METHODS FOR FORMING AN UNDERCUT REGION AND ELECTRONIC DEVICES INCORPORATING THE SAME
    1.
    发明申请
    METHODS FOR FORMING AN UNDERCUT REGION AND ELECTRONIC DEVICES INCORPORATING THE SAME 失效
    形成下属区域的方法和包含该方法的电子设备

    公开(公告)号:US20080210931A1

    公开(公告)日:2008-09-04

    申请号:US11840392

    申请日:2007-08-17

    IPC分类号: H01L51/50

    摘要: An electronic device having a substrate structure having an undercut region is provided and further included is a method for forming an undercut region of a substrate structure. The method includes forming a patterned protective layer over a first electrode. The method also includes forming the substrate structure over the patterned protective layer. An opening within the substrate structure overlies an exposed portion of the substrate structure. The method further includes removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming an undercut region of the substrate structure. The method still further includes depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer, and solidifying the liquid to form a solid layer.

    摘要翻译: 提供具有底切区域的基板结构的电子设备,并且还包括用于形成基板结构的底切区域的方法。 该方法包括在第一电极上形成图案化保护层。 该方法还包括在图案化的保护层上形成衬底结构。 衬底结构内的开口覆盖衬底结构的暴露部分。 该方法还包括去除图案化保护层的暴露部分,从而暴露第一电极的一部分并形成衬底结构的底切区域。 该方法还包括在去除图案化保护层的暴露部分之后,在第一电极上沉积液体,并固化液体以形成固体层。

    Methods for forming an undercut region and electronic devices incorporating the same
    2.
    发明授权
    Methods for forming an undercut region and electronic devices incorporating the same 失效
    形成底切区域的方法和包含该切削区域的电子装置

    公开(公告)号:US07732810B2

    公开(公告)日:2010-06-08

    申请号:US11840392

    申请日:2007-08-17

    IPC分类号: H01L51/50

    摘要: An electronic device having a substrate structure having an undercut region is provided and further included is a method for forming an undercut region of a substrate structure. The method includes forming a patterned protective layer over a first electrode. The method also includes forming the substrate structure over the patterned protective layer. An opening within the substrate structure overlies an exposed portion of the substrate structure. The method further includes removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming an undercut region of the substrate structure. The method still further includes depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer, and solidifying the liquid to form a solid layer.

    摘要翻译: 提供具有底切区域的基板结构的电子设备,并且还包括用于形成基板结构的底切区域的方法。 该方法包括在第一电极上形成图案化保护层。 该方法还包括在图案化的保护层上形成衬底结构。 衬底结构内的开口覆盖衬底结构的暴露部分。 该方法还包括去除图案化保护层的暴露部分,从而暴露第一电极的一部分并形成衬底结构的底切区域。 该方法还包括在去除图案化保护层的暴露部分之后,在第一电极上沉积液体,并固化液体以形成固体层。

    Electronic device including a guest material within a layer and a process for forming the same
    3.
    发明授权
    Electronic device including a guest material within a layer and a process for forming the same 有权
    包括层内的客体材料的电子设备及其形成方法

    公开(公告)号:US07268006B2

    公开(公告)日:2007-09-11

    申请号:US11026732

    申请日:2004-12-30

    IPC分类号: H01L21/20

    摘要: A process for forming an electronic device includes forming a first layer over a substrate and placing a first liquid composition over a first portion of the first layer. The first liquid composition includes at least a first guest material and a first liquid medium. The first liquid composition comes in contact with the first layer and a substantial amount of the first guest material intermixes with the first layer. An electronic device includes a substrate and a continuous first layer overlying the substrate. The continuous layer includes a first portion in which an electronic component lies and a second portion where no electronic component lies. The first portion is at least 30 nm thick and includes a first guest material, and the second portion is no more than 40 nm thick.

    摘要翻译: 一种用于形成电子器件的方法包括在衬底上形成第一层并将第一液体组合物置于第一层的第一部分上。 第一液体组合物包括至少第一客体材料和第一液体介质。 第一液体组合物与第一层接触并且大量的第一客体材料与第一层混合。 电子器件包括衬底和覆盖衬底的连续的第一层。 连续层包括电子部件所在的第一部分和没有电子部件所在的第二部分。 第一部分为至少30nm厚,并且包括第一客体材料,并且第二部分不超过40nm厚。

    SECURITY DEVICE
    4.
    发明申请
    SECURITY DEVICE 有权
    安全装置

    公开(公告)号:US20120068450A1

    公开(公告)日:2012-03-22

    申请号:US13203389

    申请日:2010-02-26

    IPC分类号: B42D15/00

    摘要: A security device for authenticating bank notes, documents and other items, comprises a luminescent material for producing luminescent radiation of first and second wavelengths. The security device includes an optically variable structure for controlling emission of luminescent radiation of at least one of the first and second wavelengths from the security device, the security device being arranged to permit, from an area of the optically variable structure, emission of luminescence of the first and second wavelengths from the security device. The optically variable structure causes the relative emissivity of the security device for luminescent radiation of the first and second wavelengths to change with a change m emission angle, so that the security device produces an angle-dependent colour shift m the emitted luminescent radiation. The optically variable structure may comprise an optical interference stack that controls transmission of luminescent radiation therethrough in response to the wavelength of luminescent radiation.

    摘要翻译: 用于认证钞票,文件和其他物品的安全装置包括用于产生第一和第二波长的发光辐射的发光材料。 安全装置包括光学可变结构,用于控制来自安全装置的至少一个第一和第二波长的发光辐射,安全装置被布置成允许从光学可变结构的区域发射 来自安全装置的第一和第二波长。 光学可变结构使得第一和第二波长的发光辐射的安全装置的相对发射率随着变化m发射角度而改变,使得安全装置在发射的发光辐射中产生与角度相关的色移。 光学可变结构可以包括光学干涉叠层,其响应于发光辐射的波长来控制通过其的发光辐射的透射。

    Electronic device including space-apart radiation regions and a process for forming the same
    7.
    发明授权
    Electronic device including space-apart radiation regions and a process for forming the same 有权
    包括空间分开的辐射区域的电子设备及其形成方法

    公开(公告)号:US07795653B2

    公开(公告)日:2010-09-14

    申请号:US11644751

    申请日:2006-12-22

    IPC分类号: H01L31/062

    摘要: An electronic device can include a first radiation region, a second radiation region spaced apart from the first radiation region, and an insulating region. The insulating region can have a first side and a second side opposite the first side. The first radiation region can lie immediately adjacent to the first side, and the second radiation region can lie immediately adjacent to the second side. Within the insulating region, no other radiation region may lie between the first and second radiation regions, and the insulating region can include an insulating layer that includes a plurality of openings. In another aspect, a process for forming the electronic device can include patterning an insulating layer.

    摘要翻译: 电子设备可以包括第一辐射区域,与第一辐射区域间隔开的第二辐射区域和绝缘区域。 绝缘区域可以具有与第一侧相对的第一侧和第二侧。 第一辐射区域可以紧邻第一侧面,并且第二辐射区域可以紧邻第二侧面。 在绝缘区域内,在第一和第二辐射区域之间不会有其他辐射区域,并且绝缘区域可以包括包括多个开口的绝缘层。 另一方面,用于形成电子器件的方法可以包括图案化绝缘层。