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公开(公告)号：US08293057B2
公开(公告)日：2012-10-23
申请号：US12049371
申请日：2008-03-17
申请人： Nagesh Ramachandra , Jennifer Mia Fishburn , Paul Timothy Sharp , Susan Williams , Paul Andrew Papworth , Simon Fielder , Kia Silverbrook
发明人： Nagesh Ramachandra , Jennifer Mia Fishburn , Paul Timothy Sharp , Susan Williams , Paul Andrew Papworth , Simon Fielder , Kia Silverbrook
CPC分类号： B41J2/155 , B23K26/066 , B23K26/384 , B23K26/389 , B23K2103/42 , B23K2103/50 , B41J2/16 , B41J2/1623 , B41J2/1634 , B41J2202/19 , B41J2202/20 , Y10T156/1052 , Y10T156/1056 , Y10T156/1057 , Y10T156/1062 , Y10T156/1084
摘要： A method of fabricating an apertured polymeric film. The method comprising the steps of: (a) masking a polymeric film with a first mask having first laser transmission zones defined therein; (b) laser-ablating first apertures through the polymeric film using the first mask; (c) masking the film with a second mask having second laser transmission zones defined therein, each second zone being aligned with a corresponding first aperture, and each second zone having greater perimeter dimensions than the corresponding first aperture; and (d) reaming the first apertures by laser-ablating the polymeric film using the second mask, the reamed first apertures defining second apertures in the film.
摘要翻译： 一种制造有孔聚合物膜的方法。 该方法包括以下步骤：（a）用其中限定有第一激光传输区的第一掩模掩蔽聚合物膜; （b）使用第一掩模激光消融通过聚合物膜的第一孔; （c）用限定在其中的第二激光传播区域的第二掩模掩蔽所述膜，每个第二区域与相应的第一孔对准，并且每个第二区域具有比相应的第一孔径更大的周界尺寸; 以及（d）通过使用所述第二掩模激光消融所述聚合物膜来铰接所述第一孔，所述扩孔的第一孔限定所述膜中的第二孔。
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2.发明申请公开(公告)号：US20090231383A1
公开(公告)日：2009-09-17
申请号：US12049371
申请日：2008-03-17
申请人： Nagesh Ramachandra , Jennifer Mia Fishburn , Paul Timothy Sharp , Susan Williams , Paul Andrew Papworth , Simon Fielder , Kia Silverbrook
发明人： Nagesh Ramachandra , Jennifer Mia Fishburn , Paul Timothy Sharp , Susan Williams , Paul Andrew Papworth , Simon Fielder , Kia Silverbrook
CPC分类号： B41J2/155 , B23K26/066 , B23K26/384 , B23K26/389 , B23K2103/42 , B23K2103/50 , B41J2/16 , B41J2/1623 , B41J2/1634 , B41J2202/19 , B41J2202/20 , Y10T156/1052 , Y10T156/1056 , Y10T156/1057 , Y10T156/1062 , Y10T156/1084
摘要： A method of fabricating an apertured polymeric film. The method comprising the steps of: (a) masking a polymeric film with a first mask having first laser transmission zones defined therein; (b) laser-ablating first apertures through the polymeric film using the first mask; (c) masking the film with a second mask having second laser transmission zones defined therein, each second zone being aligned with a corresponding first aperture, and each second zone having greater perimeter dimensions than the corresponding first aperture; and (d) reaming the first apertures by laser-ablating the polymeric film using the second mask, the reamed first apertures defining second apertures in the film.
摘要翻译： 一种制造有孔聚合物膜的方法。 该方法包括以下步骤：（a）用其中限定有第一激光传输区的第一掩模掩蔽聚合物膜; （b）使用第一掩模激光消融通过聚合物膜的第一孔; （c）用限定在其中的第二激光传播区域的第二掩模掩蔽所述膜，每个第二区域与相应的第一孔对准，并且每个第二区域具有比相应的第一孔径更大的周界尺寸; 以及（d）通过使用所述第二掩模激光消融所述聚合物膜来铰接所述第一孔，所述扩孔的第一孔限定所述膜中的第二孔。
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3.发明申请公开(公告)号：US20090231384A1
公开(公告)日：2009-09-17
申请号：US12049373
申请日：2008-03-17
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1634 , B41J2202/19 , B41J2202/20 , C09J7/35 , C09J2201/128 , C09J2201/134 , C09J2201/20 , C09J2463/00 , C09J2479/086 , Y10T428/14 , Y10T428/24322
摘要： A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric film; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric film is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer.
摘要翻译： 用于将打印头集成电路连接到供墨歧管的层压膜。 膜具有限定在其中的多个供墨孔，膜包括：中心聚合物膜; 用于将所述膜的第一表面粘合到所述供墨歧管的第一粘合剂层; 以及用于将薄膜的第二表面粘合到打印头集成电路的第二粘合剂层。 中心聚合物膜夹在第一和第二粘合剂层之间。 第一粘合剂层的第一熔融温度比第二粘合剂层的第二熔融温度低至少20℃。
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公开(公告)号：US20110085010A1
公开(公告)日：2011-04-14
申请号：US12973307
申请日：2010-12-20
IPC分类号： B41J2/175
CPC分类号： B41J2/16 , B41J2/155 , B41J2/1623 , B41J2/1634 , B41J2002/14362 , B41J2002/14419 , B41J2002/14491 , B41J2202/20 , C09J163/00 , Y10T156/10
摘要： A printhead assembly includes an ink manifold having a plurality of ink outlets defined in a manifold bonding surface; one or more printhead integrated circuits, each printhead integrated circuit having a plurality of ink inlets defined in a printhead bonding surface; and an adhesive film sandwiched between said manifold bonding surface and said one or more printhead bonding surfaces, said film having a plurality of ink supply holes defined therein, each ink supply hole being aligned with an ink outlet and an ink inlet. The adhesive film is a laminated film comprising a central polymeric film sandwiched between a first adhesive layer and a second adhesive layer, the first adhesive layer has a melt temperature lower than that of the second adhesive layer.
摘要翻译： 打印头组件包括具有限定在歧管接合表面中的多个墨水出口的墨水歧管; 一个或多个打印头集成电路，每个打印头集成电路具有限定在打印头接合表面中的多个墨水入口; 以及夹在所述歧管接合表面和所述一个或多个打印头接合表面之间的粘合剂膜，所述膜具有限定在其中的多个供墨孔，每个供墨孔与墨水出口和墨水入口对准。 粘合剂膜是包含夹在第一粘合剂层和第二粘合剂层之间的中心聚合物膜的层压膜，第一粘合剂层的熔融温度低于第二粘合剂层的熔融温度。
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5.发明授权Printhead integrated circuit attachment film having differentiated adhesive layers 有权具有差异化粘合剂层的打印头集成电路连接膜公开(公告)号：US07845755B2
公开(公告)日：2010-12-07
申请号：US12049373
申请日：2008-03-17
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1634 , B41J2202/19 , B41J2202/20 , C09J7/35 , C09J2201/128 , C09J2201/134 , C09J2201/20 , C09J2463/00 , C09J2479/086 , Y10T428/14 , Y10T428/24322
摘要： A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric film; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric film is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer.
摘要翻译： 用于将打印头集成电路连接到供墨歧管的层压膜。 膜具有限定在其中的多个供墨孔，膜包括：中心聚合物膜; 用于将所述膜的第一表面粘合到所述供墨歧管的第一粘合剂层; 以及用于将薄膜的第二表面粘合到打印头集成电路的第二粘合剂层。 中心聚合物膜夹在第一和第二粘合剂层之间。 第一粘合剂层的第一熔融温度比第二粘合剂层的第二熔融温度低至少20℃。
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公开(公告)号：US20090231400A1
公开(公告)日：2009-09-17
申请号：US12049375
申请日：2008-03-17
IPC分类号： B41J2/175
CPC分类号： B41J2/175 , B41J2/155 , B41J2/16 , B41J2/1623 , B41J2/1634 , B41J2/17513 , B41J2/1752 , B41J2/17553 , B41J2/18 , B41J2/185 , B41J29/02 , B41J29/13 , B41J2002/14491 , B41J2202/20
摘要： A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric web; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric web is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer.
摘要翻译： 用于将打印头集成电路连接到供墨歧管的层压膜。 膜具有限定在其中的多个供墨孔，膜包括：中央聚合物网; 用于将所述膜的第一表面粘合到所述供墨歧管的第一粘合剂层; 以及用于将薄膜的第二表面粘合到打印头集成电路的第二粘合剂层。 中心聚合物网被夹在第一和第二粘合剂层之间。 第一粘合剂层的第一熔融温度比第二粘合剂层的第二熔融温度低至少20℃。
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7.发明申请METHOD OF ATTACHING PRINTHEAD INTEGRATED CIRCUITS TO AN INK MANIFOLD USING ADHESIVE FILM 有权使用粘合膜将打印机集成电路连接到墨水盒的方法公开(公告)号：US20090229744A1
公开(公告)日：2009-09-17
申请号：US12049374
申请日：2008-03-17
IPC分类号： B32B38/10 , C09J163/00
CPC分类号： B41J2/16 , B41J2/155 , B41J2/1623 , B41J2/1634 , B41J2002/14362 , B41J2002/14419 , B41J2002/14491 , B41J2202/20 , C09J163/00 , Y10T156/10
摘要： A method of attaching one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing a laminated film having a plurality of ink supply holes defined therein, the laminated film comprising a central polymeric film sandwiched between first and second adhesive layers, wherein a first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer; (b) aligning the film with the ink supply manifold such that each ink supply hole is aligned with a respective ink outlet defined in a manifold bonding surface of the ink supply manifold; (b) bonding the first adhesive layer to the manifold bonding surface by applying heat and pressure to an opposite side of the film; (c) aligning the printhead integrated circuits with the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of each printhead integrated circuit; and (d) bonding the printhead integrated circuits to the second adhesive layer.
摘要翻译： 将一个或多个打印头集成电路附接到墨水供应歧管的方法。 该方法包括以下步骤：（a）提供层压膜，其中限定有多个供墨孔，所述层压膜包括夹在第一和第二粘合层之间的中心聚合物膜，其中第一粘合层的第一熔融温度 低于第二粘合剂层的第二熔融温度至少20℃; （b）使膜与供墨歧管对准，使得每个供墨孔与限定在供墨歧管的歧管接合表面中的相应墨出口对齐; （b）通过向膜的相反侧施加热和压力将第一粘合剂层粘合到歧管接合表面; （c）将打印头集成电路与胶片对准，使得每个供墨孔与限定在每个打印头集成电路的打印头接合表面中的墨水入口对齐; 和（d）将打印头集成电路连接到第二粘合剂层。
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公开(公告)号：US08444252B2
公开(公告)日：2013-05-21
申请号：US12973307
申请日：2010-12-20
CPC分类号： B41J2/16 , B41J2/155 , B41J2/1623 , B41J2/1634 , B41J2002/14362 , B41J2002/14419 , B41J2002/14491 , B41J2202/20 , C09J163/00 , Y10T156/10
摘要： A printhead assembly includes an ink manifold having a plurality of ink outlets defined in a manifold bonding surface; one or more printhead integrated circuits, each printhead integrated circuit having a plurality of ink inlets defined in a printhead bonding surface; and an adhesive film sandwiched between said manifold bonding surface and said one or more printhead bonding surfaces, said film having a plurality of ink supply holes defined therein, each ink supply hole being aligned with an ink outlet and an ink inlet. The adhesive film is a laminated film comprising a central polymeric film sandwiched between a first adhesive layer and a second adhesive layer, the first adhesive layer has a melt temperature lower than that of the second adhesive layer.
摘要翻译： 打印头组件包括具有限定在歧管接合表面中的多个墨水出口的墨水歧管; 一个或多个打印头集成电路，每个打印头集成电路具有限定在打印头接合表面中的多个墨水入口; 以及夹在所述歧管接合表面和所述一个或多个打印头接合表面之间的粘合剂膜，所述膜具有限定在其中的多个供墨孔，每个供墨孔与墨水出口和墨水入口对准。 粘合剂膜是包含夹在第一粘合剂层和第二粘合剂层之间的中心聚合物膜的层压膜，第一粘合剂层的熔融温度低于第二粘合剂层的熔融温度。
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公开(公告)号：US07875139B2
公开(公告)日：2011-01-25
申请号：US12783506
申请日：2010-05-19
CPC分类号： B41J2/16 , B41J2/155 , B41J2/1623 , B41J2/1634 , B41J2002/14362 , B41J2002/14419 , B41J2002/14491 , B41J2202/20 , C09J163/00 , Y10T156/10
摘要： A method of assembling a pagewidth printhead. The method includes: aligning a multilayered adhesive film an said ink supply manifold such that ink supply holes in the film are aligned with respective ink outlets in the ink supply manifold; bonding a first adhesive layer of the film to a manifold bonding surface; heating a printhead integrated circuit and positioning the heated printhead integrated circuit on an opposite side of the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of the printhead integrated circuit; and repeatedly bonding printhead integrated circuits to the film to provide the pagewidth printhead.
摘要翻译： 一种组合页宽打印头的方法。 该方法包括：将多层粘合剂膜与所述供墨歧管对准，使得膜中的墨供应孔与供墨歧管中的相应墨出口对准; 将膜的第一粘合剂层粘合到歧管接合表面; 加热打印头集成电路并将加热的打印头集成电路定位在膜的相对侧上，使得每个供墨孔与限定在打印头集成电路的打印头接合表面中的墨水入口对齐; 并将打印头集成电路重复地粘合到胶片上以提供页宽打印头。
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10.发明授权Method of attaching printhead integrated circuits to an ink manifold using adhesive film 有权使用粘合膜将打印头集成电路连接到墨水歧管的方法公开(公告)号：US07727348B2
公开(公告)日：2010-06-01
申请号：US12049374
申请日：2008-03-17
CPC分类号： B41J2/16 , B41J2/155 , B41J2/1623 , B41J2/1634 , B41J2002/14362 , B41J2002/14419 , B41J2002/14491 , B41J2202/20 , C09J163/00 , Y10T156/10
摘要： A method of attaching one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing a laminated film having a plurality of ink supply holes defined therein, the laminated film comprising a central polymeric film sandwiched between first and second adhesive layers, wherein a first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer; (b) aligning the film with the ink supply manifold such that each ink supply hole is aligned with a respective ink outlet defined in a manifold bonding surface of the ink supply manifold; (b) bonding the first adhesive layer to the manifold bonding surface by applying heat and pressure to an opposite side of the film; (c) aligning the printhead integrated circuits with the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of each printhead integrated circuit; and (d) bonding the printhead integrated circuits to the second adhesive layer.
摘要翻译： 将一个或多个打印头集成电路附接到墨水供应歧管的方法。 该方法包括以下步骤：（a）提供层压膜，其中限定有多个供墨孔，所述层压膜包括夹在第一和第二粘合层之间的中心聚合物膜，其中第一粘合层的第一熔融温度 低于第二粘合剂层的第二熔融温度至少20℃; （b）使膜与供墨歧管对准，使得每个供墨孔与限定在供墨歧管的歧管接合表面中的相应墨出口对齐; （b）通过向膜的相对侧施加热和压力将第一粘合剂层粘合到歧管接合表面; （c）将打印头集成电路与胶片对准，使得每个供墨孔与限定在每个打印头集成电路的打印头接合表面中的墨水入口对齐; 和（d）将打印头集成电路连接到第二粘合剂层。
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