Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, and printed wiring board fabrication method
    1.
    发明授权
    Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, and printed wiring board fabrication method 失效
    感光树脂组合物,使用它的感光元件,抗蚀剂图案形成方法和印刷线路板制造方法

    公开(公告)号:US07067228B2

    公开(公告)日:2006-06-27

    申请号:US10311692

    申请日:2001-06-22

    IPC分类号: G03F7/00

    CPC分类号: G03F7/033 G03F7/027 G03F7/032

    摘要: A photosensitive resin composition which comprises (A) a binder polymer, (B) a photopolymerizing compound having at least one ethylenic unsaturated bond in the molecule and (C) a photopolymerization initiator, wherein the binder polymer as component (A) comprises two or more binder polymers and/or has a dispersity of 2.5-6.0, and wherein the photopolymerizing compound as component (B) has in the molecule at least one ethylene glycol chain and at least one C3-C6 alkylene glycol chain.

    摘要翻译: 1.一种感光性树脂组合物,其含有(A)粘合剂聚合物,(B)分子中具有至少一个烯键式不饱和键的光聚合化合物和(C)光聚合引发剂,其中,作为组分(A)的粘合剂聚合物包含两种或更多种 粘合剂聚合物和/或具有2.5-6.0的分散性,并且其中组分(B)的光聚合化合物在分子中具有至少一个乙二醇链和至少一个C 3 -C > 6亚烷基二醇链。

    Photosensitive resin composition, photosensitive element, production method of resist pattern and production method for printed circuit board
    3.
    发明授权
    Photosensitive resin composition, photosensitive element, production method of resist pattern and production method for printed circuit board 有权
    光敏树脂组合物,感光元件,抗蚀剂图案的制造方法和印刷电路板的制造方法

    公开(公告)号:US07517636B2

    公开(公告)日:2009-04-14

    申请号:US10296911

    申请日:2001-05-29

    摘要: A photosensitive resin composition is here disclosed which satisfies the following (1) and (2): (1) when a 1.0 wt % aqueous sodium carbonate solution is sprayed by a spray on a layer of the photosensitive resin composition having a thickness of 37 to 42 μm under the following conditions, the photosensitive resin composition layer being able to be removed within 20 seconds, the above conditions being that an internal diameter of a nozzle of the spray is 1.2 mm, a spraying pressure is 0.05 MPa, and a distance between a point of the spray nozzle which is closest to the photosensitive resin composition layer and the photosensitive resin composition layer is 50 mm; and (2) when the 1.0 wt % aqueous sodium carbonate solution is sprayed three times for 36 seconds under the above conditions on a cured film obtained by laminating a layer of the photosensitive resin composition having the above thickness on a copper-clad laminate having 18 three-continuous holes in which 3 holes each having a diameter of 6 mm are continuously integrated and which has a length of 16 mm, and then photo-curing the layer with an exposure capable of curing 24 steps in a 41-step tablet, the number of holes where the cured film is broken being 5 or less.

    摘要翻译: 这里公开了满足以下(1)和(2)的感光性树脂组合物:(1)当通过喷雾将1.0重量%的碳酸钠水溶液喷涂在厚度为37的感光性树脂组合物的层上时, 在下述条件下,在20秒内能够除去感光性树脂组合物层,上述条件是喷雾喷嘴的内径为1.2mm,喷射压力为0.05MPa, 最靠近感光性树脂组合物层和感光性树脂组合物层的喷嘴的点为50mm; 和(2)当在上述条件下将1.0重量%碳酸钠水溶液喷涂三次36秒钟时,在通过将具有上述厚度的感光性树脂组合物层层叠在具有18层的覆铜层压板上而获得的固化膜上 三连续的孔,其中每个具有6mm直径的3个孔连续地一体化并且具有16mm的长度,然后在41步片剂中以能够固化24步的曝光对该层进行光固化, 固化膜断裂的孔数为5个以下。