公开(公告)号：US20240096769A1

公开(公告)日：2024-03-21

申请号：US18467779

申请日：2023-09-15

申请人： NEXPERIA B.V.

发明人： Haibo Fan ,  Zhou Zhou ,  Chi Ho Leung

IPC分类号： H01L23/495 ,  H01L21/48

CPC分类号： H01L23/49582 ,  H01L21/4821 ,  H01L21/561

摘要： The disclosure provides a method for manufacturing a semiconductor package assembly, which results in a semiconductor package assembly with a more even distributed stress concentrations, reduced solder crack occurrences and limited solder filler joint connections.

公开(公告)号：US10658274B2

公开(公告)日：2020-05-19

申请号：US16221723

申请日：2018-12-17

申请人： NEXPERIA B.V.

发明人： Tim Boettcher ,  Haibo Fan ,  Wai Wong Chow ,  Pompeo V. Umali ,  Shun Tik Yeung ,  Chi Ho Leung

IPC分类号： H01L21/00 ,  H01L23/495 ,  H01L23/00

摘要： An electronic device including a die and at least one lead. The electronic device further includes a corresponding at least one connector, each connector for connecting the die to a corresponding lead or leads, and each connector having a first end disposed in bondable proximity to a complementary surface of the corresponding lead and a second end disposed in bondable proximity to a complementary surface of the die. An end portion of at least one of the first end and second end has a formation, the formation in combination with the complementary surface of one, or both, of the respective lead or the die defining therebetween a first region and at least a second region configured to attract by capillary action an electrically conductive bonding material to consolidate therein.

公开(公告)号：US10825757B2

公开(公告)日：2020-11-03

申请号：US15382805

申请日：2016-12-19

申请人： Nexperia B.V.

发明人： Haibo Fan ,  Pompeo v Umali ,  Tim Boettcher ,  Wai Wong Chow

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00

摘要： Various example embodiments concern an integrated circuit (IC) package having a clip with a protruding tough-shaped finger portion. The clip can be used in various IC packages including, for example, soft-soldered compact power packages such as rectifiers with specified surge current capability. Such embodiments can be implemented to allow for a visual inspection capability of the soldering area for connecting a lead frame, via the clip, to a surface of the IC package die, while still providing sufficient thermal mass to limit the temperature increase during forward surge current loads. This results in a simple to manufacture design without compromising too much on performance.

公开(公告)号：US20230154883A1

公开(公告)日：2023-05-18

申请号：US17990230

申请日：2022-11-18

申请人： NEXPERIA B.V.

发明人： Ricardo Yandoc ,  Adam Brown ,  Haibo Fan

IPC分类号： H01L23/00

CPC分类号： H01L24/40 ,  H01L24/37 ,  H01L24/05 ,  H01L24/84 ,  H01L2224/04034 ,  H01L2224/40225 ,  H01L2224/37005 ,  H01L2924/13063 ,  H01L2924/13064 ,  H01L2224/84

摘要： A semiconductor package including a semiconductor die having multiple bond pads is provided. The package further includes an electrically conducting clip including, at a first side thereof, at least one pin for mounting the package to an external board and includes, at a second side opposite to the first side, a connecting portion connecting the clip to at least two bond pads of the multiple bond pads. The connection portion includes at least two elongated connecting strips spaced apart from each other at a distance in such a manner that each strip extends over at least one of the at least two bond pads and is connected thereto.

公开(公告)号：US11728179B2

公开(公告)日：2023-08-15

申请号：US16111470

申请日：2018-08-24

申请人： NEXPERIA B.V.

发明人： Ricardo Yandoc ,  Adam Richard Brown ,  Haibo Fan ,  Kow Siew Ting ,  Nam Khong Then ,  Wei Leong Tan

IPC分类号： H01L23/49 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L21/4842 ,  H01L21/4825 ,  H01L21/4839 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49582

摘要： A surface mount semiconductor device and method of manufacture. A semiconductor die is mounted on a first support surface; a leadframe is attached to the semiconductor die, the leadframe comprising: an electrical lead having a first lead region connected to the semiconductor die; and a second lead region distal the first lead region, wherein the second lead region is connected to a second support surface; encapsulating the semiconductor die, first support surface and the first lead region; the second lead region is severed from the second support surface to expose a lead end; and the second lead region is electro-plated with a metallic material, such that the lead end is coated with said metallic material.

公开(公告)号：US20230146666A1

公开(公告)日：2023-05-11

申请号：US17982619

申请日：2022-11-08

申请人： NEXPERIA B.V.

发明人： Zhou Zhou ,  Haibo Fan ,  Chi Ho Leung

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L23/49555 ,  H01L21/56 ,  H01L24/32

摘要： An electronic package and method for manufacturing is provided. The package includes an electronic component having a terminal, a solidified molding compound encapsulating the electronic component, a lead including an inner and a mounting portion. The molding compound includes a first recess at or near a perimeter of a bottom surface of the mounting portion, exposing a portion of a bottom surface of the inner portion arranged near the mounting portion, and/or a second recess at the perimeter of the bottom surface of the mounting portion, the second recess exposing a portion of a side surface of the mounting portion extending between the top and the bottom surface of the mounting portion. The package provides more exposed lead space for a larger solder covering area using the first and/or second recess. Thus, solder strain accumulation is reduced or mitigated, and reliability of the electronic package can be enhanced.

公开(公告)号：US20180174951A1

公开(公告)日：2018-06-21

申请号：US15382805

申请日：2016-12-19

申请人： Nexperia B.V.

发明人： Haibo Fan ,  Pompeo v. Umali ,  Tim Boettcher ,  Wai Wong Chow

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/48

摘要： Various example embodiments concern an integrated circuit (IC) package having a clip with a protruding tough-shaped finger portion. The clip can be used in various IC packages including, for example, soft-soldered compact power packages such as rectifiers with specified surge current capability. Such embodiments can be implemented to allow for a visual inspection capability of the soldering area for connecting a lead frame, via the clip, to a surface of the IC package die, while still providing sufficient thermal mass to limit the temperature increase during forward surge current loads. This results in a simple to manufacture design without compromising too much on performance.