摘要:
The invention includes methods of forming metal silicide. A layer consisting essentially of one or more metal nitrides is formed directly against a silicon-containing region. A layer comprising one or more metals is formed over the one or more metal nitrides. Silicon is transferred from the silicon-containing region, through the one or more metal nitrides, and to the one or more metals to convert at least some of the one or more metals into metal silicides. In particular aspects, titanium is formed over tantalum nitride, and the silicon is transferred into the titanium to convert the titanium into titanium silicide. The invention also includes semiconductor constructions having a layer consisting essentially of titanium silicide directly against a layer consisting essentially of tantalum nitride.
摘要:
The present invention provides atomic layer deposition systems and methods that include at least one compound of the formula (Formula I): Ta(NR1)(NR2R3)3, wherein each R1, R2, and R3 is independently hydrogen or an organic group, with the proviso that at least one of R1, R2, and R3 is a silicon-containing organic group. Such systems and methods can be useful for depositing tantalum silicon nitride layers on substrates.
摘要:
The invention includes deposition apparatuses configured to monitor the temperature of a semiconductor wafer substrate by utilizing conduits which channel radiation from the substrate to a detector/signal processor system. In particular aspects, the temperature of the substrate can be measured while the substrate is spinning within a reaction chamber. The invention also includes deposition apparatuses in which flow of mixed gases is controlled by mass flow controllers provided downstream of the location where the gases are mixed and/or where flow of gases is measured with mass flow measurement devices provided downstream of the location where the gases are mixed. Additionally, the invention encompasses deposition apparatuses in which mass flow controllers and/or mass flow measurement devices are provided upstream of a header which splits a source gas into multiple paths directed toward multiple different reaction chambers.
摘要:
The present invention provides atomic layer deposition systems and methods that include at least one compound of the formula (Formula I): Ta(NR1)(NR2R3)3, wherein each R1, R2, and R3 is independently hydrogen or an organic group, with the proviso that at least one of R1, R2, and R3 is a silicon-containing organic group. Such systems and methods can be useful for depositing tantalum silicon nitride layers on substrates.
摘要:
The present invention is generally directed to a method of forming a pseudo SOI substrate and semiconductor devices. In one illustrative embodiment, the method comprises forming a plurality of trenches in a semiconducting substrate comprised of silicon, each of the trenches having a depth, forming a layer of insulating material within each of the plurality of trenches, the layer of insulating material having a thickness that is less than the depth of the trenches, and performing an anneal process on the substrate in a hydrogen environment to cause the silicon substrate material to merge above the layer of insulating material within the plurality of trenches to thereby define a pseudo SOI substrate.
摘要:
This invention includes substrate susceptors which receive substrates to be deposited upon. In one implementation, a substrate susceptor includes a body having a substrate receiving side. The substrate receiving side has a face having a substrate receiving recess formed therein. The recess has an outer peripheral sidewall. At least three projections extend outwardly from a portion of the face. The projections respectively comprise a radially inner sidewall which extends outwardly from the recess outer peripheral sidewall to a projection upper surface. Other aspects and implementations are contemplated.
摘要:
This invention includes substrate susceptors which receive substrates to be deposited upon. In one implementation, a substrate susceptor includes a body having a substrate receiving side. The substrate receiving side has a face having a substrate receiving recess formed therein. The recess has an outer peripheral sidewall. At least three projections extend outwardly from a portion of the face. The projections respectively comprise a radially inner sidewall which extends outwardly from the recess outer peripheral sidewall to a projection upper surface. Other aspects and implementations are contemplated.
摘要:
The invention includes deposition apparatuses configured to monitor the temperature of a semiconductor wafer substrate by utilizing conduits which channel radiation from the substrate to a detector/signal processor system. In particular aspects, the temperature of the substrate can be measured while the substrate is spinning within a reaction chamber. The invention also includes deposition apparatuses in which flow of mixed gases is controlled by mass flow controllers provided downstream of the location where the gases are mixed and/or where flow of gases is measured with mass flow measurement devices provided downstream of the location where the gases are mixed. Additionally, the invention encompasses deposition apparatuses in which mass flow controllers and/or mass flow measurement devices are provided upstream of a header which splits a source gas into multiple paths directed toward multiple different reaction chambers.
摘要:
The invention includes methods of depositing elemental silicon-comprising materials over a semiconductor substrate, and methods of cleaning an internal wall of a chamber. In one implementation, a semiconductor substrate is positioned within a chamber for deposition. The chamber comprises an infrared radiation transparent wall. An elemental silicon-comprising material is deposited on the semiconductor substrate. During such depositing, a deposit is formed on the infrared radiation transparent wall within the chamber. After such depositing, a plasma is generated within the chamber with a cleaning gas from at least one plasma generating electrode received external of the chamber proximate the infrared radiation transparent wall effective to remove at least some of the deposit from the infrared radiation transparent wall within the chamber. Other aspects and implementations are contemplated.
摘要:
The present invention provides atomic layer deposition systems and methods that include at least one compound of the formula (Formula I): Ta(NR1)(NR2R3)3, wherein each R1, R2, and R3 is independently hydrogen or an organic group, with the proviso that at least one of R1, R2, and R3 is a silicon-containing organic group. Such systems and methods can be useful for depositing tantalum silicon nitride layers on substrates.