摘要:
A wet processing apparatus for wet-processing substrates can suppress the reduction of throughput when some component part thereof becomes unserviceable. The wet processing apparatus includes a first nozzle unit and a second nozzle unit. When the wet processing apparatus operates in a normal mode, a substrate carrying mechanism is controlled so as to deliver substrates alternately to processing units of a first group and those of a second group so that the substrates are processed sequentially in order. When the processing units of the first group (the second group) are unserviceable due to the inoperativeness of the substrate holders, a processing liquid supply system or a nozzle support mechanism, the nozzle unit for the processing units of the second group (the first group) is moved to process substrates by the serviceable ones of the first group (the second group).
摘要:
A wet processing apparatus for wet-processing substrates can suppress the reduction of throughput when some component part thereof becomes unserviceable. The wet processing apparatus includes a first nozzle unit and a second nozzle unit. When the wet processing apparatus operates in a normal mode, a substrate carrying mechanism is controlled so as to deliver substrates alternately to processing units of a first group and those of a second group so that the substrates are processed sequentially in order. When the processing units of the first group (the second group) are unserviceable due to the inoperativeness of the substrate holders, a processing liquid supply system or a nozzle support mechanism, the nozzle unit for the processing units of the second group (the first group) is moved to process substrates by the serviceable ones of the first group (the second group).
摘要:
Disclosed is a liquid processing apparatus capable of increasing the number of arranged substrate retainers without increasing the total exhaust amount of the liquid processing apparatus. A N-number (N is an integer identical to or greater than three) of cup bodies are inhaled and exhausted in total exhaust amount E through a plurality of separate exhaustion passage each having a first damper, and through a common exhaustion passage connected in common downstream of the separate exhaustion passages. The first dampers are configured such that an external air is received from the cup body in a first intake amount of external air E1 for one of the cup bodies where a chemical liquid nozzle is placed at a setting location facing a wafer, and an external air is received from each of the other cup bodies in a second intake amount of external air E2 less than the first amount E1 and the intake amount of external air from both each of the other cup bodies and each of branched passages equals (E−E1)/(n−1).
摘要:
A device to form a coating film which can quickly coat a substrate of a follow-up lot after coating a preceding lot. The device is configured such that nozzles for a preceding lot and a following lot are integrated into a common movement mechanism and moved between an upper side of a liquid processing unit and a standby area. A coating method includes sucking air into the nozzle for the preceding lot to form an upper gas layer, sucking a solvent for the preceding lot in the standby area to form a thinner layer, and sucking air into the nozzle for the preceding lot to form a lower gas layer within the nozzle, and thus forming a state that a solvent layer is interposed between the upper gas layer and the lower gas layer.
摘要:
To provide a liquid processing apparatus capable of processing substrates with a high throughput with the lesser number of nozzles for chemical-liquid, when the substrates that are horizontally held in cup bodies are liquid-processed by supplying a chemical liquid to the substrates. Taking a developing process as an example of a liquid process, two-types of developing nozzles are prepared for two types of developing methods. The developing nozzle, which is used in the method in which the nozzle is engaged with the process for a longer period of time, is individually disposed on each of a first processing module 1 and a second processing module 2. On the other hand, the developing nozzle, which is used in the method in which the nozzle is engaged with the process for a shorter period of time, is used in common in the first liquid processing module 1 and the second liquid processing module 2. The common developing nozzle is configured to wait on an intermediate position between the modules 1 and 2.
摘要:
In designing a printed circuit board, first and second copies of views of first and second major surfaces of the board respectively, are created. The first and second copies are positioned to contact each other. First and second segments on a side of the printed circuit board and normal to a first element in the first copy and a second element in the second copy respectively are obtained. A third segment joining ends of the first and second segments is obtained, and a point dividing the third segment according to a ratio of a distance from the first element to the side and a distance from the second element to the side is calculated. Distances from the first element to the point and from the point to the second element are calculated, and a creepage distance, a sum of the two distances and a thickness of the board, is obtained.
摘要:
A fuel assembly is composed of first fuel rods containing nuclear fuel material and burnable poison material and second fuel rods containing nuclear fuel material but no burnable poison material. The fuel assembly is charged in a high conversion area of a boiling water type nuclear reactor having a reactor core having the high conversion area and a burner area surrounding the high conversion area. A ratio V.sub.C /V.sub.F is not greater than 1.5 in the fuel assembly where V.sub.C is the volume occupied by coolant flow paths and V.sub.F is the volume occupied by the nuclear fuel material per unit length in an axial direction of the fuel assembly. In addition, the burnable poison material is composed of neutron absorption nuclides having at least one resonant energy in a neutron energy region of one electron volt or less.
摘要:
To provide a liquid processing apparatus capable of processing substrates with a high throughput with the lesser number of nozzles for chemical-liquid, when the substrates that are horizontally held in cup bodies are liquid-processed by supplying a chemical liquid to the substrates. Taking a developing process as an example of a liquid process, two-types of developing nozzles are prepared for two types of developing methods. The developing nozzle, which is used in the method in which the nozzle is engaged with the process for a longer period of time, is individually disposed on each of a first processing module 1 and a second processing module 2. On the other hand, the developing nozzle, which is used in the method in which the nozzle is engaged with the process for a shorter period of time, is used in common in the first liquid processing module 1 and the second liquid processing module 2. The common developing nozzle is configured to wait on an intermediate position between the modules 1 and 2.
摘要:
A boron trifluoride complex can be recovered without changing its molar coordination ratio, by applying a direct and/or alternating voltage to an electrically-nonconductive fluid in which at least a part of boron trifluoride complex is dispersed and/or dissolved, and separating the boron trifluoride complex by settling from the electrically-nonconductive fluid. By utilizing this method for the preparation of olefin oligomer using a boron trifluoride complex catalyst, it is possible to reuse the recovered catalyst as it stands for the reaction.
摘要:
In designing a printed circuit board, first and second copies of views of first and second major surfaces of the board respectively, are created. The first and second copies are positioned to contact each other. First and second segments on a side of the printed circuit board and normal to a first element in the first copy and a second element in the second copy respectively are obtained. A third segment joining ends of the first and second segments is obtained, and a point dividing the third segment according to a ratio of a distance from the first element to the side and a distance from the second element to the side is calculated. Distances from the first element to the point and from the point to the second element are calculated, and a creepage distance, a sum of the two distances and a thickness of the board, is obtained.