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公开(公告)号：US09295155B2
公开(公告)日：2016-03-22
申请号：US13590908
申请日：2012-08-21
申请人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
发明人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
CPC分类号： H05K1/118 , H05K1/0281 , H05K1/117 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/2009
摘要： A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.
摘要翻译： 柔性印刷电路板包括基材，第一导电焊盘沿着假想线布置在基体材料上并且沿着假想线的前侧从前端到后端的第一宽度延伸，沿假想线布置的第二导电焊盘 并且以假想线的后侧的前端延伸到第二宽度，第一布线图案设置在第二导电焊盘之间，并且第三宽度延伸到连接到第一导电焊盘的后端的前端 ，以及用于加强第一导电焊盘和第一布线图案上的加强区域的加强层，并且在第一导电焊盘的后端的前侧具有前边缘，在后端的后侧具有后边缘 的第二导电焊盘。
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公开(公告)号：US08233286B2
公开(公告)日：2012-07-31
申请号：US11905317
申请日：2007-09-28
申请人： Naoki Nakamura , Shigeru Sugino , Ryo Kanai
发明人： Naoki Nakamura , Shigeru Sugino , Ryo Kanai
摘要： Terminal pads are arranged on a first surface of the substrate for an electronic component to receive terminals of the electronic component. An electrically-conductive film is formed on a second surface defined on the back of the first surface over the back of a mounting area for the electronic component. The mounting area is contoured along the outer periphery of the arrangement of the terminal pads. The ratio of the area of the electrically-conductive material to the area of the surface of the substrate over the back of the mounting area is set appropriate to the ratio of the area of the electrically-conductive material to the area of the surface of the substrate over the mounting area for each electronic component. This results in suppression of flexure of the printed wiring board during reflow.
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公开(公告)号：US20120312586A1
公开(公告)日：2012-12-13
申请号：US13590908
申请日：2012-08-21
申请人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
发明人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
IPC分类号： H05K1/00
CPC分类号： H05K1/118 , H05K1/0281 , H05K1/117 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/2009
摘要： A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.
摘要翻译： 柔性印刷电路板包括基材，第一导电焊盘沿着假想线布置在基体材料上并且沿着假想线的前侧从前端到后端的第一宽度延伸，沿假想线布置的第二导电焊盘 并且以假想线的后侧的前端延伸到第二宽度，第一布线图案设置在第二导电焊盘之间，并且第三宽度延伸到连接到第一导电焊盘的后端的前端 ，以及用于加强第一导电焊盘和第一布线图案上的加强区域的加强层，并且在第一导电焊盘的后端的前侧具有前边缘，在后端的后侧具有后边缘 的第二导电焊盘。
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4.发明授权Printed wiring board reliably achieving electric connection with electronic component 有权印刷电路板可靠地实现与电子部件的电连接公开(公告)号：US08305767B2
公开(公告)日：2012-11-06
申请号：US11905317
申请日：2007-09-28
申请人： Naoki Nakamura , Shigeru Sugino , Ryo Kanai
发明人： Naoki Nakamura , Shigeru Sugino , Ryo Kanai
CPC分类号： H05K1/0271 , H05K3/28 , H05K3/3415 , H05K3/3452 , H05K2201/068 , H05K2201/09136 , H05K2201/09363 , H05K2201/09781 , H05K2203/0588 , H05K2203/1572 , Y10T29/4913 , Y10T29/49147
摘要： Terminal pads are arranged on a first surface of the substrate for an electronic component to receive terminals of the electronic component. An electrically-conductive film is formed on a second surface defined on the back of the first surface over the back of a mounting area for the electronic component. The mounting area is contoured along the outer periphery of the arrangement of the terminal pads. The ratio of the area of the electrically-conductive material to the area of the surface of the substrate over the back of the mounting area is set appropriate to the ratio of the area of the electrically-conductive material to the area of the surface of the substrate over the mounting area for each electronic component. This results in suppression of flexure of the printed wiring board during reflow.
摘要翻译： 端子焊盘被布置在用于电子部件的基板的第一表面上以接收电子部件的端子。 在电子部件的安装区域的背面上的第一表面的背面上的第二表面上形成导电膜。 安装区域沿着端子焊盘的布置的外周形成轮廓。 导电材料的面积与安装区域背面的基板表面的面积的比率被设定为适合于导电材料的面积与表面的面积之比 基板在每个电子部件的安装区域上。 这导致在回流期间抑制印刷线路板的挠曲。
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公开(公告)号：US20100212938A1
公开(公告)日：2010-08-26
申请号：US12698635
申请日：2010-02-02
申请人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
发明人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
IPC分类号： H05K1/02
CPC分类号： H05K1/118 , H05K1/0281 , H05K1/117 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/2009
摘要： A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.
摘要翻译： 柔性印刷电路板包括基材，第一导电焊盘沿着假想线布置在基体材料上并且沿着假想线的前侧从前端到后端的第一宽度延伸，沿假想线布置的第二导电焊盘 并且以假想线的后侧的前端延伸到第二宽度，第一布线图案设置在第二导电焊盘之间，并且第三宽度延伸到连接到第一导电焊盘的后端的前端 ，以及用于加强第一导电焊盘和第一布线图案上的加强区域的加强层，并且在第一导电焊盘的后端的前侧具有前边缘，在后端的后侧具有后边缘 的第二导电焊盘。
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公开(公告)号：US08269114B2
公开(公告)日：2012-09-18
申请号：US12698635
申请日：2010-02-02
申请人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
发明人： Naoki Nakamura , Shigeru Sugino , Nobuo Taketomi , Ryo Kanai
IPC分类号： H05K1/00
CPC分类号： H05K1/118 , H05K1/0281 , H05K1/117 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/2009
摘要： A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.
摘要翻译： 柔性印刷电路板包括基材，第一导电焊盘沿着假想线布置在基体材料上并且沿着假想线的前侧从前端到后端的第一宽度延伸，沿假想线布置的第二导电焊盘 并且以假想线的后侧的前端延伸到第二宽度，第一布线图案设置在第二导电焊盘之间，并且第三宽度延伸到连接到第一导电焊盘的后端的前端 ，以及用于加强第一导电焊盘和第一布线图案上的加强区域的加强层，并且在第一导电焊盘的后端的前侧具有前边缘，在后端的后侧具有后边缘 的第二导电焊盘。
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7.发明申请Printed wiring board reliably achieving electric connection with electronic component 有权印刷电路板可靠地实现与电子部件的电连接公开(公告)号：US20080080153A1
公开(公告)日：2008-04-03
申请号：US11905317
申请日：2007-09-28
申请人： Naoki Nakamura , Shigeru Sugino , Ryo Kanai
发明人： Naoki Nakamura , Shigeru Sugino , Ryo Kanai
CPC分类号： H05K1/0271 , H05K3/28 , H05K3/3415 , H05K3/3452 , H05K2201/068 , H05K2201/09136 , H05K2201/09363 , H05K2201/09781 , H05K2203/0588 , H05K2203/1572 , Y10T29/4913 , Y10T29/49147
摘要： Terminal pads are arranged on a first surface of the substrate for an electronic component to receive terminals of the electronic component. An electrically-conductive film is formed on a second surface defined on the back of the first surface over the back of a mounting area for the electronic component. The mounting area is contoured along the outer periphery of the arrangement of the terminal pads. The ratio of the area of the electrically-conductive material to the area of the surface of the substrate over the back of the mounting area is set appropriate to the ratio of the area of the electrically-conductive material to the area of the surface of the substrate over the mounting area for each electronic component. This results in suppression of flexure of the printed wiring board during reflow.
摘要翻译： 端子焊盘被布置在用于电子部件的基板的第一表面上以接收电子部件的端子。 在电子部件的安装区域的背面上的第一表面的背面上的第二表面上形成导电膜。 安装区域沿着端子焊盘的布置的外周形成轮廓。 导电材料的面积与安装区域背面的基板表面的面积的比率被设定为适合于导电材料的面积与表面的面积之比 基板在每个电子部件的安装区域上。 这导致在回流期间抑制印刷线路板的挠曲。
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8.发明授权公开(公告)号：US07187956B2
公开(公告)日：2007-03-06
申请号：US10245901
申请日：2002-09-17
申请人： Shigeru Sugino , Kouji Saitou , Toshiya Inubushi , Shushin Noda , Koji Nasu , Tomohiko Kamimura
发明人： Shigeru Sugino , Kouji Saitou , Toshiya Inubushi , Shushin Noda , Koji Nasu , Tomohiko Kamimura
IPC分类号： H04M1/00
CPC分类号： H04M1/19 , H04M1/0214
摘要： In a portable communication apparatus of the invention, an inner wall (22) of an openable/closable member (2) faces the front face of a diaphragm of a close-talking microphone (5) via a sound path (64), and an outer sound hole (27) faces the rear face of the diaphragm of the close-talking microphone (5) via a sound path (65). An inner sound hole (26) is biasedly located in a position which is close to a free end of the openable/closable member (2), and the outer sound hole (27) is biasedly located in a position which is close to the center position of opening and closing movements of the openable/closable member (2), thereby obtaining a speech quality of a very high S/N ratio at a substantially same degree in both the cases where the openable/closable member (2) is opened, and where the member is closed.
摘要翻译： 在本发明的便携式通信装置中，可打开/关闭构件（2）的内壁（22）经由声音路径（64）面对致密麦克风（5）的隔膜的前面，并且 外部声孔（27）通过声音路径（65）面向致密麦克风（5）的隔膜的后表面。 内部声音孔（26）被偏置地位于靠近可开启/关闭构件（2）的自由端的位置，并且外部声音孔（27）被偏置地位于接近中心的位置 可打开/关闭构件（2）的打开和关闭运动的位置，从而在可打开/关闭构件（2）打开的情况下以基本相同的程度获得非常高的S / N比的语音质量， 会员关闭的地方。
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公开(公告)号：US5704738A
公开(公告)日：1998-01-06
申请号：US649479
申请日：1996-05-17
申请人： Shigeru Sugino , Kazuyuki Ishikawa
发明人： Shigeru Sugino , Kazuyuki Ishikawa
CPC分类号： B23B31/083 , Y10T279/17017 , Y10T279/17965 , Y10T408/03 , Y10T408/95
摘要： A tool attachment assembly having a housing with a central axis, a toolholder with a tool carrying portion and a mounting portion spaced axially from the tool carrying portion, a projection on one of the housing and mounting portion of the tool holder, and a receptacle on the other of the housing and mounting portion of the tool holder for receiving the projection so that the housing and the tool holder reside at least partially, one within the other, with the tool holder in an operative state on the housing. There are axially facing first and second surfaces, one each on the housing and the mounting portion of the tool holder, that extend at least partially around the central axis and are abuttable to each other to limit movement of the tool holder axially towards the housing with the tool holder in the operative state. At least one of the first and second surfaces is other than parallel to a plane that is orthogonal to the central axis.
摘要翻译： 具有具有中心轴线的壳体的工具附接组件，具有工具承载部分的工具架和与所述工具承载部分轴向间隔开的安装部分，在所述工具架的壳体和安装部分之一上的突起，以及 用于接收突起的工具架的壳体和安装部分中的另一个，使得壳体和工具架至少部分地位于另一个内部，工具保持器处于壳体上的操作状态。 具有轴向面对的第一和第二表面，每个在壳体上和工具保持器的安装部分上，其至少部分地围绕中心轴线延伸并且彼此抵靠以限制工具保持器轴向朝向壳体的移动， 工具架处于工作状态。 第一和第二表面中的至少一个不同于平行于与中心轴线正交的平面。
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公开(公告)号：US5535496A
公开(公告)日：1996-07-16
申请号：US201889
申请日：1994-02-25
申请人： Shigeru Sugino , Masanori Nakagawa
发明人： Shigeru Sugino , Masanori Nakagawa
CPC分类号： B08B3/02 , B23Q1/0018 , B23Q11/1084 , B23Q39/02 , B05B1/1645 , B23Q2220/002 , Y10T29/5154 , Y10T408/37 , Y10T408/44 , Y10T409/304032 , Y10T483/1707
摘要： A machine tool having a frame, a turret on the frame having a spindle for holding an operating tool, structure on at least one of the frame and turret for operating the spindle to effect machining of a workpiece by an operating tool held by the spindle, and first structure on at least one of the frame and turret for communicating fluid in a flow path from a pressurized supply to a workpiece to be machined by an operating tool held by the spindle to effect deburring/washing of the workpiece.
摘要翻译： 一种具有框架的机床，具有用于保持操作工具的主轴的框架上的转台，在所述框架和转台中的至少一个上的结构，用于操作所述主轴以通过由所述主轴保持的操作工具来对工件进行加工， 并且在至少一个框架和转台上的第一结构，用于在从由加压的供给到待加工的工件的流动路径中的流体通过由主轴保持的操作工具进行加工以实现工件的去毛刺/清洗。
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