公开(公告)号：US11810845B2

公开(公告)日：2023-11-07

申请号：US16758371

申请日：2018-10-30

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  Konrad Wagner ,  Michael Förster ,  Josef Hirn

IPC: H01L23/498 ,  H01L21/48 ,  H01L33/62 ,  H01L33/64 ,  H01L23/373 ,  H01L25/075 ,  H01L25/16 ,  H01L23/15

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L23/15 ,  H01L23/373 ,  H01L23/3731 ,  H01L23/3732 ,  H01L23/3733 ,  H01L23/3736 ,  H01L23/3738 ,  H01L2224/48091 ,  H01L2933/0066 ,  H01L2933/0075

Abstract: Carrier with an electrically insulating base material, electrically conductive through-connections and a thermal connection element. The through-connections and the thermal connection element are each completely surrounded by the base material in the lateral direction, the thermal connection element and the through-connections completely penetrating the base material perpendicularly to the main extension plane of the carrier, and the thermal connection element being formed with a material which has a thermal conductivity of at least 200 W/(m K).

公开(公告)号：US20210281041A1

公开(公告)日：2021-09-09

申请号：US17261300

申请日：2019-07-15

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  Frank Singer ,  Christoph Koller

IPC: H01S5/02255 ,  H01S5/02234 ,  H01S5/00 ,  H01S5/028 ,  H01S5/40 ,  H01S5/02216

Abstract: The invention relates to a semiconductor laser including a carrier, an edge-emitting laser diode which is arranged on the carrier and which has an active zone for generating laser radiation and a facet with a radiation exit area, an optical element which covers the facet, a connecting material which is arranged between the optical element and the facet, a molded body which covers the laser diode and the optical element at least in places, wherein the optical element is at least partially transparent to the laser radiation emitted by the laser diode during operation, and the optical element is designed to change the main propagation direction of the laser radiation entering the optical element during operation.

公开(公告)号：US11955767B2

公开(公告)日：2024-04-09

申请号：US17264662

申请日：2019-08-01

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  David Racz

IPC: H01S5/022 ,  H01S5/00 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/40

CPC classification number: H01S5/0087 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/4056 ,  H01S5/4087

Abstract: In an embodiment a radiation-emitting component includes a first semiconductor chip configured to generate first primary electromagnetic radiation, a second semiconductor chip configured to generate second primary electromagnetic radiation, a first conversion element configured to partially convert the first and/or the second primary electromagnetic radiation into a first secondary radiation, wherein the first semiconductor chip is a first semiconductor laser diode, wherein the first primary electromagnetic radiation is blue primary radiation and wherein the first secondary radiation is green secondary radiation and a first optical element arranged between radiation emitting surfaces of the first semiconductor chip and the second semiconductor chip, wherein the first optical element is reflective for the first primary radiation and the second primary radiation.

公开(公告)号：US11870214B2

公开(公告)日：2024-01-09

申请号：US17971156

申请日：2022-10-21

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  Harald König ,  Alfred Lell ,  Florian Peskoller ,  Karsten Auen ,  Roland Schulz ,  Herbert Brunner ,  Frank Singer ,  Roland Hüttinger

IPC: H01S5/028 ,  H01S5/0236 ,  H01S5/02253 ,  H01S5/02326 ,  H01S5/00

CPC classification number: H01S5/028 ,  H01S5/0236 ,  H01S5/02253 ,  H01S5/02326 ,  H01S5/0078 ,  H01S5/0087

Abstract: In one embodiment the semiconductor laser comprises a carrier and an edge-emitting laser diode which is mounted on the carrier and which comprises an active zone for generating a laser radiation and a facet with a radiation exit region. The semiconductor laser further comprises a protective cover, preferably a lens for collimation of the laser radiation. The protective cover is fastened to the facet and to a side surface of the carrier by means of an adhesive. A mean distance between a light entrance side of the protective cover and the facet is at most 60 μm. The semiconductor laser is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.

公开(公告)号：US11735887B2

公开(公告)日：2023-08-22

申请号：US16754723

申请日：2018-10-08

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  Harald König ,  Alfred Lell ,  Florian Peskoller ,  Karsten Auen ,  Roland Schulz ,  Herbert Brunner ,  Frank Singer ,  Roland Hüttinger

IPC: H01S5/028 ,  H01S5/0236 ,  H01S5/02253 ,  H01S5/02326 ,  H01S5/00

CPC classification number: H01S5/028 ,  H01S5/0236 ,  H01S5/02253 ,  H01S5/02326 ,  H01S5/0078 ,  H01S5/0087

Abstract: In one embodiment the semiconductor laser (1) comprises a carrier (2) and an edge-emitting laser diode (3) which is mounted on the carrier (2) and which comprises an active zone (33) for generating a laser radiation (L) and a facet (30) with a radiation exit region (31). The semiconductor laser (1) further comprises a protective cover (4), preferably a lens for collimation of the laser radiation (L). The protective cover (4) is fastened to the facet (30) and to a side surface (20) of the carrier (2) by means of an adhesive (5). A mean distance between a light entrance side (41) of the protective cover (4) and the facet (30) is at most 60 μm. The semiconductor laser (1) is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.

公开(公告)号：US11316075B2

公开(公告)日：2022-04-26

申请号：US16754720

申请日：2018-10-08

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  Christoph Koller ,  Andreas Dobner

IPC: H01L33/48 ,  H01L33/52 ,  H01L33/62 ,  H01S5/02208 ,  H01S5/0237 ,  H01S5/02326 ,  H01S5/022 ,  H01S5/02315

Abstract: In one embodiment, the optoelectronic semiconductor component (1) comprises a semiconductor chip (2) for generating radiation and an inorganic housing (3). The semiconductor chip (2) is accommodated in a hermetically sealed manner in the housing (3). The housing (3) has a preferably ceramic base plate (31), a cover plate (33) and at least one preferably ceramic housing ring (32) and a plurality of electrical through-connections (51). A recess (15), in which the semiconductor chip (2) is located, is formed by the housing ring (32). The base plate (31) has a plurality of electrical connection surfaces (35) on a component underside (11). A plurality of through-connections (51) each extend through the base plate (31), through the cover plate (33) and through the housing ring (32). The base plate (31), the at least one housing ring (32) and the cover plate (33) are firmly connected to one another via continuous, peripheral inorganic sealing frames (6). Finally, the housing (3) comprises a radiation exit region (34) for emitting radiation.

公开(公告)号：US11611191B2

公开(公告)日：2023-03-21

申请号：US17040412

申请日：2019-03-06

Applicant: OSRAM OLED GmbH

Inventor： Frank Singer ,  Jörg Erich Sorg

IPC: H01S5/02355 ,  H01S5/02257 ,  H01S5/02253 ,  H01S5/02216

Abstract: An optoelectronic component is provided that includes a radiation-emitting semiconductor chip, which emits electromagnetic radiation from a radiation exit surface during operation, a carrier comprising at least two first contact points, and a cover including at least two second contact points, wherein the at least two first contact points and the at least two second contact points are electrically conductively and/or thermally conductively connected to one another by a first plurality of nanowires and a second plurality of nanowires, and the nanowires provide a mechanically stable connection between the carrier and the cover. In addition, a method for producing an optoelectronic component is provided.

公开(公告)号：US20210313759A1

公开(公告)日：2021-10-07

申请号：US17264662

申请日：2019-08-01

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  David Racz

IPC: H01S5/00 ,  H01S5/40 ,  H01S5/02255 ,  H01S5/02257

Abstract: In an embodiment a radiation-emitting component includes a first semiconductor chip configured to generate first primary electromagnetic radiation, a second semiconductor chip configured to generate second primary electromagnetic radiation, a first conversion element configured to partially convert the first and/or the second primary electromagnetic radiation into a first secondary radiation, wherein the first semiconductor chip is a first semiconductor laser diode, wherein the first primary electromagnetic radiation is blue primary radiation and wherein the first secondary radiation is green secondary radiation and a first optical element arranged between radiation emitting surfaces of the first semiconductor chip and the second semiconductor chip, wherein the first optical element is reflective for the first primary radiation and the second primary radiation.

公开(公告)号：US20210075187A1

公开(公告)日：2021-03-11

申请号：US17040412

申请日：2019-03-06

Applicant: OSRAM OLED GmbH

Inventor： Frank Singer ,  Jörg Erich Sorg

IPC: H01S5/022

Abstract: An optoelectronic component is provided that includes a radiation-emitting semiconductor chip, which emits electromagnetic radiation from a radiation exit surface during operation, a carrier comprising at least two first contact points, and a cover comprising at least two second contact points (4c), wherein the at least two first contact points and the at least two second contact points are electrically conductively and/or thermally conductively connected to one another by a first plurality of nanowires and a second plurality (6b) of nanowires, and the nanowires provide a mechanically stable connection between the carrier and the cover. In addition, a method for producing an optoelectronic component is given.

公开(公告)号：US20240030677A1

公开(公告)日：2024-01-25

申请号：US18355572

申请日：2023-07-20

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  Frank Singer ,  Christoph Koller

IPC: H01S5/02255 ,  H01S5/00 ,  H01S5/02234 ,  H01S5/02216 ,  H01S5/028 ,  H01S5/40 ,  H01S5/185

CPC classification number: H01S5/02255 ,  H01S5/0087 ,  H01S5/02234 ,  H01S5/02216 ,  H01S5/028 ,  H01S5/4012 ,  H01S5/4031 ,  H01S5/4075 ,  H01S5/185

Abstract: The invention relates to a semiconductor laser including a carrier, an edge-emitting laser diode which is arranged on the carrier and which has an active zone for generating laser radiation and a facet with a radiation exit area, an optical element which covers the facet, a connecting material which is arranged between the optical element and the facet, a molded body which covers the laser diode and the optical element at least in places, wherein the optical element is at least partially transparent to the laser radiation emitted by the laser diode during operation, and the optical element is designed to change the main propagation direction of the laser radiation entering the optical element during operation.