first electrode. The second electrode includes a second electrode surface. The second electrode surface is spaced apart from the first electrode surface in a second direction different from a first direction. The second electrode surface includes a first part and a second part. The first part extends in a third direction different from each of the first direction and the second direction. The second part extends from the first part in the second direction. At least part of the second part has a curved profile extending from the first part when viewed in the first direction.

Abstract translation: 发光器件包括基底结构和发光元件。 发光元件包括第一电极和第二电极。 第一电极包括第一电极表面。 第二电极与第一电极分开设置。 第二电极包括第二电极表面。 第二电极表面在与第一方向不同的第二方向上与第一电极表面间隔开。 第二电极表面包括第一部分和第二部分。 第一部分沿与第一方向和第二方向不同的第三方向延伸。 第二部分从第二个方向的第一部分延伸出来。 当从第一方向观察时，第二部分的至少一部分具有从第一部分延伸的弯曲轮廓。