公开(公告)号：US10211243B2

公开(公告)日：2019-02-19

申请号：US15945541

申请日：2018-04-04

Applicant: OmniVision Technologies, Inc.

Inventor： Chia-Chun Miao ,  Yin Qian ,  Chao-Hung Lin ,  Chen-Wei Lu ,  Dyson H. Tai ,  Ming Zhang ,  Jin Li

IPC: H01L31/0203 ,  H01L27/146

Abstract: A method of image sensor package fabrication includes providing an image sensor, including a pixel array disposed in a semiconductor material, and a first transparent shield adhered to the semiconductor material. The pixel array is disposed between the semiconductor material and the first transparent shield. A light blocking layer is deposited and disposed between lateral edges of the pixel array and lateral edges of the first transparent shield, and a second transparent shield is placed on the image sensor package, where the light blocking layer is disposed between the first transparent shield and the second transparent shield.

公开(公告)号：US20180226448A1

公开(公告)日：2018-08-09

申请号：US15945541

申请日：2018-04-04

Applicant: OmniVision Technologies, Inc.

Inventor： Chia-Chun Miao ,  Yin Qian ,  Chao-Hung Lin ,  Chen-Wei Lu ,  Dyson H. Tai ,  Ming Zhang ,  Jin Li

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687

Abstract: A method of image sensor package fabrication includes providing an image sensor, including a pixel array disposed in a semiconductor material, and a first transparent shield adhered to the semiconductor material. The pixel array is disposed between the semiconductor material and the first transparent shield. A light blocking layer is deposited and disposed between lateral edges of the pixel array and lateral edges of the first transparent shield, and a second transparent shield is placed on the image sensor package, where the light blocking layer is disposed between the first transparent shield and the second transparent shield.

公开(公告)号：US09966404B2

公开(公告)日：2018-05-08

申请号：US15430071

申请日：2017-02-10

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Chia-Chun Miao ,  Yin Qian ,  Chao-Hung Lin ,  Chen-Wei Lu ,  Dyson H. Tai ,  Ming Zhang ,  Jin Li

IPC: H01L31/0203 ,  H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687

Abstract: An image sensor package includes an image sensor with a pixel array disposed in a semiconductor material. A first transparent shield is adhered to the semiconductor material, and the pixel array is disposed between the semiconductor material and the first transparent shield. The image sensor package further includes a second transparent shield, where the first transparent shield is disposed between the pixel array and the second transparent shield. A light blocking layer is disposed between the first transparent shield and the second transparent shield, and the light blocking layer is disposed to prevent light from reflecting off edges of the first transparent shield into the pixel array.

公开(公告)号：US20170280075A1

公开(公告)日：2017-09-28

申请号：US15076911

申请日：2016-03-22

Applicant: OmniVision Technologies, Inc.

Inventor： Chao-Hung Lin ,  Hong Jun Li ,  Ping-Hsu Chen ,  Denis Chu

IPC: H04N5/357 ,  H01L27/146

CPC classification number: H04N5/3572 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14632

Abstract: An image sensor capable of capturing an image formed by a lens includes a substrate and a bonding wire. The substrate has a pixel array and a bonding pad on a top surface of the substrate between the pixel array and a substrate edge. The bonding wire is electrically connected to the bonding pad and has a region forming a non-zero angle with respect to the substrate top surface. The non-zero angle is in at least one of a lower and an upper angular range for minimizing reflection of incident light on the region from reaching the image sensor. The lower angular range is selected such that the region reflects the incident light away from the pixel array toward a plane including the lens. The upper angular range is selected such that the region reflects the incident light to a clearance between the bonding pad and the pixel array.

公开(公告)号：US10147751B2

公开(公告)日：2018-12-04

申请号：US15945530

申请日：2018-04-04

Applicant: OmniVision Technologies, Inc.

Inventor： Chia-Chun Miao ,  Yin Qian ,  Chao-Hung Lin ,  Chen-Wei Lu ,  Dyson H. Tai ,  Ming Zhang ,  Jin Li

IPC: H01L31/0203 ,  H01L27/146

Abstract: A method of image sensor package fabrication includes providing an image sensor, including a pixel array disposed in a semiconductor material, and a transparent shield adhered to the semiconductor material. The pixel array is disposed between the semiconductor material and the transparent shield. The method further includes removing portions of the transparent shield to form recessed regions in the transparent shield, where lateral bounds of the transparent shield extend beyond lateral bounds of the pixel array, and wherein the recessed regions are disposed in portions of the transparent shield that extend beyond the lateral bounds of the pixel array. The recessed regions are filled with a light blocking layer.

公开(公告)号：US20170317124A1

公开(公告)日：2017-11-02

申请号：US15430071

申请日：2017-02-10

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Chia-Chun Miao ,  Yin Qian ,  Chao-Hung Lin ,  Chen-Wei Lu ,  Dyson H. Tai ,  Ming Zhang ,  Jin Li

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687

Abstract: An image sensor package includes an image sensor with a pixel array disposed in a semiconductor material. A first transparent shield is adhered to the semiconductor material, and the pixel array is disposed between the semiconductor material and the first transparent shield. The image sensor package further includes a second transparent shield, where the first transparent shield is disposed between the pixel array and the second transparent shield. A light blocking layer is disposed between the first transparent shield and the second transparent shield, and the light blocking layer is disposed to prevent light from reflecting off edges of the first transparent shield into the pixel array.

公开(公告)号：US09781362B1

公开(公告)日：2017-10-03

申请号：US15076911

申请日：2016-03-22

Applicant: OmniVision Technologies, Inc.

Inventor： Chao-Hung Lin ,  Hong Jun Li ,  Ping-Hsu Chen ,  Denis Chu

IPC: H04N3/14 ,  H04N5/335 ,  H04N5/225 ,  H04N5/357 ,  H01L27/146

CPC classification number: H04N5/3572 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14632

Abstract: An image sensor capable of capturing an image formed by a lens includes a substrate and a bonding wire. The substrate has a pixel array and a bonding pad on a top surface of the substrate between the pixel array and a substrate edge. The bonding wire is electrically connected to the bonding pad and has a region forming a non-zero angle with respect to the substrate top surface. The non-zero angle is in at least one of a lower and an upper angular range for minimizing reflection of incident light on the region from reaching the image sensor. The lower angular range is selected such that the region reflects the incident light away from the pixel array toward a plane including the lens. The upper angular range is selected such that the region reflects the incident light to a clearance between the bonding pad and the pixel array.

公开(公告)号：US09608023B1

公开(公告)日：2017-03-28

申请号：US15144194

申请日：2016-05-02

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Chia-Chun Miao ,  Yin Qian ,  Chao-Hung Lin ,  Chen-Wei Lu ,  Dyson H. Tai ,  Ming Zhang ,  Jin Li

IPC: H01L31/0203 ,  H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687

Abstract: An image sensor package includes an image sensor with a pixel array disposed in a semiconductor material, and a transparent shield adhered to the semiconductor material. The pixel array is disposed between the semiconductor material and the transparent shield. A light blocking layer is disposed in recessed regions of the transparent shield, and the recessed regions are disposed on an illuminated side of the transparent shield. The light blocking layer is disposed to prevent light from reflecting off edges of the transparent shield into the image sensor.

公开(公告)号：US20180226447A1

公开(公告)日：2018-08-09

申请号：US15945530

申请日：2018-04-04

Applicant: OmniVision Technologies, Inc.

Inventor： Chia-Chun Miao ,  Yin Qian ,  Chao-Hung Lin ,  Chen-Wei Lu ,  Dyson H. Tai ,  Ming Zhang ,  Jin Li

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687

Abstract: A method of image sensor package fabrication includes providing an image sensor, including a pixel array disposed in a semiconductor material, and a transparent shield adhered to the semiconductor material. The pixel array is disposed between the semiconductor material and the transparent shield. The method further includes removing portions of the transparent shield to form recessed regions in the transparent shield, where lateral bounds of the transparent shield extend beyond lateral bounds of the pixel array, and wherein the recessed regions are disposed in portions of the transparent shield that extend beyond the lateral bounds of the pixel array. The recessed regions are filled with a light blocking layer.