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1.发明授权公开(公告)号：US06645881B2
公开(公告)日：2003-11-11
申请号：US10112951
申请日：2002-04-02
申请人： Nobuhide Yamada , Rempei Nakata , Makoto Sugiura , Mutsuhiko Yoshioka , Takahiro Kitano , Shinji Kobayashi
发明人： Nobuhide Yamada , Rempei Nakata , Makoto Sugiura , Mutsuhiko Yoshioka , Takahiro Kitano , Shinji Kobayashi
IPC分类号： H01L2131
CPC分类号： C23C18/1212 , B05D1/26 , C09D183/04 , C09D183/14 , H01L21/02118 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/312 , H01L21/3122 , H01L21/3127 , H01L21/31691
摘要： A coating solution for used in a scan coating method contains a low vapor pressure solvent having a vapor pressure lower than 1 Torr (133.322 Pa) at room temperature.
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公开(公告)号：US20050100681A1
公开(公告)日：2005-05-12
申请号：US11013515
申请日：2004-12-17
申请人： Shinji Kobayashi , Takahiro Kitano , Masateru Morikawa , Kazuhiro Takeshita , Yoshiyuki Kawafuchi
发明人： Shinji Kobayashi , Takahiro Kitano , Masateru Morikawa , Kazuhiro Takeshita , Yoshiyuki Kawafuchi
IPC分类号： H01L21/027 , H01L21/00 , C23C28/00 , B05C5/00
CPC分类号： H01L21/6715
摘要： The present invention is a coating unit for applying a coating solution to a substrate which includes: a discharge nozzle for reciprocating in a predetermined direction above the substrate and discharging the coating solution to the substrate; a holder for holding the substrate and horizontally movable in one direction perpendicular to the predetermined direction; and a cover for covering an upper face of the substrate when the substrate is moved in the one direction to be more forward than the discharge nozzle as viewed from a plane, wherein a lower face of the cover is inclined such as to be higher on the discharge nozzle side. According to the present invention, the cover covering the upper face of the substrate restrains a solvent from evaporating from the coating solution applied on the substrate to secure flatness of a coating film.
摘要翻译： 本发明是一种涂布单元，用于将涂布溶液涂布在基材上，该涂布单元包括：排出喷嘴，用于在基板上方沿预定方向往复运动并将涂布溶液排放到基板上; 用于保持基板并在垂直于预定方向的一个方向上可水平移动的保持器; 以及当从平面观察时，当基板沿着一个方向移动到比排出喷嘴更向前时，覆盖基板的上表面的盖，其中盖的下表面倾斜以在 排出口侧。 根据本发明，覆盖基板的上表面的盖子阻止溶剂从施加在基板上的涂布溶液蒸发，以确保涂膜的平坦度。
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公开(公告)号：US06599366B1
公开(公告)日：2003-07-29
申请号：US09711968
申请日：2000-11-15
IPC分类号： B05C1106
CPC分类号： H01L21/6715
摘要： The present invention includes a current plate which is arranged above a substrate in a chamber. A pressure inside the chamber is reduced by exhaust means and drying processing is performed on, for example, a coating solution on the substrate. On a peripheral portion of an underneath surface of the current plate, formed is a ring-shaped protrusion corresponding to a peripheral portion of the substrate. A protruding portion of a coating solution at the peripheral portion of the substrate is made flat by air current generated when the pressure is reduced, and consequently a coating film with a uniform film thickness as a whole is formed on the substrate.
摘要翻译： 本发明包括一个布置在腔室中的衬底上方的电流板。 通过排气装置降低室内的压力，并且例如对基板上的涂布溶液进行干燥处理。 在当前板的下表面的周边部分上形成有与基板的周边部分对应的环形突起。 通过在压力降低时产生的气流使基板周边部分的涂布液的突出部分变得平坦，因此在基板上形成整体上具有均匀膜厚的涂膜。
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公开(公告)号：US20050100679A1
公开(公告)日：2005-05-12
申请号：US10964684
申请日：2004-10-15
申请人： Takahiro Kitano , Shinichi Sugimoto , Shinji Kobayashi , Naoya Hirakawa , Akira Fukutomi , Nobukazu Ishizaka
发明人： Takahiro Kitano , Shinichi Sugimoto , Shinji Kobayashi , Naoya Hirakawa , Akira Fukutomi , Nobukazu Ishizaka
IPC分类号： H01L21/027 , B05D3/04 , G03F7/16 , H01L21/00 , B05C5/00
CPC分类号： H01L21/6715 , B05D3/0466 , B05D3/0486 , G03F7/162
摘要： The present invention relates to a processing method for processing a substrate, and comprises a step of coating a coating solution on a surface of the substrate while relatively moving a coating solution discharge nozzle and the substrate and discharging the coating solution from the nozzle onto the substrate. Thereafter, the substrate is exposed to a solvent atmosphere of the coating solution or the pressure is temporarily applied thereto in a container. Thereafter, the pressure inside the container in which the substrate is housed is reduced to dry the coating solution on the substrate. According to the present invention, it is possible to narrow the so-called edge cutting width, which is at a periphery part of the substrate and is not commercialized, and to maintain an in-plane uniformity of the coating film.
摘要翻译： 本发明涉及一种处理基板的处理方法，包括在使涂布液排出喷嘴和基板相对移动并将涂布溶液从喷嘴排出到基板上的同时在基板的表面上涂布涂布液的步骤 。 此后，将基板暴露于涂布溶液的溶剂气氛中，或者将压力暂时施加到容器中。 此后，将容纳基板的容器内部的压力减小，以使基材上的涂布溶液干燥。 根据本发明，可以缩小位于基板的周边部分并且不商业化的所谓的边缘切割宽度，并且保持涂膜的面内均匀性。
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公开(公告)号：US06773510B2
公开(公告)日：2004-08-10
申请号：US10122389
申请日：2002-04-16
申请人： Takahiro Kitano , Shinichi Sugimoto , Shinji Kobayashi , Naoya Hirakawa , Akira Fukutomi , Nobukazu Ishizaka
发明人： Takahiro Kitano , Shinichi Sugimoto , Shinji Kobayashi , Naoya Hirakawa , Akira Fukutomi , Nobukazu Ishizaka
IPC分类号： B05C1102
CPC分类号： H01L21/67178 , G03F7/162 , G03F7/3021 , H01L21/67069
摘要： The present invention relates to a processing unit for processing a substrate, which comprises a chamber for housing the substrate and forming a hermetically closeable processing room, and an exhauster for exhausting an atmosphere in the processing room from an upper portion of the chamber to reduce a pressure in the processing room. The processing unit of the present invention includes a current plate for controlling an atmospheric current formed in the processing room when the pressure is reduced, and the chamber has a mounting table for mounting the substrate thereon, an almost cylindrical lid body with its lower face open for covering the substrate on the mounting plate from above and forming the processing room integrally with the mounting table, and a supporting member for supporting the current plate so that the current plate is parallel to the mounting plate. According to the present invention, the speed of an atmospheric current flowing between the current plate and the substrate becomes uniform within the surface of the substrate, and consequently when a coating film on the substrate is dried, the film is planarized to have a uniform thickness.
摘要翻译： 本发明涉及一种用于处理基板的处理单元，其包括用于容纳基板并形成密封处理室的室，以及用于从室的上部排出处理室中的气氛的排气器，以减少 处理室压力。 本发明的处理单元包括用于当压力降低时控制在处理室中形成的大气电流的电流板，并且该腔室具有用于将基板安装在其上的安装台，其下表面打开的几乎圆柱形的盖体 用于从上方覆盖安装板上的基板并与安装台一体地形成处理室;以及支撑构件，用于支撑当前板，使得当前板平行于安装板。 根据本发明，在基板表面之间流动的当前板和基板之间的大气电流的速度变得均匀，因此当基板上的涂膜被干燥时，该膜被平坦化以具有均匀的厚度 。
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6.发明授权公开(公告)号：US07205025B2
公开(公告)日：2007-04-17
申请号：US11212725
申请日：2005-08-29
IPC分类号： B05D3/00
CPC分类号： H01L21/67034 , B05D3/0254 , B05D3/0493
摘要： In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q1, and thereafter, it is performed based on a second flow rate set value larger than Q1. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q1, and more active evaporation of a solvent component is attained by switching to Q2.
摘要翻译： 在减压下涂布抗蚀剂等涂布液的干燥中，不管干燥时间长短如何，周边部分的涂膜容易失去良好的形状，难以设定合适的排气流量。 在将基板装载到气密容器中之后，例如将压力从大气压降至略高于溶剂蒸气压的压力。 然后，溶剂从涂布液中主动蒸发。 这里，首先基于第一流量设定值Q 1进行排气，之后，基于大于Q 1的第二流量设定值进行排气。 通过基于Q 1的排气来校正周边部分的表面的四舍五入，并且通过切换到Q 2来获得更有效的溶剂成分的蒸发。
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7.发明申请公开(公告)号：US20060003105A1
公开(公告)日：2006-01-05
申请号：US11212725
申请日：2005-08-29
IPC分类号： B05D3/02
CPC分类号： H01L21/67034 , B05D3/0254 , B05D3/0493
摘要： In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q1, and thereafter, it is performed based on a second flow rate set value larger than Q1. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q1, and more active evaporation of a solvent component is attained by switching to Q2.
摘要翻译： 在减压下涂布抗蚀剂等涂布液的干燥中，不管干燥时间长短如何，周边部分的涂膜容易失去良好的形状，难以设定合适的排气流量。 在将基板装载到气密容器中之后，例如将压力从大气压降至略高于溶剂蒸气压的压力。 然后，溶剂从涂布液中主动蒸发。 这里，首先基于第一流量设定值Q 1进行排气，之后，基于大于Q 1的第二流量设定值进行排气。 通过基于Q 1的排气来校正周边部分的表面的四舍五入，并且通过切换到Q 2来获得更有效的溶剂成分的蒸发。
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8.发明授权公开(公告)号：US06966949B2
公开(公告)日：2005-11-22
申请号：US10615800
申请日：2003-07-10
IPC分类号： B05D1/40 , B05C9/12 , B05C11/08 , B05D3/02 , B05D3/04 , B05D3/12 , H01L21/00 , H01L21/027 , B05C11/02
CPC分类号： H01L21/67034 , B05D3/0254 , B05D3/0493
摘要： In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q1, and thereafter, it is performed based on a second flow rate set value larger than Q1. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q1, and more active evaporation of a solvent component is attained by switching to Q2.
摘要翻译： 在减压下涂布抗蚀剂等涂布液的干燥中，不管干燥时间长短如何，周边部分的涂膜容易失去良好的形状，难以设定合适的排气流量。 在将基板装载到气密容器中之后，例如将压力从大气压降至略高于溶剂蒸气压的压力。 然后，溶剂从涂布液中主动蒸发。 这里，首先基于第一流量设定值Q 1进行排气，之后，基于大于Q 1的第二流量设定值进行排气。 通过基于Q 1的排气来校正周边部分的表面的四舍五入，并且通过切换到Q 2来获得更有效的溶剂成分的蒸发。
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公开(公告)号：US06933015B2
公开(公告)日：2005-08-23
申请号：US10361689
申请日：2003-02-11
IPC分类号： B05B15/04 , B05C5/00 , B05C13/02 , B05D1/00 , B05D1/30 , G03F7/16 , H01L21/00 , H01L21/027 , B05D3/00
CPC分类号： H01L21/6715 , B05D1/005 , G03F7/162
摘要： A method of forming a film of a coating solution on a substrate includes steps of moving a coating solution discharge member relative to a substrate while a coating solution is being discharged from the coating solution discharge member to the surface of the substrate, and changing a discharge direction of the coating solution to an outer peripheral portion of the substrate to make the amount of application to the outer peripheral portion smaller than that to other portions. This can reduce the amount of application to the outer peripheral portion of the substrate, thereby making it possible to restrain protuberance of the coating solution at the outer peripheral portion of the substrate caused by surface tension. Consequently, a coating film which is uniform also at the outer peripheral portion on the substrate is formed.
摘要翻译： 在基材上形成涂布液的膜的方法包括以下步骤：在将涂布液从涂布液排出部件排出到基板的表面的同时使涂布液排出部件相对于基板移动，并且改变排出 涂布液的方向到基板的外周部分，以使得施加到外周部分的量比其它部分小。 这可以减少施加到基板的外周部分的量，从而可以抑制由表面张力引起的基板的外周部分处的涂布液的突起。 因此，形成在基板的外周部均匀的涂膜。
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公开(公告)号：US06860945B2
公开(公告)日：2005-03-01
申请号：US10101707
申请日：2002-03-21
申请人： Shinji Kobayashi , Takahiro Kitano , Masateru Morikawa , Kazuhiro Takeshita , Yoshiyuki Kawafuchi
发明人： Shinji Kobayashi , Takahiro Kitano , Masateru Morikawa , Kazuhiro Takeshita , Yoshiyuki Kawafuchi
IPC分类号： H01L21/027 , H01L21/00 , B05B15/04 , B05B3/00 , B05C5/00
CPC分类号： H01L21/6715
摘要： The present invention is a coating unit for applying a coating solution to a substrate which includes: a discharge nozzle for reciprocating in a predetermined direction above the substrate and discharging the coating solution to the substrate; a holder for holding the substrate and horizontally movable in one direction perpendicular to the predetermined direction; and a cover for covering an upper face of the substrate when the substrate is moved in the one direction to be more forward than the discharge nozzle as viewed from a plane, wherein a lower face of the cover is inclined such as to be higher on the discharge nozzle side. According to the present invention, the cover covering the upper face of the substrate restrains a solvent from evaporating from the coating solution applied on the substrate to secure flatness of a coating film.
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