Film formation method
    8.
    发明授权

    公开(公告)号:US11827985B2

    公开(公告)日:2023-11-28

    申请号:US17598930

    申请日:2019-03-29

    IPC分类号: C23C24/04 F01L3/04 C22C9/00

    CPC分类号: C23C24/04 F01L3/04 C22C9/00

    摘要: A film forming method forms a coating film on a workpiece (e.g., a cylinder head) having a film-deposited portion (e.g., an annular valve seat part) by moving a nozzle of a cold spray device relative to the workpiece along a film formation trajectory having a film formation starting point and a film formation finishing point in which the film-deposited portion overlaps to form an overlapping portion. The coating film is formed by causing a raw material powder to collide in a solid-phase state with the workpiece and plastically deform. Also, the coating film on the film-deposited portion is further formed such that an inclination angle of an end part of the coating film relative to a surface of the film-deposited portion is 45° or less at the film formation starting point of the overlapping portion.