公开(公告)号：US20230408342A1

公开(公告)日：2023-12-21

申请号：US17844758

申请日：2022-06-21

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： SHIANG-FENG TANG ,  SHUN-LUNG YEN ,  KUO-JEN CHANG ,  HSIN-CHANG CHEN

IPC: G01J5/80 ,  G01J5/02

CPC classification number: G01J5/808 ,  G01J5/0205 ,  G01J2005/0077

Abstract: A temperature measurement calibration method without interference of a shutter of a thermal imaging module comprises steps: at a temperature of a core chip of a thermal imaging module, obtaining a response value generated by measuring a blackbody temperature after the shutter is started at a frame time; performing a linear regression analysis of the response value to obtain a correction response value equation; inputting the response value into the correction response value equation; and obtaining a correction response value of measuring the blackbody temperature.

公开(公告)号：US20230314238A1

公开(公告)日：2023-10-05

申请号：US17707997

申请日：2022-03-30

Applicant: National Chung Shan Institute of Science and Technology

Inventor： SHIANG-FENG TANG ,  SHUN-LUNG YEN ,  KUO-JEN CHANG ,  HSIN-CHANG CHEN

IPC: G01K1/20 ,  G01J5/53 ,  G01K11/30

CPC classification number: G01K1/20 ,  G01J5/53 ,  G01K11/30

Abstract: A method of stabilizing temperature sensing in presence of temperature-sensing component temperature variation includes steps of: obtaining response value caused by black body at first temperature of a thermal imager core chip; obtaining high-temperature first-order linear function of high-temperature black body response value versus thermal imager core chip temperature; obtaining low-temperature first-order linear function of low-temperature black body response value versus thermal imager core chip temperature; obtaining response value of high-temperature first-order linear function at first temperature, response value of high-temperature first-order linear function at second temperature of the thermal imager core chip, response value of low-temperature first-order linear function at first temperature, response value of low-temperature first-order linear function at second temperature, and response value of black body and substituting the five values into an equation for correcting the response values; and obtaining instant corrected value of the response value of the black body.

公开(公告)号：US20240418578A1

公开(公告)日：2024-12-19

申请号：US18333566

申请日：2023-06-13

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： SHIANG-FENG TANG ,  SHUN-LUNG YEN ,  KUO-JEN CHANG ,  HSIN-CHANG CHEN

IPC: G01K11/00 ,  G01K1/022

Abstract: An accurate temperature measurement structure of a wide temperature range includes: a lens set; an optical base, having a neutral density slot and being fixed with the lens set by a first screw; a mask shutter assembly, fixed with the optical base by a second screw; and a temperature sensing unit, for sensing a target object temperature so as to obtain a measured temperature value, the temperature sensing unit performing a temperature normalization correction when the accurate temperature measurement structure of the wide temperature range is in a power-on stage to obtain a signal strength value, setting a plurality of signal conditions according to the signal strength value to obtain a dynamic linearity strength value and accordingly determining an extreme value region, so as to determine whether to add a neutral density filter to the neutral density slot.

公开(公告)号：US20210190596A1

公开(公告)日：2021-06-24

申请号：US17124523

申请日：2020-12-17

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： SHIANG-FENG TANG ,  SHUN-LUNG YEN ,  KUN-CHI LO ,  WEN-JEN LIN

IPC: G01J5/02

Abstract: A high-precision non-contact temperature measurement device includes: a thermal insulation box made of a thermal insulation material and having therein a receiving space; a dynamic constant-temperature feedback control module for controlling temperature of the receiving space; and a non-temperature-sensing thermal imager disposed in the receiving space. The device achieves system thermal insulation within a non-contact temperature measurement gauge, maintains the overall closed system dynamically at constant temperature, compensates for effects of internal chip self-heating effect and visual field background temperature variation, and finally calculates average temperature of surfaces of a target precisely with an imaging, non-contact temperature measurement gauge and a temperature calibration algorithm widely used in thermal-imaging non-contact temperature measurement.