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    TEMPERATURE CONTROLLED MULTI-GAS DISTRIBUTION ASSEMBLY
    1.
    发明申请
    TEMPERATURE CONTROLLED MULTI-GAS DISTRIBUTION ASSEMBLY 审中-公开
    温度控制多气体分配总成

    公开(公告)号：US20080099147A1

    公开(公告)日：2008-05-01

    申请号：US11553340

    申请日：2006-10-26

    申请人： Nyi Oo Myo ,  Steven Poppe ,  George Mattinger

    发明人： Nyi Oo Myo ,  Steven Poppe ,  George Mattinger

    IPC分类号： C23F1/00 ,  C23C16/00

    CPC分类号： C23C16/45565 ,  C23C16/45572 ,  C23C16/45574

    摘要： An apparatus and method for a gas distribution plate is provided. The gas distribution plate has a first manifold which includes a plurality of concentric channels for providing at least two distinct gases to a processing zone above a substrate. A portion of the plurality of channels perform a thermal control function and are separated from the remaining channels, which provide separated gas flow channels within the gas distribution plate. The gas flow channels are in fluid communication with a second manifold which includes a plurality of concentric rings. Apertures formed in the rings are in fluid communication with the gas flow channels and the processing zone. The gases are provided to the processing zone above the substrate, and do not mix within the gas distribution plate.

    摘要翻译： 提供了一种用于气体分配板的装置和方法。 气体分配板具有第一歧管，其包括多个同心通道，用于向衬底上方的处理区域提供至少两种不同的气体。 多个通道的一部分执行热控制功能，并且与剩余的通道分离，其在气体分配板内提供分离的气体流动通道。 气体流动通道与包括多个同心环的第二歧管流体连通。 形成在环中的孔与气体流动通道和处理区流体连通。 气体被提供到衬底上方的处理区域，并且不在气体分布板内混合。

    Small footprint modular processing system
    2.
    发明申请
    Small footprint modular processing system 审中-公开
    小尺寸模块化处理系统

    公开(公告)号：US20080019806A1

    公开(公告)日：2008-01-24

    申请号：US11491577

    申请日：2006-07-24

    申请人： Nyi Oo Myo ,  Steven Poppe ,  Anthony White ,  Nety M. Krishna

    发明人： Nyi Oo Myo ,  Steven Poppe ,  Anthony White ,  Nety M. Krishna

    IPC分类号： H01L21/677

    CPC分类号： H01L21/67196

    摘要： A method and apparatus for a modular processing system is described. The apparatus includes a transfer chamber as the foundation for the system and includes sidewalls adapted to receive at least three 200 mm and/or 300 mm process chambers. The transfer chamber includes a robot capable of withstanding high temperatures and is configured to transfer 200 mm and 300 mm substrates. The modularity of the transfer chamber is highly transportable and provides a research and development platform at a low cost of ownership and may be modularly built into a production system as additional chambers and peripheral hardware is added.

    摘要翻译： 描述了用于模块化处理系统的方法和装置。 该装置包括作为系统的基础的传送室，并且包括适于容纳至少三个200mm和/或300mm处理室的侧壁。 传送室包括能承受高温的机器人，并被配置成传送200mm和300mm的基片。 传送室的模块化高度可移植，并以低成本提供研发平台，并且可以将模块化内置在生产系统中，因为添加了附加的室和外围硬件。