摘要:
The present invention provides a phosphor sheet in which the optical properties thereof are not impaired and which exhibits excellent film thickness uniformity even when comprising large-sized phosphor particles in high concentration. In one embodiment, the invention provides a phosphor sheet in which the content of phosphor is 53 weight % or more of the total sheet, and in another embodiment, a phosphor sheet includes at least a silicone resin, a phosphor and silicone fine particles.
摘要:
The present invention provides a phosphor sheet in which the optical properties thereof are not impaired and which exhibits excellent film thickness uniformity even when comprising large-sized phosphor particles in high concentration. In one embodiment, the invention provides a phosphor sheet in which the content of phosphor is 53 weight % or more of the total sheet, and in another embodiment, a phosphor sheet includes at least a silicone resin, a phosphor and silicone fine particles.
摘要:
In order to improve the color and luminance uniformity of an LED chip with a phosphor-containing resin sheet obtained by adhering the phosphor-containing resin sheet to the LED chip, improve the ease of production, and improve the degree of freedom in design, etc., provided is a resin sheet laminate provided with a phosphor-containing resin sheet on a base material, wherein the phosphor-containing resin sheet is divided into a plurality of sections.
摘要:
A phosphor-containing sheet having a storage modulus of 0.1 MPa or more at 25° C. and a storage modulus of less than 0.1 MPa at 100° C., wherein a resin main component of the phosphor-containing sheet is a crosslinked product formed by subjecting a crosslinkable silicone composition containing a specific composition to a hydrosilylation reaction. This phosphor-containing sheet provides a phosphor sheet having good shapability and high adhesive power as a phosphor sheet bonded to an LED chip as a wavelength conversion layer.
摘要:
A phosphor-containing sheet having a storage modulus of 0.1 MPa or more at 25° C. and a storage modulus of less than 0.1 MPa at 100° C., wherein a resin main component of the phosphor-containing sheet is a crosslinked product formed by subjecting a crosslinkable silicone composition containing a specific composition to a hydrosilylation reaction. This phosphor-containing sheet provides a phosphor sheet having good shapability and high adhesive power as a phosphor sheet bonded to an LED chip as a wavelength conversion layer.