Light Emission Device And Method Of Forming The Same

    公开(公告)号:US20240355967A1

    公开(公告)日:2024-10-24

    申请号:US18625406

    申请日:2024-04-03

    IPC分类号: H01L33/28 H01L33/00 H01L33/10

    摘要: Various embodiments may provide a light emission device including a stacked arrangement having a first pad region, a second pad region and a bridge region. At least a portion of the first pad region may include a portion of a first doped layer, while at least a portion of the second pad region may include a further portion of the first doped layer, a portion of a second doped layer, and a portion of an intrinsic layer. A percentage concentration of tin (Sn) of the intrinsic layer may be higher than that of the first doped layer, and that of the second doped layer. The light emission device may include a first tensile stressed metal pad in contact with the portion of the first doped layer, and a second tensile stressed metal pad in contact with the portion of the second doped layer.