Production Method for a Component

    公开(公告)号:US20210351319A1

    公开(公告)日:2021-11-11

    申请号:US17277764

    申请日:2019-09-12

    Abstract: In an embodiment a method for manufacturing optoelectronic components includes providing a metal sheet, milling the metal sheet, structuring the metal sheet into a lead frame blank with the intermediate pieces, applying a plurality of semiconductor devices to the intermediate pieces and separating to form the components. Each components may include an optoelectronic semiconductor device including at least two electrical contact surfaces on an assembly side, a lead frame base and electrical connection surfaces for external electrical contacting of the semiconductor device, wherein each base comprises at least two metallic intermediate pieces, wherein each of the intermediate pieces is fastened directly to one of the contact surfaces, and wherein the intermediate pieces are each L-shaped or T-shaped.

Patent Agency Ranking