公开(公告)号：US20150318326A1

公开(公告)日：2015-11-05

申请号：US14269879

申请日：2014-05-05

Applicant: OmniVision Technologies, Inc.

Inventor： Alan Martin ,  Edward Nabighian

IPC: H01L27/146

CPC classification number: H01L27/14687 ,  H01L27/14685 ,  H01L27/14698

Abstract: A wafer-level method for fabricating a plurality of cameras includes modifying an image sensor wafer to reduce risk of the image sensor wafer warping, and bonding the image sensor wafer to a lens wafer to form a composite wafer that includes the plurality of cameras. A wafer-level method for fabricating a plurality of cameras includes bonding an image sensor wafer to a lens wafer, using a pressure sensitive adhesive, to form a composite wafer that includes the plurality of cameras.

Abstract translation: 用于制造多个照相机的晶片级方法包括修改图像传感器晶片以降低图像传感器晶片翘曲的风险，以及将图像传感器晶片接合到透镜晶片以形成包括多个相机的复合晶片。 用于制造多个照相机的晶片级方法包括使用压敏粘合剂将图像传感器晶片连接到透镜晶片，以形成包括多个相机的复合晶片。

公开(公告)号：US10677964B2

公开(公告)日：2020-06-09

申请号：US15791006

申请日：2017-10-23

Applicant: OmniVision Technologies, Inc.

Inventor： Alan Martin ,  Edward Nabighian

IPC: G02B3/08 ,  G02B3/00 ,  G02B7/02 ,  G02B13/00

Abstract: A method for manufacturing a stepped spacer wafer for a wafer-level camera includes a step of measuring a plurality of focal lengths f1,2, . . . , N of a respective one of a plurality of lenses L1,2, . . . , N of a lens wafer. The method also includes a step of fabricating a stepped spacer wafer including (i) a plurality of apertures A1,2, . . . , N therethrough, and (ii) a plurality of thicknesses T1,2, . . . , N defining a respective thickness of the stepped spacer wafer at least partially surrounding a respective one of the plurality of apertures A1,2, . . . , N. Each of the plurality of thicknesses T1,2, . . . , N is equal to a difference between (a) a respective one of the plurality of focal lengths f1,2, . . . , N, and (b) a uniform thickness that is the same for each of the plurality of thicknesses.

公开(公告)号：US09368530B2

公开(公告)日：2016-06-14

申请号：US13773143

申请日：2013-02-21

Applicant: OmniVision Technologies, Inc.

Inventor： Guannho George Tsau ,  Edward Nabighian

IPC: H01L27/00 ,  H01L27/146 ,  G02B5/20

CPC classification number: H01L27/14621 ,  G02B5/201

Abstract: An apparatus including a pixel array including a plurality of pixels and a filter array positioned over the pixel array, the color filter array comprising a plurality of tiled minimal repeating units, each minimal repeating unit including a plurality of enmeshed filter sets, each filter set including a different set of colors than any other filter set in the filter array. Other embodiments are disclosed and claimed.

Abstract translation: 一种包括包括多个像素的像素阵列和位于所述像素阵列上方的滤光器阵列的装置，所述滤色器阵列包括多个平铺最小重复单元，每个最小重复单元包括多个嵌入式滤波器组，每个滤波器组包括 与过滤器阵列中设置的任何其他过滤器不同的一组颜色。 公开和要求保护其他实施例。

公开(公告)号：US20190121003A1

公开(公告)日：2019-04-25

申请号：US15791006

申请日：2017-10-23

Applicant: OmniVision Technologies, Inc.

Inventor： Alan Martin ,  Edward Nabighian

IPC: G02B3/00 ,  G02B7/02 ,  G02B13/00

Abstract: A method for manufacturing a stepped spacer wafer for a wafer-level camera includes a step of measuring a plurality of focal lengths f1,2, . . . , N of a respective one of a plurality of lenses L1,2, . . . , N of a lens wafer. The method also includes a step of fabricating a stepped spacer wafer including (i) a plurality of apertures A1,2, . . . , N therethrough, and (ii) a plurality of thicknesses T1,2, . . . , N defining a respective thickness of the stepped spacer wafer at least partially surrounding a respective one of the plurality of apertures A1,2, . . . , N. Each of the plurality of thicknesses T1,2, . . . , N is equal to a difference between (a) a respective one of the plurality of focal lengths f1,2, . . . , N, and (b) a uniform thickness that is the same for each of the plurality of thicknesses.

公开(公告)号：US09798114B2

公开(公告)日：2017-10-24

申请号：US14307255

申请日：2014-06-17

Applicant: OmniVision Technologies, Inc.

Inventor： Edward Nabighian ,  Alan Martin

IPC: G02B11/00 ,  G02B13/00 ,  G02B15/00 ,  G02B25/00 ,  G02B3/00 ,  G02B7/00 ,  G02B9/00 ,  G02B7/02 ,  B29C33/00 ,  B29L11/00

CPC classification number: G02B13/0085 ,  B29C33/0055 ,  B29L2011/0016 ,  G02B7/022

Abstract: Wafer-level optical elements and the concave spacer-wafer apertures in which they are formed are disclosed. The wafer-level optical elements include a spacer wafer comprising a plurality of apertures. Each aperture has a concave shape in a planar cross-section of the spacer wafer and an overflow region intersecting the planar cross-section. The wafer-level optical elements also include an array of optical elements, each optical element of the array being formed of cured flowable material within a respective one of the plurality of apertures. A portion of the cured flowable material forming each optical element extends into the overflow region of the respective aperture of the plurality of apertures. The spacer wafer includes a plurality of apertures, each of the plurality of apertures having a concave shape in a planar cross-section of the spacer wafer. Each of the plurality of apertures includes an overflow region intersecting the planar cross-section.

公开(公告)号：US09553126B2

公开(公告)日：2017-01-24

申请号：US14269879

申请日：2014-05-05

Applicant: OmniVision Technologies, Inc.

Inventor： Alan Martin ,  Edward Nabighian

IPC: H01L21/00 ,  H01L27/146

CPC classification number: H01L27/14687 ,  H01L27/14685 ,  H01L27/14698

Abstract: A wafer-level method for fabricating a plurality of cameras includes modifying an image sensor wafer to reduce risk of the image sensor wafer warping, and bonding the image sensor wafer to a lens wafer to form a composite wafer that includes the plurality of cameras. A wafer-level method for fabricating a plurality of cameras includes bonding an image sensor wafer to a lens wafer, using a pressure sensitive adhesive, to form a composite wafer that includes the plurality of cameras.

Abstract translation: 用于制造多个照相机的晶片级方法包括修改图像传感器晶片以降低图像传感器晶片翘曲的风险，以及将图像传感器晶片接合到透镜晶片以形成包括多个相机的复合晶片。 用于制造多个照相机的晶片级方法包括使用压敏粘合剂将图像传感器晶片连接到透镜晶片，以形成包括多个相机的复合晶片。

公开(公告)号：US09293505B2

公开(公告)日：2016-03-22

申请号：US14270281

申请日：2014-05-05

Applicant: OmniVision Technologies, Inc.

Inventor： Edward Nabighian ,  Yi Qin ,  Ward Zhang ,  Alan Martin

IPC: H01L27/146

CPC classification number: H01L27/14685 ,  H01L27/1462 ,  H01L27/14687

Abstract: A method for black coating camera cubes at wafer level includes expanding the gap between individual diced camera cubes of the wafer by stretching tape securing the diced camera cubes. The method includes applying a black coating layer to the stretched camera cubes, laser trimming undesired portions of the black coating layer, and removing the undesired portions of the black coating layer.

Abstract translation: 用于在晶片级黑色涂布相机立方体的方法包括通过固定切割的相机立方体的拉伸带扩大晶片的各个切割相机立方体之间的间隙。 该方法包括将黑色涂层施加到拉伸的相机立方体上，激光修整黑色涂层的不希望的部分，以及去除黑色涂层的不希望的部分。

公开(公告)号：US20150318325A1

公开(公告)日：2015-11-05

申请号：US14270281

申请日：2014-05-05

Applicant: OmniVision Technologies, Inc.

Inventor： Edward Nabighian ,  Yi Quin ,  Ward Zhang ,  Alan Martin

IPC: H01L27/146

CPC classification number: H01L27/14685 ,  H01L27/1462 ,  H01L27/14687

Abstract: A method for black coating camera cubes at wafer level includes expanding the gap between individual diced camera cubes of the wafer by stretching tape securing the diced camera cubes. The method includes applying a black coating layer to the stretched camera cubes, laser trimming undesired portions of the black coating layer, and removing the undesired portions of the black coating layer.

Abstract translation: 用于在晶片级黑色涂布相机立方体的方法包括通过固定切割的相机立方体的拉伸带扩大晶片的各个切割相机立方体之间的间隙。 该方法包括将黑色涂层施加到拉伸的相机立方体上，激光修整黑色涂层的不希望的部分，以及去除黑色涂层的不希望的部分。

公开(公告)号：US20140231621A1

公开(公告)日：2014-08-21

申请号：US13773143

申请日：2013-02-21

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Guannho George Tsau ,  Edward Nabighian

IPC: H01L27/146

CPC classification number: H01L27/14621 ,  G02B5/201

Abstract: An apparatus including a pixel array including a plurality of pixels and a filter array positioned over the pixel array, the color filter array comprising a plurality of tiled minimal repeating units, each minimal repeating unit including a plurality of enmeshed filter sets, each filter set including a different set of colors than any other filter set in the filter array. Other embodiments are disclosed and claimed.

Abstract translation: 一种包括包括多个像素的像素阵列和位于所述像素阵列上方的滤光器阵列的装置，所述滤色器阵列包括多个平铺的最小重复单元，每个最小重复单元包括多个嵌入式滤波器组，每个滤波器组包括 与过滤器阵列中设置的任何其他过滤器不同的一组颜色。 公开和要求保护其他实施例。