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公开(公告)号：US20210403759A1
公开(公告)日：2021-12-30
申请号：US17474253
申请日：2021-09-14
发明人： Akiko YOSHIDA , Kenichi OKADA , Koji AKAZAWA
IPC分类号： C09J5/04 , C09J163/00 , C09J7/30 , C09J7/10 , C09J7/40
摘要： An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.
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公开(公告)号：US20140057374A1
公开(公告)日：2014-02-27
申请号：US14068590
申请日：2013-10-31
发明人： Takashi KONDO , Koji AKAZAWA , Takashi OZAKI
IPC分类号： H01L33/56
CPC分类号： H01L33/56 , B29C43/18 , H01L33/50 , H01L33/505 , H01L33/507 , H01L2224/48227 , H01L2933/005 , H05B33/04 , Y10T428/31663
摘要： The present invention relates to an optical-semiconductor device, which is prepared by: arranging a sheet for optical-semiconductor element encapsulation including an encapsulating resin layer capable of embedding an optical-semiconductor element and a wavelength conversion layer containing light wavelength-converting particles and being laminated directly or indirectly on the encapsulating resin layer, on an optical-semiconductor element-mounting substrate so that the encapsulating resin layer faces the optical-semiconductor element-mounting substrate; followed by compression-molding, in which the wavelength conversion layer is present on an upper part of a molded body in which the optical-semiconductor element is embedded therein, but is not present on a side surface of the molded body.
摘要翻译： 光半导体装置技术领域本发明涉及一种光半导体装置，其通过以下方式制备：将包含能够嵌入光半导体元件的封装树脂层和含有光波长转换粒子的波长转换层的光半导体元件封装用片， 在光学半导体元件安装基板上直接或间接地层叠在封装树脂层上，使得封装树脂层面向光半导体元件安装基板; 接着进行压缩成型，其中波长转换层存在于其中嵌入光半导体元件的成型体的上部，但不存在于成型体的侧表面上。
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公开(公告)号：US20140106487A1
公开(公告)日：2014-04-17
申请号：US14140817
申请日：2013-12-26
发明人： Kazuya FUJIOKA , Hirokazu MATSUDA , Koji AKAZAWA
IPC分类号： H01L33/52
CPC分类号： H01L33/52 , H01L23/295 , H01L23/296 , H01L23/3135 , H01L33/507 , H01L2924/0002 , H01L2933/005 , H01L2933/0091 , H01L2924/00
摘要： The present invention relates to a sheet-shaped, optical-semiconductor encapsulating material including: a first resin layer containing inorganic particles; and a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer, and relates to a kit for optical-semiconductor encapsulation including: a sheet-shaped molded body including a first resin layer containing inorganic particles; and a sheet-shaped molded body including a second resin layer containing a phosphor.
摘要翻译： 本发明涉及一种片状光半导体封装材料，包括：含有无机颗粒的第一树脂层; 以及包含荧光体并且直接或间接叠置在第一树脂层上的第二树脂层，并且涉及一种用于光学半导体封装的套件，包括：包括含有无机颗粒的第一树脂层的片状成型体; 以及包含含有荧光体的第二树脂层的片状成型体。
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公开(公告)号：US20200002581A1
公开(公告)日：2020-01-02
申请号：US16490806
申请日：2018-03-01
发明人： Kaori AKAMATSU , Kaori MIZOBATA , Ryo AWANE , Koji AKAZAWA , Junji YOKOYAMA , Akira HIRAO , Yosuke SHIMIZU , Akiko TANAKA
IPC分类号： C09J9/00 , C09J133/08 , C09J11/06 , C08K5/521 , C09J133/10
摘要： An object of the present invention is to provide an electrically debondable composition for forming an electrically debondable adhesive layer suitable for suppressing corrosion of a metal adherend surface. The present invention further provides an adhesive sheet having the electrically debondable adhesive layer, and an adhered body including the adhesive sheet. An electrically debondable composition of the present invention includes a polymer, an ionic liquid, and at least one additive selected from the group consisting of a carbodiimide compound, an adsorptive inhibitor and a chelate-forming metal deactivator.
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公开(公告)号：US20180327635A1
公开(公告)日：2018-11-15
申请号：US15773586
申请日：2016-10-31
发明人： Akiko YOSHIDA , Kenichi OKADA , Koji AKAZAWA
IPC分类号： C09J5/04 , C09J7/40 , C09J163/00
摘要： An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.
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