公开(公告)号：US07952071B2

公开(公告)日：2011-05-31

申请号：US12162071

申请日：2007-01-24

申请人： Nobuharu Noji ,  Yoshihiko Naito ,  Hirosi Sobukawa ,  Masahiro Hatakeyama ,  Kenji Terao ,  Takeshi Murakami ,  Katsuya Okumura ,  Tatsuhiko Higashiki

发明人： Nobuharu Noji ,  Yoshihiko Naito ,  Hirosi Sobukawa ,  Masahiro Hatakeyama ,  Kenji Terao ,  Takeshi Murakami ,  Katsuya Okumura ,  Tatsuhiko Higashiki

IPC分类号： G01N23/00

CPC分类号： H01J37/29 ,  H01J37/045 ,  H01J2237/2446

摘要： Provided is a defect inspection apparatus and an inspection (or evaluation) method with highly improved accuracy, which would not be provided by the prior art, in the defect inspection apparatus used in a manufacturing process of a semiconductor device.Provided is a method for inspecting a sample surface with a projection type electron beam inspection apparatus, comprising the steps of: forming such an irradiation area on the sample surface by an electron beam generated from an electron gun 21 that has approximately a circular or elliptical shape of a size larger than a pattern on the sample surface; irradiating the electron beam substantially onto a center of the pattern on the sample surface; and forming an image on an electron detection plane of a detector from secondary electrons emanating from the sample surface in response to the irradiation of the electron beam for inspecting the sample surface.

摘要翻译： 提供了在半导体器件的制造工艺中使用的缺陷检查装置中，现有技术不能提供高精度的缺陷检查装置和检查（或评价）方法。 提供一种用投影型电子束检查装置检查样品表面的方法，包括以下步骤：通过由具有大致圆形或椭圆形的电子枪21产生的电子束在样品表面上形成这样的照射区域 尺寸大于样品表面上的图案; 将电子束基本上照射到样品表面上的图案的中心; 以及响应于用于检查样品表面的电子束的照射，从从样品表面发射的二次电子在检测器的电子检测平面上形成图像。

公开(公告)号：US20090026368A1

公开(公告)日：2009-01-29

申请号：US12162071

申请日：2007-01-24

申请人： Nobuharu Noji ,  Yoshihiko Naito ,  Hirosi Sobukawa ,  Masahiro Hatakeyama ,  Kenji Terao ,  Takeshi Murakami ,  Katsuya Okumura ,  Tatsuhiko Higashiki

发明人： Nobuharu Noji ,  Yoshihiko Naito ,  Hirosi Sobukawa ,  Masahiro Hatakeyama ,  Kenji Terao ,  Takeshi Murakami ,  Katsuya Okumura ,  Tatsuhiko Higashiki

IPC分类号： G01N23/00

CPC分类号： H01J37/29 ,  H01J37/045 ,  H01J2237/2446

摘要： Provided is a defect inspection apparatus and an inspection (or evaluation) method with highly improved accuracy, which would not be provided by the prior art, in the defect inspection apparatus used in a manufacturing process of a semiconductor device.Provided is a method for inspecting a sample surface with a projection type electron beam inspection apparatus, comprising the steps of: forming such an irradiation area on the sample surface by an electron beam generated from an electron gun 21 that has approximately a circular or elliptical shape of a size larger than a pattern on the sample surface; irradiating the electron beam substantially onto a center of the pattern on the sample surface; and forming an image on an electron detection plane of a detector from secondary electrons emanating from the sample surface in response to the irradiation of the electron beam for inspecting the sample surface.

摘要翻译： 提供了在半导体器件的制造工艺中使用的缺陷检查装置中，现有技术不能提供高精度的缺陷检查装置和检查（或评价）方法。 提供一种用投影型电子束检查装置检查样品表面的方法，包括以下步骤：通过由具有大致圆形或椭圆形的电子枪21产生的电子束在样品表面上形成这样的照射区域 尺寸大于样品表面上的图案; 将电子束基本上照射到样品表面上的图案的中心; 以及响应于用于检查样品表面的电子束的照射，从从样品表面发射的二次电子在检测器的电子检测平面上形成图像。

公开(公告)号：US08525127B2

公开(公告)日：2013-09-03

申请号：US13398112

申请日：2012-02-16

申请人： Nobuharu Noji ,  Yoshihiko Naito ,  Hirosi Sobukawa ,  Kenji Terao ,  Masahiro Hatakeyama ,  Katsuya Okumura

发明人： Nobuharu Noji ,  Yoshihiko Naito ,  Hirosi Sobukawa ,  Kenji Terao ,  Masahiro Hatakeyama ,  Katsuya Okumura

IPC分类号： G21K5/10

CPC分类号： H01J37/265 ,  G01R31/307 ,  H01J37/04 ,  H01J2237/2441 ,  H01J2237/2446 ,  H01J2237/2594 ,  H01J2237/2817

摘要： Provided is a method and an apparatus for inspecting a sample surface with high accuracy. Provided is a method for inspecting a sample surface by using an electron beam method sample surface inspection apparatus, in which an electron beam generated by an electron gun of the electron beam method sample surface inspection apparatus is irradiated onto the sample surface, and secondary electrons emanating from the sample surface are formed into an image toward an electron detection plane of a detector for inspecting the sample surface, the method characterized in that a condition for forming the secondary electrons into an image on a detection plane of the detector is controlled such that a potential in the sample surface varies in dependence on an amount of the electron beam irradiated onto the sample surface.

摘要翻译： 提供了一种用于以高精度检查样品表面的方法和装置。 提供了一种使用电子束法样品表面检查装置检查样品表面的方法，其中由电子束法样品表面检查装置的电子枪产生的电子束照射到样品表面上，并且发射二次电子 从样品表面形成为检测样品表面的检测器的电子检测面的图像，其特征在于，将检测器的检测面上的二次电子形成为图像的条件进行控制，使得 样品表面的电位根据照射到样品表面上的电子束的量而变化。

公开(公告)号：US20120145921A1

公开(公告)日：2012-06-14

申请号：US13398112

申请日：2012-02-16

申请人： Nobuharu Noji ,  Yoshihiko Naito ,  Hirosi Sobukawa ,  Kenji Terao ,  Masahiro Hatakeyama ,  Katsuya Okumura

发明人： Nobuharu Noji ,  Yoshihiko Naito ,  Hirosi Sobukawa ,  Kenji Terao ,  Masahiro Hatakeyama ,  Katsuya Okumura

IPC分类号： G21K5/10

CPC分类号： H01J37/265 ,  G01R31/307 ,  H01J37/04 ,  H01J2237/2441 ,  H01J2237/2446 ,  H01J2237/2594 ,  H01J2237/2817

摘要： Provided is a method and an apparatus for inspecting a sample surface with high accuracy. Provided is a method for inspecting a sample surface by using an electron beam method sample surface inspection apparatus, in which an electron beam generated by an electron gun of the electron beam method sample surface inspection apparatus is irradiated onto the sample surface, and secondary electrons emanating from the sample surface are formed into an image toward an electron detection plane of a detector for inspecting the sample surface, the method characterized in that a condition for forming the secondary electrons into an image on a detection plane of the detector is controlled such that a potential in the sample surface varies in dependence on an amount of the electron beam irradiated onto the sample surface.

摘要翻译： 提供了一种用于以高精度检查样品表面的方法和装置。 提供了一种使用电子束法样品表面检查装置检查样品表面的方法，其中由电子束法样品表面检查装置的电子枪产生的电子束照射到样品表面上，并且发射二次电子 从样品表面形成为检测样品表面的检测器的电子检测面的图像，其特征在于，将检测器的检测面上的二次电子形成为图像的条件进行控制，使得 样品表面的电位根据照射到样品表面上的电子束的量而变化。

公开(公告)号：US08859984B2

公开(公告)日：2014-10-14

申请号：US13954425

申请日：2013-07-30

申请人： Nobuharu Noji ,  Yoshihiko Naito ,  Hirosi Sobukawa ,  Kenji Terao ,  Masahiro Hatakeyama ,  Katsuya Okumura

发明人： Nobuharu Noji ,  Yoshihiko Naito ,  Hirosi Sobukawa ,  Kenji Terao ,  Masahiro Hatakeyama ,  Katsuya Okumura

IPC分类号： G01N23/00

CPC分类号： H01J37/265 ,  G01R31/307 ,  H01J37/04 ,  H01J2237/2441 ,  H01J2237/2446 ,  H01J2237/2594 ,  H01J2237/2817

摘要： Provided is a method and an apparatus for inspecting a sample surface with high accuracy. Provided is a method for inspecting a sample surface by using an electron beam method sample surface inspection apparatus, in which an electron beam generated by an electron gun of the electron beam method sample surface inspection apparatus is irradiated onto the sample surface, and secondary electrons emanating from the sample surface are formed into an image toward an electron detection plane of a detector for inspecting the sample surface, the method characterized in that a condition for forming the secondary electrons into an image on a detection plane of the detector is controlled such that a potential in the sample surface varies in dependence on an amount of the electron beam irradiated onto the sample surface.

摘要翻译： 提供了一种用于以高精度检查样品表面的方法和装置。 提供了一种使用电子束法样品表面检查装置检查样品表面的方法，其中由电子束法样品表面检查装置的电子枪产生的电子束照射到样品表面上，并且发射二次电子 从样品表面形成为检测样品表面的检测器的电子检测面的图像，其特征在于，将检测器的检测面上的二次电子形成为图像的条件进行控制，使得 样品表面的电位根据照射到样品表面上的电子束的量而变化。

公开(公告)号：US20090050802A1

公开(公告)日：2009-02-26

申请号：US12162067

申请日：2007-01-24

申请人： Nobuharu Noji ,  Yoshihiko Naito ,  Hirosi Sobukawa ,  Kenji Terao ,  Masahiro Hatakeyama ,  Katsuya Okumura

发明人： Nobuharu Noji ,  Yoshihiko Naito ,  Hirosi Sobukawa ,  Kenji Terao ,  Masahiro Hatakeyama ,  Katsuya Okumura

IPC分类号： G01N23/00

CPC分类号： H01J37/265 ,  G01R31/307 ,  H01J37/04 ,  H01J2237/2441 ,  H01J2237/2446 ,  H01J2237/2594 ,  H01J2237/2817

摘要： Provided is a method and an apparatus for inspecting a sample surface with high accuracy.Provided is a method for inspecting a sample surface by using an electron beam method sample surface inspection apparatus, in which an electron beam generated by an electron gun of the electron beam method sample surface inspection apparatus is irradiated onto the sample surface, and secondary electrons emanating from the sample surface are formed into an image toward an electron detection plane of a detector for inspecting the sample surface, the method characterized in that a condition for forming the secondary electrons into an image on a detection plane of the detector is controlled such that a potential in the sample surface varies in dependence on an amount of the electron beam irradiated onto the sample surface.

摘要翻译： 提供了一种用于高精度地检查样品表面的方法和装置。 提供了一种使用电子束法样品表面检查装置检查样品表面的方法，其中由电子束法样品表面检查装置的电子枪产生的电子束照射到样品表面上，并且发射二次电子 从样品表面形成为检测样品表面的检测器的电子检测面的图像，其特征在于，将检测器的检测面上的二次电子形成为图像的条件进行控制，使得 样品表面的电位根据照射到样品表面上的电子束的量而变化。

公开(公告)号：US20130313429A1

公开(公告)日：2013-11-28

申请号：US13954425

申请日：2013-07-30

申请人： Nobuharu Noji ,  Yoshihiko Naito ,  Hirosi Sobukawa ,  Kenji Terao ,  Masahiro Hatakeyama ,  Katsuya Okumura

发明人： Nobuharu Noji ,  Yoshihiko Naito ,  Hirosi Sobukawa ,  Kenji Terao ,  Masahiro Hatakeyama ,  Katsuya Okumura

IPC分类号： H01J37/26

CPC分类号： H01J37/265 ,  G01R31/307 ,  H01J37/04 ,  H01J2237/2441 ,  H01J2237/2446 ,  H01J2237/2594 ,  H01J2237/2817

摘要： Provided is a method and an apparatus for inspecting a sample surface with high accuracy. Provided is a method for inspecting a sample surface by using an electron beam method sample surface inspection apparatus, in which an electron beam generated by an electron gun of the electron beam method sample surface inspection apparatus is irradiated onto the sample surface, and secondary electrons emanating from the sample surface are formed into an image toward an electron detection plane of a detector for inspecting the sample surface, the method characterized in that a condition for forming the secondary electrons into an image on a detection plane of the detector is controlled such that a potential in the sample surface varies in dependence on an amount of the electron beam irradiated onto the sample surface.

公开(公告)号：US08624182B2

公开(公告)日：2014-01-07

申请号：US13195927

申请日：2011-08-02

申请人： Kenji Watanabe ,  Masahiro Hatakeyama ,  Yoshihiko Naito ,  Tatsuya Kohama ,  Kenji Terao ,  Takeshi Murakami ,  Takehide Hayashi ,  Kiwamu Tsukamoto ,  Hiroshi Sobukawa ,  Norio Kimura

发明人： Kenji Watanabe ,  Masahiro Hatakeyama ,  Yoshihiko Naito ,  Tatsuya Kohama ,  Kenji Terao ,  Takeshi Murakami ,  Takehide Hayashi ,  Kiwamu Tsukamoto ,  Hiroshi Sobukawa ,  Norio Kimura

IPC分类号： H01J37/244 ,  H01J37/285 ,  H01J37/29

CPC分类号： H01J37/22 ,  H01J37/265 ,  H01J37/29 ,  H01J2237/004 ,  H01J2237/022 ,  H01J2237/24495 ,  H01J2237/24564 ,  H01J2237/2817

摘要： An electro-optical inspection apparatus prevents adhesion of dust or particles to a sample surface, wherein a stage on which a sample is placed is disposed inside a vacuum chamber that can be evacuated, and a dust collecting electrode is disposed to surround a periphery of the sample. The dust collecting electrode is applied with a voltage having the same polarity as a voltage applied to the sample and an absolute value that is the same or larger than an absolute value of the voltage. Because dust or particles adhere to the dust collecting electrode, adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied.

摘要翻译： 电光检查装置防止灰尘或颗粒附着到样品表面，其中放置样品的阶段设置在可以抽真空的真空室内，并且集尘电极被设置成围绕 样品。 集尘电极施加与施加到样品的电压极性相同的电压，绝对值等于或大于电压的绝对值。 由于灰尘或颗粒附着在集尘电极上，所以可以减少灰尘或颗粒附着到样品表面。 代替使用集尘电极，可以在真空室的壁上形成凹部，或者在壁上设置具有施加了预定电压的网状结构的金属板。

公开(公告)号：US09194826B2

公开(公告)日：2015-11-24

申请号：US12103354

申请日：2008-04-15

申请人： Toru Kaga ,  Kenji Terao ,  Masahiro Hatakeyama ,  Kenji Watanabe ,  Yoshihiko Naito ,  Takeshi Murakami ,  Norio Kimura

发明人： Toru Kaga ,  Kenji Terao ,  Masahiro Hatakeyama ,  Kenji Watanabe ,  Yoshihiko Naito ,  Takeshi Murakami ,  Norio Kimura

IPC分类号： G21K5/04 ,  G01N23/203 ,  G01N23/225 ,  H01J37/28

CPC分类号： G01N23/203 ,  G01N23/2251 ,  G01N2223/6116 ,  H01J37/28 ,  H01J2237/004 ,  H01J2237/022 ,  H01J2237/2446 ,  H01J2237/2817

摘要： The electron beam apparatus is provided with a stage for mounting a sample thereon, a primary optical system for generating an electron beam having an irradiation area and irradiating the electron beam onto the sample, a secondary optical system for detecting electrons which have been generated through the irradiation of the electron beam onto the sample and have acquired structural information of the sample and acquiring an image of the sample about a viewing area and an irradiation area changing section for changing the position of the irradiation area with respect to the viewing area.

摘要翻译： 电子束装置设置有用于在其上安装样品的载物台，用于产生具有照射区域并将电子束照射到样品上的电子束的主光学系统，用于检测通过 将电子束照射到样品上并获取样品的结构信息并获取关于观察区域的样品的图像和用于改变照射区域相对于观察区域的位置的照射区域改变部分。

公开(公告)号：US08937283B2

公开(公告)日：2015-01-20

申请号：US12937145

申请日：2009-04-10

申请人： Masahiro Hatakeyama ,  Takeshi Murakami ,  Yoshihiko Naito ,  Kenji Terao ,  Norio Kimura ,  Kenji Watanabe

发明人： Masahiro Hatakeyama ,  Takeshi Murakami ,  Yoshihiko Naito ,  Kenji Terao ,  Norio Kimura ,  Kenji Watanabe

IPC分类号： H01J37/29 ,  H01J37/28 ,  H01J37/244 ,  H01L21/66

CPC分类号： H01J37/28 ,  H01J37/22 ,  H01J37/244 ,  H01J37/29 ,  H01J2237/24475 ,  H01J2237/24585 ,  H01J2237/24592 ,  H01J2237/2805 ,  H01J2237/2806 ,  H01J2237/2817 ,  H01L22/12

摘要： A technique capable of improving the ability to observe a specimen using an electron beam in an energy region which has not been conventionally given attention is provided. This specimen observation method comprises: irradiating the specimen with an electron beam; detecting electrons to be observed which have been generated and have obtained information on the specimen by the electron beam irradiation; and generating an image of the specimen from the detected electrons to be observed. The electron beam irradiation comprises irradiating the specimen with the electron beam with a landing energy set in a transition region between a secondary emission electron region in which secondary emission electrons are detected and a mirror electron region in which mirror electrons are detected, thereby causing the secondary emission electrons and the mirror electrons to be mixed as the electrons to be observed. The detection of the electrons to be observed comprises performing the detection in a state where the secondary emission electrons and the mirror electrons are mixed. Observation and inspection can be quickly carried out for a fine foreign material and pattern of 100 nm or less.

摘要翻译： 提供了一种技术，其能够提高在未经常被注意的能量区域中使用电子束观察样本的能力。 该样本观察方法包括：用电子束照射样本; 检测已经产生的待观察的电子，并通过电子束照射获得关于样品的信息; 以及从所检测的电子产生待观察的样本的图像。 电子束照射包括用电子束照射样本，其中在其中检测到二次发射电子的二次发射电子区域和其中检测到反射镜电子的镜电子区域之间的过渡区域中设置的着陆能量，从而使次级 发射电子和镜电子作为待观察的电子进行混合。 要观察的电子的检测包括在二次发射电子和镜电子混合的状态下进行检测。 对于100nm以下的细小异物和图案，可以快速进行观察和检查。