摘要:
A dielectric ceramic composition prepared by adding 0.1 to 1.3% of B.sub.2 O.sub.3, 1.0 to 3.0% of SiO.sub.2 and 0.5 to 3.0% of ZnO to a composition comprising 18.0 to 27.0% of BaTiO.sub.2, 31.6 to 36.3% of Nd.sub.2 O.sub.3, 27.6 to 35.5% of TiO.sub.2, 2.5 to 8.1% of Bi.sub.2 O.sub.3 and 5.6 to 9.0% of Pb.sub.3 O.sub.4, all percentages being by weight. This dielectric composition has a high dielectric constant and a temperature coefficient controlled within a narrow range and can be fired at relatively low temperatures. Because of these properties, it is used as a multilayer ceramic capacitor in combination with an electrode composed of an Ag-Pd alloy containing a major amount of Ag.
摘要翻译:通过将0.1〜1.3%的B 2 O 3,1.0〜3.0%的SiO 2和0.5〜3.0%的ZnO添加到包含18.0〜27.0%的BaTiO 2,31.6〜36.3%的Nd 2 O 3,27.6〜35.5%的BaTiO 2的组合物中制备的电介质陶瓷组合物 TiO 2,2.5〜8.1%的Bi 2 O 3和5.6〜9.0%的Pb 3 O 4,所有的百分数均为重量百分比。 该电介质组合物具有高介电常数和温度系数控制在窄范围内并且可以在相对低的温度下烧制。 由于这些性质,它被用作与包含主要量的Ag的Ag-Pd合金组成的电极的多层陶瓷电容器。
摘要:
A solid-state image sensing device includes a light receiving layer and a shutter layer. The light receiving layer has a photoelectric conversion part arranged in a plane state and configured to convert received light into an electric signal. The shutter layer is configured to control transmission of the light to be incident on the light receiving layer. In the solid-state image sensing device, an interval between the light receiving layer and the shutter layer is less than or equal to a length of a shutter element formed in the shutter layer.
摘要:
Disclosed is a solid-state image sensing device including: a first photoelectric conversion element having a first semiconductor region of a first conductivity type formed inside a semiconductor substrate; a second photoelectric conversion element having a second semiconductor region of a first conductivity type formed at a deeper position of the semiconductor substrate than the first photoelectric conversion element; a gate electrode laminated on the semiconductor substrate and to which a predetermined voltage is applied at a charge transfer time; a floating diffusion region to which the charges accumulated in the first photoelectric conversion element and the second photoelectric conversion element are transferred at the charge transfer time; and a third semiconductor region of a first conductivity type arranged between the first semiconductor region and the second semiconductor region in a depth direction of the semiconductor.
摘要:
A solid state image pickup device includes a pixel section defined by unit pixels arrayed in line and row directions of a semiconductor substrate. Each of the unit pixels includes a photoelectric transducer that is formed on the semiconductor substrate and converts incident light into a signal charge, a waveguide that is formed above the photoelectric transducer and guides the incident light to the photoelectric transducer, and a microlens that is formed above the waveguide and guides the incident light to an end of light incident side of the waveguide. The waveguide has a columnar body with a constant cross section from the end of light incident side to an end of light exit side, and is arranged such that a center of rays of the incident light incident from the microlens on the end of light incident side of the waveguide is aligned with a central axis of the waveguide.
摘要:
There is provided a solid-state imaging device including a substrate of which surface is provided with a pixel area where a plurality of pixels arranged, each pixel including a photoelectric converting element to receive light from a subject image and perform photoelectric conversion on the received light to generate signal charge, and a surrounding area that is positioned around the pixel area and that includes a surrounding circuit to process the signal charge generated by the photoelectric converting elements. The solid-state imaging device includes a color filter facing the substrate so as to receive the light from the subject image in a surface corresponding to the surface of the substrate and to allow the light to transmit therethrough onto the surface of the substrate. The color filter includes a first colored layer and a second colored layer.
摘要:
There is disclosed a process for the production of 2-thiophene aldehydes, in which the 2-thiophene aldehydes are obtained by the formylation of thiophene or derivatives thereof with formamides and phosgene.
摘要:
A solid-state image sensing device includes a light receiving layer and a shutter layer. The light receiving layer has a photoelectric conversion part arranged in a plane state and configured to convert received light into an electric signal. The shutter layer is configured to control transmission of the light to be incident on the light receiving layer. In the solid-state image sensing device, an interval between the light receiving layer and the shutter layer is less than or equal to a length of a shutter element formed in the shutter layer.
摘要:
Disclosed is a solid-state image sensing device including: a first photoelectric conversion element having a first semiconductor region of a first conductivity type formed inside a semiconductor substrate; a second photoelectric conversion element having a second semiconductor region of a first conductivity type formed at a deeper position of the semiconductor substrate than the first photoelectric conversion element; a gate electrode laminated on the semiconductor substrate and to which a predetermined voltage is applied at a charge transfer time; a floating diffusion region to which the charges accumulated in the first photoelectric conversion element and the second photoelectric conversion element are transferred at the charge transfer time; and a third semiconductor region of a first conductivity type arranged between the first semiconductor region and the second semiconductor region in a depth direction of the semiconductor.
摘要:
A display apparatus includes scanning lines; signal lines crossing the scanning lines; thin-film transistors connected to the scanning lines and the signal lines; capacitors connected to the thin-film transistors; interlayer insulating films disposed over the scanning lines with the signal lines, the thin-film transistors, and the capacitors disposed between or on the interlayer insulating films; upper interlayer insulating films disposed above the signal lines, the thin-film transistors, and the capacitors; common lines disposed between or on the upper interlayer insulating films; pixel electrodes disposed between or on the upper interlayer insulating films; and connection holes continuously penetrating the interlayer insulating films disposed between the common lines and the capacitors. The common lines and the capacitors are directly connected via the connection holes, and the connection holes have a ratio of depth to opening width of more than 1.
摘要:
There is provided a solid-state imaging device including a substrate of which surface is provided with a pixel area where a plurality of pixels arranged, each pixel including a photoelectric converting element to receive light from a subject image and perform photoelectric conversion on the received light to generate signal charge, and a surrounding area that is positioned around the pixel area and that includes a surrounding circuit to process the signal charge generated by the photoelectric converting elements. The solid-state imaging device includes a color filter facing the substrate so as to receive the light from the subject image in a surface corresponding to the surface of the substrate and to allow the light to transmit therethrough onto the surface of the substrate. The color filter includes a first colored layer and a second colored layer.