Wet processing apparatus, wet processing method and storage medium
    1.
    发明授权
    Wet processing apparatus, wet processing method and storage medium 有权
    湿处理设备,湿法处理方法和存储介质

    公开(公告)号:US08522714B2

    公开(公告)日:2013-09-03

    申请号:US13037624

    申请日:2011-03-01

    IPC分类号: B05C11/00 B05C11/02 B05B7/06

    摘要: A wet processing apparatus for wet-processing substrates can suppress the reduction of throughput when some component part thereof becomes unserviceable. The wet processing apparatus includes a first nozzle unit and a second nozzle unit. When the wet processing apparatus operates in a normal mode, a substrate carrying mechanism is controlled so as to deliver substrates alternately to processing units of a first group and those of a second group so that the substrates are processed sequentially in order. When the processing units of the first group (the second group) are unserviceable due to the inoperativeness of the substrate holders, a processing liquid supply system or a nozzle support mechanism, the nozzle unit for the processing units of the second group (the first group) is moved to process substrates by the serviceable ones of the first group (the second group).

    摘要翻译: 用于湿处理基板的湿式处理装置可以抑制当其一部分成为不可用时的吞吐量的降低。 湿式处理装置包括第一喷嘴单元和第二喷嘴单元。 当湿法处理装置以正常模式操作时,控制基板承载机构以将基板交替地传送到第一组和第二组的处理单元,使得依次顺序地处理基板。 当第一组(第二组)的处理单元由于衬底保持器的不操作而不能使用时,处理液体供应系统或喷嘴支撑机构,用于第二组(第一组)的处理单元的喷嘴单元 )被移动到由第一组(第二组)中可用的基板处理衬底。

    WET PROCESSING APPARATUS, WET PROCESSING METHOD AND STORAGE MEDIUM
    2.
    发明申请
    WET PROCESSING APPARATUS, WET PROCESSING METHOD AND STORAGE MEDIUM 有权
    湿处理设备,湿处理方法和储存介质

    公开(公告)号:US20110217473A1

    公开(公告)日:2011-09-08

    申请号:US13037624

    申请日:2011-03-01

    IPC分类号: B05D1/30 B05C11/00 B05D1/00

    摘要: A wet processing apparatus for wet-processing substrates can suppress the reduction of throughput when some component part thereof becomes unserviceable. The wet processing apparatus includes a first nozzle unit and a second nozzle unit. When the wet processing apparatus operates in a normal mode, a substrate carrying mechanism is controlled so as to deliver substrates alternately to processing units of a first group and those of a second group so that the substrates are processed sequentially in order. When the processing units of the first group (the second group) are unserviceable due to the inoperativeness of the substrate holders, a processing liquid supply system or a nozzle support mechanism, the nozzle unit for the processing units of the second group (the first group) is moved to process substrates by the serviceable ones of the first group (the second group).

    摘要翻译: 用于湿处理基板的湿式处理装置可以抑制当其一部分成为不可用时的吞吐量的降低。 湿式处理装置包括第一喷嘴单元和第二喷嘴单元。 当湿法处理装置以正常模式操作时,控制基板承载机构以将基板交替地传送到第一组和第二组的处理单元,使得依次顺序地处理基板。 当第一组(第二组)的处理单元由于基板保持器的不能操作而不能使用时,处理液体供应系统或喷嘴支撑机构,用于第二组(第一组)的处理单元的喷嘴单元 )被移动到由第一组(第二组)中可用的基板处理衬底。

    Liquid processing apparatus, liquid processing method and storage medium
    3.
    发明授权
    Liquid processing apparatus, liquid processing method and storage medium 有权
    液体处理装置,液体处理方法和储存介质

    公开(公告)号:US08671875B2

    公开(公告)日:2014-03-18

    申请号:US12540219

    申请日:2009-08-12

    IPC分类号: B05B13/04 B05C11/00

    摘要: Disclosed is a liquid processing apparatus capable of increasing the number of arranged substrate retainers without increasing the total exhaust amount of the liquid processing apparatus. A N-number (N is an integer identical to or greater than three) of cup bodies are inhaled and exhausted in total exhaust amount E through a plurality of separate exhaustion passage each having a first damper, and through a common exhaustion passage connected in common downstream of the separate exhaustion passages. The first dampers are configured such that an external air is received from the cup body in a first intake amount of external air E1 for one of the cup bodies where a chemical liquid nozzle is placed at a setting location facing a wafer, and an external air is received from each of the other cup bodies in a second intake amount of external air E2 less than the first amount E1 and the intake amount of external air from both each of the other cup bodies and each of branched passages equals (E−E1)/(n−1).

    摘要翻译: 公开了一种液体处理装置,其能够增加布置的基板保持件的数量,而不增加液体处理装置的总排气量。 通过具有第一阻尼器的多个分开的排气通道,并且通过共同连接的共同的排气通道吸入并排出具有总排气量E的杯体的N数(N是等于或大于3的整数) 在分开的排气通道的下游。 第一阻尼器构造成使得外部空气从杯体中以第一吸入量的外部空气E1接收,用于杯形体之一,其中化学液体喷嘴位于面向晶片的设置位置处,并且外部空气 从每个其他杯体的第二吸入量小于第一量E1的外部空气E2和来自两个其他杯体和每个分支通道的外部空气的吸入量等于(E-E1) /(n-1)。

    Coating method, coating device, and storage medium
    4.
    发明授权
    Coating method, coating device, and storage medium 有权
    涂布方法,涂布装置和存储介质

    公开(公告)号:US08940365B2

    公开(公告)日:2015-01-27

    申请号:US13336373

    申请日:2011-12-23

    IPC分类号: B05D3/12 G06F19/00 H01L21/67

    CPC分类号: H01L21/6715

    摘要: A device to form a coating film which can quickly coat a substrate of a follow-up lot after coating a preceding lot. The device is configured such that nozzles for a preceding lot and a following lot are integrated into a common movement mechanism and moved between an upper side of a liquid processing unit and a standby area. A coating method includes sucking air into the nozzle for the preceding lot to form an upper gas layer, sucking a solvent for the preceding lot in the standby area to form a thinner layer, and sucking air into the nozzle for the preceding lot to form a lower gas layer within the nozzle, and thus forming a state that a solvent layer is interposed between the upper gas layer and the lower gas layer.

    摘要翻译: 一种形成涂膜的装置,其可以在涂覆前面的批次之后快速地涂覆后续批次的基材。 该装置被构造成使得用于先前批次和后续批次的喷嘴被集成到公共运动机构中并且在液体处理单元的上侧和待机区域之间移动。 涂布方法包括将空气吸入前述批次的喷嘴中以形成上部气体层,在备用区域吸取前一批料的溶剂以形成更薄的层,并将空气吸入前一批料的喷嘴中以形成 从而形成在上部气体层和下部气体层之间插入溶剂层的状态。

    LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD
    5.
    发明申请
    LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD 有权
    液体加工设备和液体加工方法

    公开(公告)号:US20130118533A1

    公开(公告)日:2013-05-16

    申请号:US13811522

    申请日:2011-07-12

    IPC分类号: B08B3/04

    摘要: To provide a liquid processing apparatus capable of processing substrates with a high throughput with the lesser number of nozzles for chemical-liquid, when the substrates that are horizontally held in cup bodies are liquid-processed by supplying a chemical liquid to the substrates. Taking a developing process as an example of a liquid process, two-types of developing nozzles are prepared for two types of developing methods. The developing nozzle, which is used in the method in which the nozzle is engaged with the process for a longer period of time, is individually disposed on each of a first processing module 1 and a second processing module 2. On the other hand, the developing nozzle, which is used in the method in which the nozzle is engaged with the process for a shorter period of time, is used in common in the first liquid processing module 1 and the second liquid processing module 2. The common developing nozzle is configured to wait on an intermediate position between the modules 1 and 2.

    摘要翻译: 为了提供一种液体处理装置,当水平保持在杯体中的基板通过向基板供应化学液体进行液体处理时,能够以较少数量的用于液体的喷嘴来处理具有高产量的基板的液体处理装置。 以液体工艺为例的显影过程,为两种显影方法准备了两种类型的显影喷嘴。 在喷嘴与该处理接合较长时间的方法中使用的显影喷嘴被单独地设置在第一处理模块1和第二处理模块2的每一个上。另一方面, 在第一液体处理模块1和第二液体处理模块2中共同使用在喷嘴与该工艺相比较短时间接合的方法中使用的显影喷嘴。公知的显影喷嘴被配置 等待模块1和2之间的中间位置。

    PRINTED CIRCUIT BOARD DESIGN SUPPORT APPARATUS, METHOD, AND PROGRAM MEDIUM THEREFOR
    6.
    发明申请
    PRINTED CIRCUIT BOARD DESIGN SUPPORT APPARATUS, METHOD, AND PROGRAM MEDIUM THEREFOR 有权
    印刷电路板设计支持设备,方法和程序介质

    公开(公告)号:US20110093832A1

    公开(公告)日:2011-04-21

    申请号:US12978767

    申请日:2010-12-27

    申请人: Kouji Fujimura

    发明人: Kouji Fujimura

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5068

    摘要: In designing a printed circuit board, first and second copies of views of first and second major surfaces of the board respectively, are created. The first and second copies are positioned to contact each other. First and second segments on a side of the printed circuit board and normal to a first element in the first copy and a second element in the second copy respectively are obtained. A third segment joining ends of the first and second segments is obtained, and a point dividing the third segment according to a ratio of a distance from the first element to the side and a distance from the second element to the side is calculated. Distances from the first element to the point and from the point to the second element are calculated, and a creepage distance, a sum of the two distances and a thickness of the board, is obtained.

    摘要翻译: 在设计印刷电路板时,分别形成第一和第二主表面的第一和第二副视图。 第一和第二副本被定位成彼此接触。 分别获得印刷电路板一侧的第一和第二部分,并分别垂直于第一个拷贝中的第一个元件和第二个复制件中的第二个元件。 获得接合第一和第二段的端部的第三段,并且计算根据与第一元件到侧面的距离与从第二元件到侧面的距离的比率将第三段分割的点。 计算从第一元素到点和从点到第二元素的距离,并且获得爬电距离,两个距离之和和板的厚度。

    Liquid processing apparatus and liquid processing method
    8.
    发明授权
    Liquid processing apparatus and liquid processing method 有权
    液体处理装置和液体处理方法

    公开(公告)号:US08636915B2

    公开(公告)日:2014-01-28

    申请号:US13811522

    申请日:2011-07-12

    摘要: To provide a liquid processing apparatus capable of processing substrates with a high throughput with the lesser number of nozzles for chemical-liquid, when the substrates that are horizontally held in cup bodies are liquid-processed by supplying a chemical liquid to the substrates. Taking a developing process as an example of a liquid process, two-types of developing nozzles are prepared for two types of developing methods. The developing nozzle, which is used in the method in which the nozzle is engaged with the process for a longer period of time, is individually disposed on each of a first processing module 1 and a second processing module 2. On the other hand, the developing nozzle, which is used in the method in which the nozzle is engaged with the process for a shorter period of time, is used in common in the first liquid processing module 1 and the second liquid processing module 2. The common developing nozzle is configured to wait on an intermediate position between the modules 1 and 2.

    摘要翻译: 为了提供一种液体处理装置,当水平保持在杯体中的基板通过向基板供应化学液体进行液体处理时,能够以较少数量的用于液体的喷嘴来处理具有高产量的基板的液体处理装置。 以液体工艺为例的显影过程,为两种显影方法准备了两种类型的显影喷嘴。 在喷嘴与该处理接合较长时间的方法中使用的显影喷嘴被单独地设置在第一处理模块1和第二处理模块2的每一个上。另一方面, 在第一液体处理模块1和第二液体处理模块2中共同使用在喷嘴与该工艺相比较短时间接合的方法中使用的显影喷嘴。公知的显影喷嘴被配置 等待模块1和2之间的中间位置。

    Printed circuit board design support apparatus, method, and recording medium storing program therefor
    10.
    发明授权
    Printed circuit board design support apparatus, method, and recording medium storing program therefor 有权
    印刷电路板设计支持设备,方法和记录介质存储程序

    公开(公告)号:US07984414B2

    公开(公告)日:2011-07-19

    申请号:US12978767

    申请日:2010-12-27

    申请人: Kouji Fujimura

    发明人: Kouji Fujimura

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5068

    摘要: In designing a printed circuit board, first and second copies of views of first and second major surfaces of the board respectively, are created. The first and second copies are positioned to contact each other. First and second segments on a side of the printed circuit board and normal to a first element in the first copy and a second element in the second copy respectively are obtained. A third segment joining ends of the first and second segments is obtained, and a point dividing the third segment according to a ratio of a distance from the first element to the side and a distance from the second element to the side is calculated. Distances from the first element to the point and from the point to the second element are calculated, and a creepage distance, a sum of the two distances and a thickness of the board, is obtained.

    摘要翻译: 在设计印刷电路板时,分别形成第一和第二主表面的第一和第二副视图。 第一和第二副本被定位成彼此接触。 分别获得印刷电路板一侧的第一和第二部分,并分别垂直于第一个拷贝中的第一个元件和第二个复制件中的第二个元件。 获得接合第一和第二段的端部的第三段,并且计算根据与第一元件到侧面的距离与从第二元件到侧面的距离的比率将第三段分割的点。 计算从第一元素到点和从点到第二元素的距离,并且获得爬电距离,两个距离之和和板的厚度。