公开(公告)号：US20160005710A1

公开(公告)日：2016-01-07

申请号：US14728891

申请日：2015-06-02

Applicant: NXP B.V.

Inventor： Sven Walczyk ,  Johan de Beer ,  Erik Eltink ,  Amar Mavinkurve

IPC: H01L23/00 ,  B23K1/20 ,  B23K1/00 ,  H01L23/495 ,  H01L21/48

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K1/20 ,  H01L23/49572 ,  H01L23/49586 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/10175 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/81011 ,  H01L2224/81022 ,  H01L2224/81097 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/8136 ,  H01L2224/81395 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A method of attaching an electronic component to a metal substrate, wherein the electronic component comprises solder provided on an exposed solder region. The method comprising: forming a metal-based compound layer on the substrate; placing the electronic component on the metal substrate such that the solder region is in contact with a contact region of the metal-based compound layer; and heating the solder region such that the contact region of the metal-based compound layer dissolves and the solder region forms an electrical connection between the electronic component and the metal substrate. The metal-based compound layer can have a minimum thickness of 10 nm.

Abstract translation: 一种将电子部件附接到金属基板的方法，其中所述电子部件包括设置在暴露的焊料区域上的焊料。 该方法包括：在基底上形成金属基化合物层; 将电子部件放置在金属基板上，使得焊料区域与金属基化合物层的接触区域接触; 并且加热焊料区域使得金属基化合物层的接触区域溶解，并且焊料区域形成电子部件和金属基板之间的电连接。 金属基化合物层可以具有10nm的最小厚度。