公开(公告)号：US20130157200A1

公开(公告)日：2013-06-20

申请号：US13763232

申请日：2013-02-08

Applicant: Nitto Denko Corporation

Inventor： Yasushi TAMURA ,  Ryouji SUEZAKI ,  Tetsuya OHSAWA ,  Hiroyuki TANABE ,  Hitoki KANAGAWA

IPC: G03F7/20

CPC classification number: G03F7/2022 ,  G03F1/144 ,  G03F1/70 ,  G11B5/4846 ,  H05K1/056 ,  H05K3/0023 ,  H05K3/28 ,  H05K2201/0191 ,  H05K2203/0505 ,  H05K2203/0588 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.

Abstract translation: 具有电路的悬挂板包括金属支撑板，形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在绝缘基底层上以覆盖导电图案的绝缘覆盖层， 以及插入到E块中的插入部。 插入部中的绝缘覆盖层的厚度比除了插入部以外的部分的绝缘覆盖层的厚度大。