公开(公告)号：US08487191B2

公开(公告)日：2013-07-16

申请号：US13141730

申请日：2009-12-22

申请人： Nobuhito Makino ,  Hajime Inazumi ,  Taku Yoshida

发明人： Nobuhito Makino ,  Hajime Inazumi ,  Taku Yoshida

IPC分类号： H05K1/00 ,  B32B15/08

CPC分类号： B32B15/08 ,  B32B7/12 ,  B32B15/20 ,  B32B27/16 ,  B32B27/281 ,  B32B2307/202 ,  B32B2307/538 ,  B32B2307/546 ,  B32B2307/732 ,  H05K1/0346 ,  H05K3/388 ,  H05K2201/0154 ,  H05K2203/095 ,  H05K2203/1545 ,  Y10T428/12569

摘要： An adhesive-free flexible laminate formed from a polyimide film in which at least one surface has been plasma treated, a tie-coat layer formed on the surface of the plasma-treated polyimide film, a metal seed layer made of either copper or copper alloy and which is formed on the tie-coat layer, and a metal conductive layer made of either copper or copper alloy and which is formed on the metal seed layer, wherein the atomic percent of Cu inclusion in the tie-coat layer is 0.5 at % or less. Consequently, provided is a flexible laminate capable of effectively inhibiting the deterioration of the peel strength upon producing a flexible laminate (in particular a two-layer metalizing laminate).

摘要翻译： 由聚酰亚胺膜形成的无粘合剂柔性层压体，其中至少一个表面经过等离子体处理，形成在等离子体处理的聚酰亚胺膜的表面上的粘结层，由铜或铜合金制成的金属籽晶层 并且在所述连接层上形成有由铜或铜合金构成的金属导电层，所述金属导电层形成在所述金属种子层上，其中所述连接层中的Cu夹杂物的原子百分比为0.5原子％ 或更少。 因此，提供了一种柔性层压体，其能够有效地抑制柔性层压体（特别是两层金属化层压体）的剥离强度的劣化。

公开(公告)号：US20120012367A1

公开(公告)日：2012-01-19

申请号：US13141730

申请日：2009-12-22

申请人： Nobuhito Makino ,  Hajime Inazumi ,  Taku Yoshida

发明人： Nobuhito Makino ,  Hajime Inazumi ,  Taku Yoshida

IPC分类号： B32B15/08 ,  H05K1/00

CPC分类号： B32B15/08 ,  B32B7/12 ,  B32B15/20 ,  B32B27/16 ,  B32B27/281 ,  B32B2307/202 ,  B32B2307/538 ,  B32B2307/546 ,  B32B2307/732 ,  H05K1/0346 ,  H05K3/388 ,  H05K2201/0154 ,  H05K2203/095 ,  H05K2203/1545 ,  Y10T428/12569

摘要： An adhesive-free flexible laminate formed from a polyimide film in which at least one surface has been plasma treated, a tie-coat layer formed on the surface of the plasma-treated polyimide film, a metal seed layer made of either copper or copper alloy and which is formed on the tie-coat layer, and a metal conductive layer made of either copper or copper alloy and which is formed on the metal seed layer, wherein the atomic percent of Cu inclusion in the tie-coat layer is 0.5 at % or less. Consequently, provided is a flexible laminate capable of effectively inhibiting the deterioration of the peel strength upon producing a flexible laminate (in particular a two-layer metalizing laminate).

摘要翻译： 由聚酰亚胺膜形成的无粘合剂柔性层压体，其中至少一个表面经过等离子体处理，形成在等离子体处理的聚酰亚胺膜的表面上的粘结层，由铜或铜合金制成的金属籽晶层 并且在所述连接层上形成有由铜或铜合金构成的金属导电层，所述金属导电层形成在所述金属种子层上，其中所述连接层中的Cu夹杂物的原子百分比为0.5原子％ 或更少。 因此，提供了一种柔性层压体，其能够有效地抑制柔性层压体（特别是两层金属化层压体）的剥离强度的劣化。

公开(公告)号：US20120034475A1

公开(公告)日：2012-02-09

申请号：US13148831

申请日：2010-02-17

申请人： Taku Yoshida ,  Hajime Inazumi

发明人： Taku Yoshida ,  Hajime Inazumi

IPC分类号： B32B15/08

CPC分类号： B32B15/20 ,  B32B15/08 ,  B32B27/281 ,  B32B2255/205 ,  B32B2307/202 ,  B32B2307/546 ,  B32B2307/732 ,  C25D5/34 ,  H05K1/0346 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0154 ,  Y10T428/31681

摘要： [Object] To provide a metal-coated polyimide resin substrate that does not deteriorate the initial adhesion between the metal-coated polyimide resin film and the metal layer and has high adhesion after aging at 150° C. for 168 hours.[Solution] A metal-coated polyimide resin substrate in which a barrier layer is formed by a dry process after performing surface modification to one surface or both surfaces of a polyimide resin film by a dry process, a seed layer is thereafter formed by a wet process or a dry process, and a conductive film is formed on a surface layer thereof by a wet process; wherein, at the peeling surface on the conductive film layer side after the metal-coated polyimide resin substrate is subject to a 90-degree peel test, the thickness of a mixed layer of polyimide residue and barrier metal layer residue according to in-depth profiling with a time-of-flight secondary ion mass spectrometer (TOF-SIMS) is 0.70 nm or less based on Si sputter rate conversion, and peel strength retention after an aging test at 150° C. for 168 hours (peel strength after aging at 150° C. for 168 hours/initial peel strength) is 50% or higher.

摘要翻译： 本发明提供一种金属包覆的聚酰亚胺树脂基板，其不会使金属包覆的聚酰亚胺树脂膜与金属层之间的初始粘合性劣化，并且在150℃下老化168小时后具有高粘附性。 [解决方案]通过干法对聚酰亚胺树脂膜的一面或两面进行表面改性后，通过干法形成阻挡层的金属涂布的聚酰亚胺树脂基板，然后通过湿法形成种子层 工艺或干法，并且通过湿法在其表面层上形成导电膜; 其中，在金属涂覆的聚酰亚胺树脂基板进行90度剥离试验之后的导电膜层侧的剥离面上，根据深度图案，聚酰亚胺残留物和阻隔金属层残留物的混合层的厚度 使用飞行时间二次离子质谱仪（TOF-SIMS）为基于Si溅射速率转换为0.70nm以下，150℃下老化试验后的剥离强度保持168小时（老化后的剥离强度 150℃，168小时/初始剥离强度）为50％以上。

公开(公告)号：US20080226299A1

公开(公告)日：2008-09-18

申请号：US12034691

申请日：2008-02-21

申请人： Yoshiyuki Maeda ,  Hironori Kadota ,  Taku Yoshida ,  Yoshinobu Matsukawa

发明人： Yoshiyuki Maeda ,  Hironori Kadota ,  Taku Yoshida ,  Yoshinobu Matsukawa

IPC分类号： H04B10/12

CPC分类号： H04J3/085 ,  H04J2203/006

摘要： An optical transmission apparatus includes redundant line cards each having a plurality of ports, a hardware unit and a CPU. The hardware unit obtains failure information on redundant lines for each port. The CPU determines switching control of the redundant lines based on the failure information. Then, the hardware unit switches the redundant lines based on the switching control determined by the CPU, so as to transmit an SDH/SONET optical signal in a ring network. The CPU of one of the line cards is set as a master CPU on the corresponding line card to control switching of the redundant lines. Further, the CPU of the other line card is set as a slave CPU.

摘要翻译： 光传输装置包括各自具有多个端口的冗余线路卡，硬件单元和CPU。 硬件单元获取每个端口冗余线路的故障信息。 CPU根据故障信息确定冗余线路的切换控制。 然后，硬件单元基于由CPU确定的切换控制来切换冗余线路，以便在环形网络中发送SDH / SONET光信号。 其中一个线路卡的CPU设置为相应线路卡上的主CPU，以控制冗余线路的切换。 此外，另一线卡的CPU被设置为从CPU。

公开(公告)号：US20110244665A1

公开(公告)日：2011-10-06

申请号：US13075659

申请日：2011-03-30

申请人： Makoto MIKAMI ,  Misao Takakusaki ,  Taku Yoshida ,  Satoru Morioka

发明人： Makoto MIKAMI ,  Misao Takakusaki ,  Taku Yoshida ,  Satoru Morioka

IPC分类号： H01L21/20

CPC分类号： H01L21/0254 ,  C30B25/183 ,  C30B29/406 ,  H01L21/0242 ,  H01L21/02458 ,  H01L21/02505 ,  H01L21/0262

摘要： A low-temperature protective layer having AlN is grown on a rare earth perovskite substrate and a first GaN based semiconductor layer having Alx1Ga1-x1N where composition x1 of Al is 0.40≦x1≦0.45 is grown thereon. Then, a second GaN semiconductor layer having Alx2Ga1-x2N where composition x2 of Al is 0≦x2≦0.45 is grown on the first GaN based semiconductor layer.

摘要翻译： 在稀土类钙钛矿基板上生长具有AlN的低温保护层，在其上生长Al 1 Ga 1-x 1 N的第一GaN基半导体层，其中Al的组成x1为0.40＆lt; l1; x1＆n1E; 0.45。 然后，在第一GaN基半导体层上生长具有Al的组成x2为0并且具有Alx2Ga1-x2N的第二GaN半导体层; x2和nlE; 0.45。

公开(公告)号：US07822052B2

公开(公告)日：2010-10-26

申请号：US11898771

申请日：2007-09-14

申请人： Hiromu Yoshii ,  Hironori Kadota ,  Yoko Toyozumi ,  Yumiko Ogata ,  Taku Yoshida ,  Yoshiyuki Maeda ,  Yoshiko Sakamoto ,  Seiji Miyata ,  Kazuyuki Inomoto

发明人： Hiromu Yoshii ,  Hironori Kadota ,  Yoko Toyozumi ,  Yumiko Ogata ,  Taku Yoshida ,  Yoshiyuki Maeda ,  Yoshiko Sakamoto ,  Seiji Miyata ,  Kazuyuki Inomoto

IPC分类号： H04L12/56

CPC分类号： H04L45/00

摘要： A communication processing apparatus appends group information representing a group to received communication frames. Group information to be appended to the communication frames is changed on a predetermined cycle. The communication frames processed in each processing unit are counted separately for each of the group information appended, and the count value is collected in each processing unit. With a communication processing apparatus, such as a switch and a router, which has a plurality of processing units (device), performs processing by each of the processing units on the communication frames received from a receiving unit, and transmits the processed communication frames from a transmitting unit, it is possible to realize a communication processing apparatus and a totalizing system capable of accurately counting and collecting the communication frames while performing an operation when totalizing the number of communication frames processed in each of the processing units.

摘要翻译： 通信处理装置将表示组的组信息附加到接收到的通信帧。 要附加到通信帧的组信息在预定周期上改变。 在每个处理单元中处理的通信帧对于附加的每个组信息分别计数，并且计数值被收集在每个处理单元中。 利用具有多个处理单元（设备）的诸如交换机和路由器的通信处理装置，对从接收单元接收到的通信帧执行每个处理单元的处理，并将处理后的通信帧从 发送单元，可以实现在对在每个处理单元中处理的通信帧的数量进行累加的同时执行操作时能够精确地计数和收集通信帧的通信处理装置和累加系统。

公开(公告)号：US20070147231A1

公开(公告)日：2007-06-28

申请号：US11388825

申请日：2006-03-24

申请人： Taku Yoshida ,  Hironori Kadota ,  Yoko Toyozumi ,  Yumiko Ogata ,  Yoshiyuki Maeda ,  Hiromu Yoshii ,  Yoshiko Sakamoto ,  Seiji Miyata

发明人： Taku Yoshida ,  Hironori Kadota ,  Yoko Toyozumi ,  Yumiko Ogata ,  Yoshiyuki Maeda ,  Hiromu Yoshii ,  Yoshiko Sakamoto ,  Seiji Miyata

IPC分类号： H04J1/16 ,  G08C15/00 ,  H04J3/14 ,  H04L12/26

CPC分类号： H04L12/462 ,  H04L12/4641 ,  H04L45/22 ,  H04L45/28 ,  H04L45/50 ,  H04L49/354 ,  H04L49/555 ,  H04L49/602

摘要： A path protection method is disclosed that is capable of path protection without extra cost and able to improve path switching efficiency. The method includes the steps of associating a virtual network identifier assigned to one or more users with a virtual network identifier for management, the virtual network identifier assigned to one or more users being regarded as one path to set a path for current use and a spare path; and when switching the currently-used path and the spare path, according to service class information included in the virtual network identifier for management, a path corresponding to a virtual network identifier for management having a higher service class than other paths is preferentially switched to.

摘要翻译： 公开了一种路径保护方法，其能够在没有额外成本的情况下进行路径保护，并且能够提高路径切换效率。 该方法包括以下步骤：将分配给一个或多个用户的虚拟网络标识符与用于管理的虚拟网络标识符相关联，分配给一个或多个用户的虚拟网络标识符被认为是设置当前使用的路径的一条路径和备用 路径; 并且当切换当前使用的路径和备用路径时，根据包括在用于管理的虚拟网络标识符中的服务类别信息，优先地切换与具有比其他路径更高的服务等级的用于管理的虚拟网络标识符相对应的路径。

公开(公告)号：US08462652B2

公开(公告)日：2013-06-11

申请号：US12662369

申请日：2010-04-13

申请人： Yoshiyuki Maeda ,  Yumiko Ogata ,  Taku Yoshida ,  Seiji Miyata

发明人： Yoshiyuki Maeda ,  Yumiko Ogata ,  Taku Yoshida ,  Seiji Miyata

IPC分类号： H04L12/26

CPC分类号： G06F11/3433 ,  G06F11/2007 ,  H04L41/069 ,  H04L69/40

摘要： In an optical transmission device, firmware that operates within a CPU of a first LIU and firmware that operates within a CPU of a second LIU periodically measure a load status of a CPU via an OS, respectively. Switchover control of a master CPU is performed according to a load status of a CPU measured by the firmware of each LIU. For example, when a load status of the CPU of the second LIU is lower than that of the CPU of the first LIU, a master CPU that performs switchover control of a predetermined port is switched to a slave CPU in the first LIU, and a slave CPU related to the predetermined port is switched to a master CPU in the second LIU, thereby dynamically changing the setting.

摘要翻译： 在光传输装置中，在第一LIU的CPU内操作的固件和在第二LIU的CPU内操作的固件分别经由OS周期性地测量CPU的负载状态。 根据由每个LIU的固件测量的CPU的负载状态来执行主CPU的切换控制。 例如，当第二LIU的CPU的负载状态低于第一LIU的CPU的负载状态时，执行预定端口的切换控制的主CPU切换到第一LIU中的从CPU，并且 与预定端口相关的从CPU将切换到第二LIU中的主CPU，从而动态地改变设置。

公开(公告)号：US08301035B2

公开(公告)日：2012-10-30

申请号：US12558780

申请日：2009-09-14

申请人： Keisuke Harada ,  Taku Yoshida ,  Yoshiyuki Maeda

发明人： Keisuke Harada ,  Taku Yoshida ,  Yoshiyuki Maeda

IPC分类号： H04B10/12

CPC分类号： H04B10/2504 ,  H04Q11/0005 ,  H04Q11/0066 ,  H04Q2011/0013 ,  H04Q2011/0015 ,  H04Q2011/0039 ,  H04Q2011/0049

摘要： An optical communication apparatus includes an optical signal transmitter for outputting an optical signal, an optical switch device for switching a route of the optical signal, a drive controller for supplying a drive current for controlling a route switching to the optical switch device, a cooling device for cooling the optical switch device on the basis of a control signal, a temperature controller for transmitting the control signal to the cooling device in order to keep a measured temperature at a specific temperature, where the measured temperature is related to a temperature of the optical switch device.

摘要翻译： 一种光通信装置，包括用于输出光信号的光信号发送器，用于切换光信号的路径的光开关装置，用于提供驱动电流的驱动控制器，用于控制到光开关装置的路径切换;冷却装置 用于基于控制信号冷却光开关装置，用于将控制信号传输到冷却装置的温度控制器，以便将测量温度保持在特定温度，其中所测量的温度与光学器件的温度相关 开关装置。

公开(公告)号：US20110318602A1

公开(公告)日：2011-12-29

申请号：US13148708

申请日：2010-02-17

申请人： Taku Yoshida

发明人： Taku Yoshida

IPC分类号： B32B27/06 ,  B32B33/00

CPC分类号： H05K3/388 ,  C23C18/1651 ,  C23C18/2006 ,  C23C18/204 ,  C23C18/24 ,  C25D5/56 ,  H05K1/0346 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2201/2063 ,  Y10T428/12535 ,  Y10T428/31721

摘要： [Object] To provide a metal-coated polyimide resin substrate that does not deteriorate the initial adhesion between the metal-coated polyimide resin film and the metal layer and has high adhesion after aging at 150° C. for 168 hours.[Solution] A metal-coated polyimide resin substrate in which a barrier layer is formed by a wet process after performing surface modification to one surface or both surfaces of a polyimide resin film by a wet process or a dry process or a combination thereof, a seed layer is thereafter formed by a wet process or a dry process, and a conductive film is formed on a surface layer thereof by a wet process; wherein, at the peeling surface on the conductive film layer side after the metal-coated polyimide resin substrate is subject to a 90-degree peel test, the thickness of a mixed layer of polyimide residue and barrier metal layer residue according to in-depth profiling with a time-of-flight secondary ion mass spectrometer (TOF-SIMS) is 2.60 nm or less based on Si sputter rate conversion, and peel strength retention after an aging test at 150° C. for 168 hours (peel strength after aging at 150° C. for 168 hours/initial peel strength) is 50% or higher.

摘要翻译： 本发明提供一种金属包覆的聚酰亚胺树脂基板，其不会使金属包覆的聚酰亚胺树脂膜与金属层之间的初始粘合性劣化，并且在150℃下老化168小时后具有高粘附性。 [方案]一种金属涂覆的聚酰亚胺树脂基板，其中通过湿法或干法或其组合对聚酰亚胺树脂膜的一个表面或两个表面进行表面改性之后通过湿法形成阻挡层， 然后通过湿法或干法形成种子层，并通过湿法在其表面层上形成导电膜; 其中，在金属涂覆的聚酰亚胺树脂基板进行90度剥离试验之后的导电膜层侧的剥离面上，根据深度图案，聚酰亚胺残留物和阻隔金属层残留物的混合层的厚度 使用飞行时间次级离子质谱仪（TOF-SIMS），基于Si溅射速率转换为2.60nm以下，150℃下老化试验后的剥离强度保持168小时（老化后的剥离强度 150℃，168小时/初始剥离强度）为50％以上。