摘要:
A liquid processing apparatus 1 comprises a casing 5, a substrate holding mechanism 20 that holds a wafer (substrate to be processed) W, a process-liquid supplying mechanism 30 that supplies a process liquid, a draining cup 12 that receives a process liquid, and a draining pipe 13 that discharges a process liquid outside. The process-liquid supplying mechanism 30 includes a first chemical-liquid supply mechanism that supplies a hydrofluoric process liquid, and a drying-liquid supplying mechanism that supplies an organic solvent for drying a wafer W. A control part 50 causes the first chemical-liquid supplying mechanism to supply a hydrofluoric process liquid, and then causes the drying-liquid supplying mechanism to supply an organic solvent. In addition, before the control part 50 causes the drying-liquid supplying mechanism to supply an organic solvent, the control part causes a cleaning mechanism 10 to remove an alkaline component in a casing 5.
摘要:
A liquid processing apparatus includes: a hollow holding plate configured to hold an object to be processed; a hollow outer rotational shaft fixedly connected to the holding plate; a rotary drive part configured to rotate the outer rotational shaft; and a lift pin plate disposed in a hollow space of the holding plate, and having a lift pin configured to support the object to be processed. Inside the lift pin plate, a cleaning-liquid supply part configured to supply a cleaning liquid is extended. Connected to the lift pin plate is a lifting member configured to locate the lift pin plate on an upper position and a lower position. When located on the lower position, the lift pin plate receives a force of the rotary drive part for rotating the outer rotational shaft so that the lift pin plate is rotated.
摘要:
A liquid processing apparatus includes: a hollow holding plate configured to hold an object to be processed; a hollow outer rotational shaft fixedly connected to the holding plate; a rotary drive part configured to rotate the outer rotational shaft; and a lift pin plate disposed in a hollow space of the holding plate, and having a lift pin configured to support the object to be processed. Inside the lift pin plate, a cleaning-liquid supply part configured to supply a cleaning liquid is extended. Connected to the lift pin plate is a lifting member configured to locate the lift pin plate on an upper position and a lower position. When located on the lower position, the lift pin plate receives a force of the rotary drive part for rotating the outer rotational shaft so that the lift pin plate is rotated.
摘要:
A liquid processing apparatus includes: a hollow holding plate to hold an object to be processed; a hollow outer rotary shaft fixedly joined to the holding plate; a lift pin plate having a lift pin to support the object; an inner rotary shaft fixedly joined to the lift pin plate; and a lifting member to raise and lower the lift pin plate to locate the lift pin plate on an upper position and a lower position. Inside the inner rotary shaft, there is disposed a cleaning-liquid supply part to supply a cleaning liquid to the object to be processed. An outer rotary drive part is joined to the outer rotary shaft, the outer rotary drive part being configured to rotate the outer rotary shaft. An inner rotary drive part is joined to the inner rotary shaft, the inner rotary drive part being configured to rotate the inner rotary shaft.
摘要:
A liquid processing apparatus 1 comprises a casing 5, a substrate holding mechanism 20 that holds a wafer (substrate to be processed) W, a process-liquid supplying mechanism 30 that supplies a process liquid, a draining cup 12 that receives a process liquid, and a draining pipe 13 that discharges a process liquid outside. The process-liquid supplying mechanism 30 includes a first chemical-liquid supply mechanism that supplies a hydrofluoric process liquid, and a drying-liquid supplying mechanism that supplies an organic solvent for drying a wafer W. A control part 50 causes the first chemical-liquid supplying mechanism to supply a hydrofluoric process liquid, and then causes the drying-liquid supplying mechanism to supply an organic solvent. In addition, before the control part 50 causes the drying-liquid supplying mechanism to supply an organic solvent, the control part causes a cleaning mechanism 10 to remove an alkaline component in a casing 5.
摘要:
Provided is an organic electroluminescent element superior in long-term durability and lifetime characteristics. The organic electroluminescent element has a structure where plurality of light-emitting layers formed via an intermediate layer are interposed between a positive electrode and a negative electrode. The intermediate layer has a mixed layer, a first layer, and a hole-injection layer which are formed in this order from the positive electrode to the negative electrode, the mixed layer containing an electron-donating substance and an electron-transporting organic material, and the first layer being made of an electron-transporting material. The first layer has a thickness in a range of 0.2 to 2.0 nm. The hole-injection layer consists of an electro-accepting organic material.
摘要:
The liquid processing apparatus includes: a liquid supply mechanism; a supply line connected to the liquid supply mechanism, the supply line having a discharge opening for discharging a temperature-regulated liquid; a processing unit supporting the discharge opening of the supply line; a return line configured to return the liquid supplied to the supply line to the liquid supply mechanism; and a liquid-supply switching valve configured to switch between supply of the liquid, which is used in a processing of an object to be processed in the processing unit, and stoppage of the liquid supply. The liquid-supply switching valve is disposed on the supply line on a route of the liquid returning from the supply line to the liquid supply mechanism through the return line.
摘要:
A top plate 32 is provided with a top plate rotation mechanism configured to rotate the top plate 32 in a horizontal plane. An outside cup peripheral case 50 disposed around a cup 40 is configured to move between an upper position, in which a top end of the cylinder 50 is positioned above the cup 40, and a lower position located below the upper position. A nozzle support arm 82 configured to support a nozzle 82a is moved, in a horizontal direction, between an advanced position, in which the arm 82 is advanced into the outside cup peripheral case 50 via a side opening 50m formed in a side surface of the outside cup peripheral case 50 when the cylinder 50 is located in the upper position, and a retracted position, in which the arm 82 is retracted outward from the outside cup peripheral case 50.
摘要:
Disclosed is a liquid treatment apparatus capable of effectively exhausting processing liquid atmosphere around a target object. The liquid treatment apparatus includes a container, a support part located within the container that supports the target object, a rotation driving mechanism to rotate the target object supported by the support part, a processing liquid supply mechanism to supply a processing liquid to the target object, and a rotation cup, which is located outside of the outer circumference of the target object and is rotatable together with the support part. A rotation exhaust cup is arranged above the rotation cup and is rotatable together with the rotation cup. A discharge mechanism discharges processing liquid atmosphere guided by the rotation cup and the rotation exhaust cup.
摘要:
A liquid treatment device having a substrate holding section (2) for horizontally holding a wafer (W) and capable of rotating with the wafer (W), a rotation cup (4) having an annular shape so as to surround the wafer (W) held by the substrate holding section (2) and capable of rotating with the wafer (W), a rotation mechanism (3) for integrally rotating the rotation cup (4) and the substrate holding section (2), a nozzle (5) for supplying a treatment liquid for the wafer (W) and a cleaning liquid for the rotation cup (4), a liquid supply section (85) for supplying the treatment liquid and cleaning liquid to the nozzle (5), and a nozzle movement mechanism for moving the nozzle (5) between a first position at which the liquid is discharged to the wafer (W) and a second position at which the liquid is discharged to an external portion of the rotation cup (4). The wafer (W) is treated with the liquid with the nozzle (5) positioned at the wafer treatment position, and the cleaning liquid is discharged to the external portion of the rotation cup with the nozzle (5) positioned at the rotation cup cleaning position.