Device interface board with cavity back for very high frequency applications
    2.
    发明授权
    Device interface board with cavity back for very high frequency applications 有权
    器件接口板,具有空腔背面,适用于非常高频率的应用

    公开(公告)号:US08461855B2

    公开(公告)日:2013-06-11

    申请号:US12572955

    申请日:2009-10-02

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2889

    摘要: In one embodiment, a device interface board is provided which includes a printed circuit board with a DUT interface structure, such as socket, associated with a DUT side of the printed circuit board. A high frequency connector and electronic component are mounted in a cavity formed in a back side of the printed circuit board. A signal via through the printed circuit board couples the high frequency connector and electronic component with the DUT interface structure. An encapsulating structure may be provided, which covers the cavity while allowing a cable to connect to the high frequency connector.

    摘要翻译: 在一个实施例中,提供了一种设备接口板,其包括具有DUT接口结构的印刷电路板,例如与印刷电路板的DUT侧相关联的插座。 高频连接器和电子部件安装在形成在印刷电路板的背面的空腔中。 通过印刷电路板的信号通孔将高频连接器和电子部件与DUT接口结构耦合。 可以提供封装结构,该封装结构覆盖空腔,同时允许电缆连接到高频连接器。

    Device Interface Board with Cavity Back for Very High Frequency Applications
    3.
    发明申请
    Device Interface Board with Cavity Back for Very High Frequency Applications 有权
    器件接口板,带有空腔返回,适用于超高频应用

    公开(公告)号:US20110080187A1

    公开(公告)日:2011-04-07

    申请号:US12572955

    申请日:2009-10-02

    IPC分类号: G01R31/26

    CPC分类号: G01R31/2889

    摘要: In one embodiment, a device interface board is provided which includes a printed circuit board with a DUT interface structure, such as socket, associated with a DUT side of the printed circuit board. A high frequency connector and electronic component are mounted in a cavity formed in a back side of the printed circuit board. A signal via through the printed circuit board couples the high frequency connector and electronic component with the DUT interface structure. An encapsulating structure may be provided, which covers the cavity while allowing a cable to connect to the high frequency connector.

    摘要翻译: 在一个实施例中,提供了一种设备接口板,其包括具有DUT接口结构的印刷电路板,例如与印刷电路板的DUT侧相关联的插座。 高频连接器和电子部件安装在形成在印刷电路板的背面的空腔中。 通过印刷电路板的信号通孔将高频连接器和电子部件与DUT接口结构耦合。 可以提供封装结构,该封装结构覆盖空腔,同时允许电缆连接到高频连接器。