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公开(公告)号:US20190225838A1
公开(公告)日:2019-07-25
申请号:US16255378
申请日:2019-01-23
Applicant: NITTO DENKO CORPORATION
Inventor: Tatsuya Suzuki , Akira Hirao , Hiroki Ieda
Abstract: Provided is a laminate sheet in which a first sheet, a PSA layer and a second sheet are laminated in this order. Of the first and second sheets, at least one is a release liner having a release face on the side facing the PSA layer. The PSA layer has a thickness of 200 μm or greater. The first sheet has a tensile modulus of 1000 MPa or greater and the second sheet has a tensile modulus of 500 MPa or less.
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公开(公告)号:US20190206427A1
公开(公告)日:2019-07-04
申请号:US16223800
申请日:2018-12-18
Applicant: Nitto Denko Corporation
Inventor: Kenji Furuta , Akira Hirao , Tatsuya Suzuki , Hiroki Ieda , Akira Chinen , Minami Watanabe
CPC classification number: G11B5/012 , C09J7/387 , C09J2203/326 , C09J2205/114 , C09J2425/00 , C09J2453/00 , G11B5/127 , G11B19/2009
Abstract: Provided is a PSA sheet that achieves both bonding reliability at a high temperature and reduction of outgassing. The PSA sheet provided by this invention comprises a substrate layer and a PSA layer provided to one face of the substrate layer. The PSA sheet exhibits a 180° peel strength of 1 N/20 mm or greater to stainless steel at 60° C. It has an amount of thermally released gas of 10 μg/cm2 or less, determined at 130° C. for 30 minutes by GC-MS.
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公开(公告)号:US10593353B2
公开(公告)日:2020-03-17
申请号:US16223800
申请日:2018-12-18
Applicant: Nitto Denko Corporation
Inventor: Kenji Furuta , Akira Hirao , Tatsuya Suzuki , Hiroki Ieda , Akira Chinen , Minami Watanabe
Abstract: Provided is a PSA sheet that achieves both bonding reliability at a high temperature and reduction of outgassing. The PSA sheet provided by this invention comprises a substrate layer and a PSA layer provided to one face of the substrate layer. The PSA sheet exhibits a 180° peel strength of 1 N/20 mm or greater to stainless steel at 60° C. It has an amount of thermally released gas of 10 μg/cm2 or less, determined at 130° C. for 30 minutes by GC-MS.
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公开(公告)号:US20200031028A1
公开(公告)日:2020-01-30
申请号:US16522794
申请日:2019-07-26
Applicant: Nitto Denko Corporation
Inventor: Tatsuya Suzuki , Takeshi Nakano , Hiroki Ieda
IPC: B29C45/00
Abstract: Provided is a thermally conductive sheet with greater optical transmission. The thermally conductive sheet provided by this invention has a resin layer that comprises a resin and a thermally conductive filler. The resin has a refractive index np and the thermally conductive filler has a refractive index nf, satisfying the next relational expression −0.04≤(np−nf)≤0.04. According to a preferable embodiment, the thermally conductive filler content is 50 parts by weight or more and 250 parts by weight or less to 100 parts by weight of the resin.
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公开(公告)号:US10961417B2
公开(公告)日:2021-03-30
申请号:US16255378
申请日:2019-01-23
Applicant: NITTO DENKO CORPORATION
Inventor: Tatsuya Suzuki , Akira Hirao , Hiroki Ieda
IPC: C09J7/25 , C09J7/40 , C09J7/38 , B32B7/06 , B32B7/12 , B32B27/26 , C09J7/22 , B32B27/36 , B32B27/32
Abstract: Provided is a laminate sheet in which a first sheet, a PSA layer and a second sheet are laminated in this order. Of the first and second sheets, at least one is a release liner having a release face on the side facing the PSA layer. The PSA layer has a thickness of 200 μm or greater. The first sheet has a tensile modulus of 1000 MPa or greater and the second sheet has a tensile modulus of 500 MPa or less.
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公开(公告)号:US10815396B2
公开(公告)日:2020-10-27
申请号:US16174624
申请日:2018-10-30
Applicant: NITTO DENKO CORPORATION
Inventor: Tatsuya Suzuki , Hiroki Ieda , Akira Hirao , Kenji Furuta
IPC: C09J7/38 , C08K3/22 , C09J11/04 , C09J133/06 , C09J133/26 , C09J9/00 , C09J7/10 , C08K3/01
Abstract: Provided is a thermally conductive PSA sheet that comprises a PSA layer comprising a thermally conductive filler. The PSA sheet has a thermal resistance less than 6.0 cm2·K/W, and also has an adhesive strength N1 at 30 minutes of standing at 23° C. after applied to a stainless steel plate and an adhesive strength N2 at 23° C. after subjected to 5 minutes of heating at 80° C. after applied to a stainless steel plate, satisfying N2/N1≥2.
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