公开(公告)号：US06995315B2

公开(公告)日：2006-02-07

申请号：US11140250

申请日：2005-05-27

申请人： Nirmal Sharma ,  Richard Dickinson ,  Michael Doogue ,  Jay Gagnon

发明人： Nirmal Sharma ,  Richard Dickinson ,  Michael Doogue ,  Jay Gagnon

IPC分类号： H01L23/02

CPC分类号： G01R15/202 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. A current conductor portion can be deposited on a surface of the substrate proximate to the one or more magnetic field sensors. With this arrangement, a current sensor is provided for which the one or more magnetic field transducers are very close to the current conductor portion, resulting in a current sensor having improved sensitivity.

摘要翻译： 集成电路电流传感器包括具有耦合以提供电流导体部分的至少两个引线的引线框架，以及具有第一表面的基板，其中设置有一个或多个磁场换能器，其中第一表面接近电流导体部分， 远离电流导体部分的第二表面。 在一个具体实施例中，衬底被布置成具有衬底的第一表面在电流导体部分上方，衬底的第二表面在第一表面之上。 在该特定实施例中，相对于传统的方向，衬底在集成电路中被上下颠倒。 电流导体部分可以沉积在靠近一个或多个磁场传感器的基板的表面上。 利用这种布置，提供了一个电流传感器，一个或多个磁场换能器非常接近电流导体部分，导致具有改进的灵敏度的电流传感器。

公开(公告)号：US20050248336A1

公开(公告)日：2005-11-10

申请号：US11140250

申请日：2005-05-27

申请人： Nirmal Sharma ,  Richard Dickinson ,  Michael Doogue ,  Jay Gagnon

发明人： Nirmal Sharma ,  Richard Dickinson ,  Michael Doogue ,  Jay Gagnon

IPC分类号： G01R15/20 ,  G01R33/00

CPC分类号： G01R15/202 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. A current conductor portion can be deposited on a surface of the substrate proximate to the one or more magnetic field sensors. With this arrangement, a current sensor is provided for which the one or more magnetic field transducers are very close to the current conductor portion, resulting in a current sensor having improved sensitivity.

摘要翻译： 集成电路电流传感器包括具有耦合以提供电流导体部分的至少两个引线的引线框架，以及具有第一表面的基板，其中设置有一个或多个磁场换能器，其中第一表面接近电流导体部分， 远离电流导体部分的第二表面。 在一个具体实施例中，衬底被布置成具有衬底的第一表面在电流导体部分上方，衬底的第二表面在第一表面之上。 在该特定实施例中，相对于传统的方向，衬底在集成电路中被上下颠倒。 电流导体部分可以沉积在靠近一个或多个磁场传感器的基板的表面上。 利用这种布置，提供了一个电流传感器，一个或多个磁场换能器非常接近电流导体部分，导致具有改进的灵敏度的电流传感器。

公开(公告)号：US20070279053A1

公开(公告)日：2007-12-06

申请号：US11776242

申请日：2007-07-11

申请人： William Taylor ,  John Cummings ,  Michael Doogue ,  Jay Gagnon ,  Vijay Mangtani ,  Nirmal Sharma

发明人： William Taylor ,  John Cummings ,  Michael Doogue ,  Jay Gagnon ,  Vijay Mangtani ,  Nirmal Sharma

IPC分类号： G01R33/02 ,  G01R33/07 ,  G01R33/09

CPC分类号： G01R33/07 ,  G01R1/18 ,  G01R15/207 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An integrated current sensor includes a current conductor, a magnetic field transducer, and an electromagnetic shield. The magnetic field transducer includes a sensor die. The electromagnetic shield is disposed proximate to the sensor die. The electromagnetic shield has at least one feature selected to reduce an eddy current in the electromagnetic shield.

摘要翻译： 集成电流传感器包括电流导体，磁场换能器和电磁屏蔽。 磁场换能器包括传感器模具。 电磁屏蔽设置在传感器芯片附近。 电磁屏蔽具有至少一个选择的特征以减少电磁屏蔽中的涡流。

公开(公告)号：US20060219436A1

公开(公告)日：2006-10-05

申请号：US11383021

申请日：2006-05-12

申请人： William Taylor ,  Michael Doogue ,  Nirmal Sharma ,  Jay Gagnon ,  Vijay Mangtani

发明人： William Taylor ,  Michael Doogue ,  Nirmal Sharma ,  Jay Gagnon ,  Vijay Mangtani

IPC分类号： H01L23/495

CPC分类号： G01R15/207 ,  G01R1/18 ,  G01R15/202 ,  H01L23/552 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The current sensor can also include an electromagnetic shield disposed between the current conductor portion and the magnetic field sensing elements.

摘要翻译： 集成电路电流传感器包括具有耦合以提供电流导体部分的至少两个引线的引线框架，以及具有第一表面的基板，其中设置有一个或多个磁场感测元件，其中第一表面接近电流 导体部分和远离电流导体部分的第二表面。 在一个具体实施例中，衬底被布置成具有衬底的第一表面在电流导体部分上方，衬底的第二表面在第一表面之上。 在该特定实施例中，基板以倒装置布置在集成电路中上下颠倒。 电流传感器还可以包括设置在电流导体部分和磁场感测元件之间的电磁屏蔽。

公开(公告)号：US20120013333A1

公开(公告)日：2012-01-19

申请号：US13241380

申请日：2011-09-23

申请人： Virgil Ararao ,  Nirmal Sharma ,  Raymond W. Engel ,  Jay Gagnon ,  John Sauber ,  William P. Taylor ,  Elsa Kam-Lum

发明人： Virgil Ararao ,  Nirmal Sharma ,  Raymond W. Engel ,  Jay Gagnon ,  John Sauber ,  William P. Taylor ,  Elsa Kam-Lum

IPC分类号： G01R33/02

CPC分类号： H01L43/02 ,  G01R33/0047 ,  G01R33/02 ,  H01L43/12 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10156 ,  H01L2924/1815 ,  H01L2924/00014

摘要： Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

摘要翻译： 制造磁场传感器的磁场传感器和相关联的方法包括模制结构，以封装磁场感测元件和相关联的引线框架的管芯附接垫并且还封装或形成磁体或集流器。

公开(公告)号：US08486755B2

公开(公告)日：2013-07-16

申请号：US12328798

申请日：2008-12-05

申请人： Virgil Ararao ,  Nirmal Sharma ,  Raymond W. Engel ,  Jay Gagnon ,  John Sauber ,  William P. Taylor ,  Elsa Kam-Lum

发明人： Virgil Ararao ,  Nirmal Sharma ,  Raymond W. Engel ,  Jay Gagnon ,  John Sauber ,  William P. Taylor ,  Elsa Kam-Lum

IPC分类号： H01L21/00

CPC分类号： H01L43/02 ,  G01R33/0047 ,  G01R33/02 ,  H01L43/12 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10156 ,  H01L2924/1815 ,  H01L2924/00014

摘要： Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

公开(公告)号：US20120086090A1

公开(公告)日：2012-04-12

申请号：US13325162

申请日：2011-12-14

申请人： Nirmal Sharma ,  Virgil Ararao ,  Leonardo T. Magpantay ,  Raymond W. Engel ,  William P. Taylor ,  Kirsten Doogue ,  Jay Gagnon

发明人： Nirmal Sharma ,  Virgil Ararao ,  Leonardo T. Magpantay ,  Raymond W. Engel ,  William P. Taylor ,  Kirsten Doogue ,  Jay Gagnon

IPC分类号： H01L29/82

CPC分类号： G01D11/245 ,  G01R33/07 ,  G01R33/09 ,  H01L23/49589 ,  H01L43/04 ,  H01L43/06 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Methods and apparatus provide a sensor including a component coupled to the leadframe such that the component is an integrated part of the IC package.

摘要翻译： 方法和装置提供一种包括耦合到引线框的部件的传感器，使得该部件是IC封装的集成部分。

公开(公告)号：US20080013298A1

公开(公告)日：2008-01-17

申请号：US11457626

申请日：2006-07-14

申请人： Nirmal Sharma ,  Virgil Ararao ,  Leonardo T. Magpantay ,  Raymond W. Engel ,  William P. Taylor ,  Kirsten Doogue ,  Jay Gagnon

发明人： Nirmal Sharma ,  Virgil Ararao ,  Leonardo T. Magpantay ,  Raymond W. Engel ,  William P. Taylor ,  Kirsten Doogue ,  Jay Gagnon

IPC分类号： H05K5/02

CPC分类号： G01D11/245 ,  G01R33/07 ,  G01R33/09 ,  H01L23/49589 ,  H01L43/04 ,  H01L43/06 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Methods and apparatus provide a sensor having an integrated component coupled to a leadframe. In one embodiment, a sensor includes external leads on an opposite side of a die from the integrated component. In another embodiment, a leadframe includes a slot to reduce eddy currents.

摘要翻译： 方法和装置提供具有耦合到引线框架的集成部件的传感器。 在一个实施例中，传感器包括在与集成部件相对的模具的相对侧上的外部引线。 在另一实施例中，引线框架包括用于减小涡流的槽。

公开(公告)号：US09228860B2

公开(公告)日：2016-01-05

申请号：US13325162

申请日：2011-12-14

申请人： Nirmal Sharma ,  Virgil Ararao ,  Leonardo T. Magpantay ,  Raymond W. Engle ,  William P. Taylor ,  Kirsten Doogue ,  Jay Gagnon

发明人： Nirmal Sharma ,  Virgil Ararao ,  Leonardo T. Magpantay ,  Raymond W. Engle ,  William P. Taylor ,  Kirsten Doogue ,  Jay Gagnon

IPC分类号： H05K7/10 ,  H05K7/12 ,  G01D11/24 ,  G01R33/07 ,  H01L23/495

CPC分类号： G01D11/245 ,  G01R33/07 ,  G01R33/09 ,  H01L23/49589 ,  H01L43/04 ,  H01L43/06 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Methods and apparatus for a magnetic field sensor in a molded IC package having a magnetic field sensing element in a die with a component coupled to a leadframe at a downset area. In embodiments, a thickness of the leadframe in the downset area is less than a thickness of the leadframe in a non-downset area adjacent to the downset area.

摘要翻译： 用于模制IC封装中的磁场传感器的方法和装置，其具有在模具中的磁场感测元件，其中组件耦合到在低压区域的引线框架。 在实施例中，在下降区域中的引线框架的厚度小于与凹陷区域相邻的非凹陷区域中的引线框架的厚度。

公开(公告)号：US08461677B2

公开(公告)日：2013-06-11

申请号：US13241380

申请日：2011-09-23

申请人： Virgil Ararao ,  Nirmal Sharma ,  Raymond W. Engel ,  Jay Gagnon ,  John Sauber ,  William P. Taylor ,  Elsa Kam-Lum

发明人： Virgil Ararao ,  Nirmal Sharma ,  Raymond W. Engel ,  Jay Gagnon ,  John Sauber ,  William P. Taylor ,  Elsa Kam-Lum

IPC分类号： H01L23/04

CPC分类号： H01L43/02 ,  G01R33/0047 ,  G01R33/02 ,  H01L43/12 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10156 ,  H01L2924/1815 ,  H01L2924/00014

摘要： Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

摘要翻译： 制造磁场传感器的磁场传感器和相关联的方法包括模制结构，以封装磁场感测元件和相关联的引线框架的管芯附接垫并且还封装或形成磁体或集流器。