摘要:
In a communication system using an IP tunnel for communication between application processing apparatuses (hereinafter, processing apparatuses), an application can be moved to an arbitrary processing apparatus, update of tunnel tables included in the respective processing apparatuses is quickly performed, and a buffer for waiting for packets during the table update is made small. A redundancy managing apparatus manages a correspondence between a virtual IP address (VIP) of an application in a communication system and an IP address (RIP) of an processing apparatus to execute the application. The processing apparatus notifies the VIP of the communication partner application of the application to the redundancy managing apparatus. The redundancy managing apparatus notifies the VIP of the communication partner application of the moved application and the RIP of the processing apparatus to execute the communication partner application to the processing apparatus of the movement destination (failover destination) of the application.
摘要:
In a communication system using an IP tunnel for communication between application processing apparatuses (hereinafter, processing apparatuses), an application can be moved to an arbitrary processing apparatus, update of tunnel tables included in the respective processing apparatuses is quickly performed, and a buffer for waiting for packets during the table update is made small. A redundancy managing apparatus manages a correspondence between a virtual IP address (VIP) of an application in a communication system and an IP address (RIP) of an processing apparatus to execute the application. The processing apparatus notifies the VIP of the communication partner application of the application to the redundancy managing apparatus. The redundancy managing apparatus notifies the VIP of the communication partner application of the moved application and the RIP of the processing apparatus to execute the communication partner application to the processing apparatus of the movement destination (failover destination) of the application.
摘要:
In a defect inspecting apparatus, the strength of a fatal defect signal decreases due to miniaturization. Thus, in order to assure a high SN ratio, it is necessary to reduce noises caused by scattered light from a wafer. Roughness of a pattern edge and surface roughness which serve as a scattered-light source are spread over the entire wafer. The present invention has discovered the fact that reduction of an illuminated area is a technique effective for decreasing noises. That is to say, the present invention has discovered the fact that creation of an illuminated area having a spot shape and reduction of the dimension of a spot beam are effective. A plurality of temporally and spatially divided spot beams are radiated to the wafer serving as a sample.
摘要:
An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.
摘要:
A pattern defect inspection apparatus capable of detecting minute defects on a sample with high sensitivity without generating speckle noise in signals is realized. Substantially the same region on a surface of a wafer is detected by using two detectors at mutually different timings. Output signals from the two detectors are summed and averaged to eliminate noise. Since a large number of rays of illumination light are not simultaneously irradiated to the same region on the wafer, a pattern defect inspection apparatus capable of suppressing noise resulting from interference of a large number of rays, eliminating noise owing to other causes and detecting with high sensitivity minute defects on the sample without the occurrence of speckle noise in the signal can be accomplished.
摘要:
An evaporation apparatus that is capable of stably forming a good quality thin film and is highly suitable for mass production is provided. The evaporation apparatus include an evaporation source discharging an evaporation material by heating, a retention member retaining an evaporation object, and a heat shield member that is located between the evaporation source and the evaporation object retained by the retention member, has an opening for passing the evaporation material in a state of vapor phase from the evaporation source to the evaporation object, and shields the evaporation object from part of radiation heat of the evaporation source. The heat shield member is located closer to the evaporation source than to the retention member.
摘要:
The present invention provides an inspection apparatus and inspection method. The inspection apparatus includes a stage mechanism for supporting an object under inspection. A spatial filter is provided in the detection optical system to inspect the object. A printer is used to print the results of the spatial filter. The spatial filter can be provided in the form of a Fourier transformed image.
摘要:
A system for monitoring foreign matter includes a manufacturing line having plural process processing apparatuses, a production management system which manages the processing of workpieces in the manufacturing line, plural optical heads which monitor foreign matter in relation to at least one of the workpieces, and which provide an output signal indicative thereof, and at least one image signal processing unit provided in a lesser number than a number of the plural optical heads for processing the output signal therefrom.
摘要:
An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.
摘要:
The present invention provides an apparatus and a method for reviewing a defect with high throughput by detecting the defect to be reviewed with high sensitivity, comprising: an optical microscope; a correction means; and a scanning electron microscope which reviews the existing defect on the sample; wherein the optical microscope has: an optical height detection system which optically detects a vertical position of an upper surface of the sample placed on the stage; an illumination optical system which illuminates the defect with light; an image detection optical system which converges and detects reflected light or scattered light generated from the defect illuminated by the illumination optical system to obtain an image signal; and a focus adjusting means which adjusts a focus position of the optical microscope based on the vertical position of the upper surface of the sample, which is detected by the optical height detection system.