Semiconductor device and method for fabricating the same
    1.
    发明申请
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US20060086971A1

    公开(公告)日:2006-04-27

    申请号:US11152114

    申请日:2005-06-15

    IPC分类号: H01L29/792 H01L21/336

    摘要: A semiconductor device includes a memory section formed at a semiconductor substrate and including a first transistor having an ONO film that can store charges between the semiconductor substrate and a memory electrode and a first STI region for isolating the first transistor, and a CMOS section formed at the semiconductor substrate and including a second transistor having a CMOS electrode and a gate dielectric and a second STI region for isolating the second transistor. The height of the top surface of the first STI region is set equal to or smaller than the height of the top surface of the second STI region.

    摘要翻译: 一种半导体器件包括形成在半导体衬底上的存储器部分,并且包括具有可存储半导体衬底和存储电极之间的电荷的ONO膜的第一晶体管和用于隔离第一晶体管的第一STI区域和形成在 半导体衬底并且包括具有CMOS电极和栅极电介质的第二晶体管和用于隔离第二晶体管的第二STI区域。 第一STI区域的顶表面的高度被设定为等于或小于第二STI区域的顶表面的高度。

    Semiconductor device and method for fabricating the same
    2.
    发明授权
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US07781291B2

    公开(公告)日:2010-08-24

    申请号:US12551848

    申请日:2009-09-01

    IPC分类号: H01L21/336

    摘要: A semiconductor device includes a memory section formed at a semiconductor substrate and including a first transistor having an ONO film that can store charges between the semiconductor substrate and a memory electrode and a first STI region for isolating the first transistor, and a CMOS section formed at the semiconductor substrate and including a second transistor having a CMOS electrode and a gate dielectric and a second STI region for isolating the second transistor. The height of the top surface of the first STI region is set equal to or smaller than the height of the top surface of the second STI region.

    摘要翻译: 一种半导体器件包括形成在半导体衬底上的存储器部分,并且包括具有可存储半导体衬底和存储电极之间的电荷的ONO膜的第一晶体管和用于隔离第一晶体管的第一STI区域和形成在 半导体衬底并且包括具有CMOS电极和栅极电介质的第二晶体管和用于隔离第二晶体管的第二STI区域。 第一STI区域的顶表面的高度被设定为等于或小于第二STI区域的顶表面的高度。

    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    3.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20090317955A1

    公开(公告)日:2009-12-24

    申请号:US12551848

    申请日:2009-09-01

    IPC分类号: H01L21/336

    摘要: A semiconductor device includes a memory section formed at a semiconductor substrate and including a first transistor having an ONO film that can store charges between the semiconductor substrate and a memory electrode and a first STI region for isolating the first transistor, and a CMOS section formed at the semiconductor substrate and including a second transistor having a CMOS electrode and a gate dielectric and a second STI region for isolating the second transistor. The height of the top surface of the first STI region is set equal to or smaller than the height of the top surface of the second STI region.

    摘要翻译: 一种半导体器件包括形成在半导体衬底上的存储器部分,并且包括具有可存储半导体衬底和存储电极之间的电荷的ONO膜的第一晶体管和用于隔离第一晶体管的第一STI区域和形成在 半导体衬底并且包括具有CMOS电极和栅极电介质的第二晶体管和用于隔离第二晶体管的第二STI区域。 第一STI区域的顶表面的高度被设定为等于或小于第二STI区域的顶表面的高度。

    Semiconductor device
    4.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US07598589B2

    公开(公告)日:2009-10-06

    申请号:US11152114

    申请日:2005-06-15

    IPC分类号: H01L27/105

    摘要: A semiconductor device includes a memory section formed at a semiconductor substrate and including a first transistor having an ONO film that can store charges between the semiconductor substrate and a memory electrode and a first STI region for isolating the first transistor, and a CMOS section formed at the semiconductor substrate and including a second transistor having a CMOS electrode and a gate dielectric and a second STI region for isolating the second transistor. The height of the top surface of the first STI region is set equal to or smaller than the height of the top surface of the second STI region.

    摘要翻译: 一种半导体器件包括形成在半导体衬底上的存储器部分,并且包括具有可存储半导体衬底和存储电极之间的电荷的ONO膜的第一晶体管和用于隔离第一晶体管的第一STI区域和形成在 半导体衬底并且包括具有CMOS电极和栅极电介质的第二晶体管和用于隔离第二晶体管的第二STI区域。 第一STI区域的顶表面的高度被设定为等于或小于第二STI区域的顶表面的高度。

    Method for fabricating semiconductor device
    5.
    发明授权
    Method for fabricating semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US07951679B2

    公开(公告)日:2011-05-31

    申请号:US11187958

    申请日:2005-07-25

    IPC分类号: H01L21/336

    CPC分类号: H01L27/115 H01L27/11568

    摘要: First, on a semiconductor region of a first conductivity type, a trapping film is formed which stores information by accumulating charges. Then, the trapping film is formed with a plurality of openings, and impurity ions of a second conductivity type are implanted into the semiconductor region from the formed openings, thereby forming a plurality of diffused layers of the second conductivity type in portions of the semiconductor region located below the openings, respectively. An insulating film is formed to cover edges of the trapping film located toward the openings, and then the semiconductor region is subjected to a thermal process in an atmosphere containing oxygen to oxidize upper portions of the diffused layers. Thereby, insulating oxide films are formed in the upper portions of the diffused layers, respectively. Subsequently, a conductive film is formed over the trapping film including the edges thereof to form an electrode.

    摘要翻译: 首先,在第一导电类型的半导体区域上,形成通过累积电荷来存储信息的捕获膜。 然后,捕获膜形成有多个开口,并且第二导电类型的杂质离子从形成的开口注入到半导体区域中,从而在半导体区域的部分中形成多个第二导电类型的扩散层 分别位于开口下方。 形成绝缘膜以覆盖位于开口的捕获膜的边缘,然后在含氧气氛中对半导体区域进行热处理,以氧化扩散层的上部。 因此,绝缘氧化膜分别形成在扩散层的上部。 随后,在包括其边缘的捕获膜上形成导电膜以形成电极。

    Method for fabricating semiconductor device
    6.
    发明申请
    Method for fabricating semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US20060035418A1

    公开(公告)日:2006-02-16

    申请号:US11187958

    申请日:2005-07-25

    IPC分类号: H01L21/84 H01L21/00

    CPC分类号: H01L27/115 H01L27/11568

    摘要: First, on a semiconductor region of a first conductivity type, a trapping film is formed which stores information by accumulating charges. Then, the trapping film is formed with a plurality of openings, and impurity ions of a second conductivity type are implanted into the semiconductor region from the formed openings, thereby forming a plurality of diffused layers of the second conductivity type in portions of the semiconductor region located below the openings, respectively. An insulating film is formed to cover edges of the trapping film located toward the openings, and then the semiconductor region is subjected to a thermal process in an atmosphere containing oxygen to oxidize upper portions of the diffused layers. Thereby, insulating oxide films are formed in the upper portions of the diffused layers, respectively. Subsequently, a conductive film is formed over the trapping film including the edges thereof to form an electrode.

    摘要翻译: 首先,在第一导电类型的半导体区域上,形成通过累积电荷来存储信息的捕获膜。 然后,捕获膜形成有多个开口,并且第二导电类型的杂质离子从形成的开口注入到半导体区域中,从而在半导体区域的部分中形成多个第二导电类型的扩散层 分别位于开口下方。 形成绝缘膜以覆盖位于开口的捕获膜的边缘,然后在含氧气氛中对半导体区域进行热处理,以氧化扩散层的上部。 因此,绝缘氧化膜分别形成在扩散层的上部。 随后,在包括其边缘的捕获膜上形成导电膜以形成电极。

    SEMICONDUCTOR DEVICE HAVING DIFFUSION LAYERS AS BIT LINES AND METHOD FOR MANUFACTURING THE SAME
    10.
    发明申请
    SEMICONDUCTOR DEVICE HAVING DIFFUSION LAYERS AS BIT LINES AND METHOD FOR MANUFACTURING THE SAME 失效
    具有扩展层作为位线的半导体器件及其制造方法

    公开(公告)号:US20090104765A1

    公开(公告)日:2009-04-23

    申请号:US12337023

    申请日:2008-12-17

    IPC分类号: H01L21/768

    CPC分类号: H01L27/11568 H01L27/115

    摘要: A semiconductor device includes: a semiconductor region; a plurality of bit line diffusion layers formed in an upper portion of the semiconductor region and each extending in a row direction; a plurality of bit line insulating films formed on the bit line diffusion layers; a plurality of gate insulting films formed between the respective adjacent bit line diffusion layers on the semiconductor region; and a plurality of word lines each formed on the semiconductor region in a column direction and each intersecting with the bit line insulating films and the gate insulating films. Memory cells are formed at intersections of the gate insulating films and the word lines. A plurality of connection diffusion layers including connection parts electrically connected to the bit line diffusion layers are formed in the upper portion of the semiconductor region, and a level of upper faces of the connection parts is lower than a level of upper faces of the connection diffusion layers in the semiconductor region.

    摘要翻译: 半导体器件包括:半导体区域; 多个位线扩散层,其形成在所述半导体区域的上部,并且各自沿行方向延伸; 形成在位线扩散层上的多个位线绝缘膜; 形成在所述半导体区域上的各个相邻位线扩散层之间的多个栅极绝缘膜; 以及多个字线,各自在列方向上形成在半导体区域上,并且与字线绝缘膜和栅极绝缘膜交叉。 存储单元形成在栅极绝缘膜和字线的交点处。 包括与位线扩散层电连接的连接部分的多个连接扩散层形成在半导体区域的上部,并且连接部分的上表面的电平低于连接扩散部的上表面的高度 半导体区域中的层。