OPTICAL-SEMICONDUCTOR DEVICE
    2.
    发明申请
    OPTICAL-SEMICONDUCTOR DEVICE 审中-公开
    光学半导体器件

    公开(公告)号:US20140057374A1

    公开(公告)日:2014-02-27

    申请号:US14068590

    申请日:2013-10-31

    Abstract: The present invention relates to an optical-semiconductor device, which is prepared by: arranging a sheet for optical-semiconductor element encapsulation including an encapsulating resin layer capable of embedding an optical-semiconductor element and a wavelength conversion layer containing light wavelength-converting particles and being laminated directly or indirectly on the encapsulating resin layer, on an optical-semiconductor element-mounting substrate so that the encapsulating resin layer faces the optical-semiconductor element-mounting substrate; followed by compression-molding, in which the wavelength conversion layer is present on an upper part of a molded body in which the optical-semiconductor element is embedded therein, but is not present on a side surface of the molded body.

    Abstract translation: 光半导体装置技术领域本发明涉及一种光半导体装置,其通过以下方式制备:将包含能够嵌入光半导体元件的封装树脂层和含有光波长转换粒子的波长转换层的光半导体元件封装用片, 在光学半导体元件安装基板上直接或间接地层叠在封装树脂层上,使得封装树脂层面向光半导体元件安装基板; 接着进行压缩成型,其中波长转换层存在于其中嵌入光半导体元件的成型体的上部,但不存在于成型体的侧表面上。

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