公开(公告)号：US20140159072A1

公开(公告)日：2014-06-12

申请号：US14096626

申请日：2013-12-04

Applicant: NITTO DENKO CORPORATION

Inventor： Yasunari OOYABU ,  Yoshihiko KITAYAMA ,  Munehisa MITANI

IPC: H05K1/11 ,  H01L25/075

CPC classification number: H05K1/11 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device assembly includes a plurality of light-emitting devices, the plurality of light-emitting devices being provided continuously, the plurality of light-emitting devices each including a substrate, an optical semiconductor element mounted on the surface of the substrate, an encapsulating layer formed on the substrate surface to encapsulate the optical semiconductor element, and an electrode formed on the substrate surface so as to be electrically connected to the optical semiconductor element. The substrate has a fragile region formed to partition off the light-emitting devices that are disposed next to each other.

Abstract translation: 发光装置组件包括多个发光装置，所述多个发光装置连续地设置，所述多个发光装置各自包括基板，安装在所述基板的表面上的光半导体元件， 形成在基板表面上以封装光学半导体元件的封装层，以及形成在基板表面上以电连接到光学半导体元件的电极。 基板具有形成为分隔彼此相邻布置的发光器件的脆弱区域。

公开(公告)号：US20140091337A1

公开(公告)日：2014-04-03

申请号：US14096570

申请日：2013-12-04

Applicant: NITTO DENKO CORPORATION

Inventor： Yasunari OOYABU ,  Yoshihiko KITAYAMA ,  Munehisa MITANI

IPC: H01L33/52 ,  H01L27/15

CPC classification number: H01L33/52 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/09709 ,  H05K2201/09972 ,  H05K2201/10106 ,  H05K2203/1311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device assembly includes a substrate, an optical semiconductor element mounted on the surface of the substrate, an encapsulating layer formed on the substrate surface to encapsulate the optical semiconductor element, and an electrode formed on the substrate surface to be electrically connected to the optical semiconductor element. On the substrate, only an encapsulating region and an electrode region are formed, the encapsulating region including the optical semiconductor element and being defined by the encapsulating layer, and the electrode region being defined by the electrode exposed from the encapsulating layer.

Abstract translation: 发光装置组件包括基板，安装在基板的表面上的光半导体元件，形成在基板表面上以封装光半导体元件的封装层，以及形成在基板表面上以电连接到 光半导体元件。 在基板上仅形成封装区域和电极区域，该封装区域包括光学半导体元件并由封装层限定，并且电极区域由从封装层露出的电极限定。