公开(公告)号：US11888097B2

公开(公告)日：2024-01-30

申请号：US17253566

申请日：2019-07-01

Applicant: OSRAM OLED GmbH

Inventor： Konrad Wagner ,  Daniel Richter ,  Gunnar Petersen ,  Nicole Berner ,  Michael Förster

IPC: H01L33/54 ,  H01L25/075 ,  H01L33/56

CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L33/56 ,  H01L2933/005

Abstract: An optoelectronic component (1) is specified, with at least one radiation-emitting semiconductor chip generating electromagnetic radiation during operation, a coating surrounding the at least one semiconductor chip in lateral directions, a magnetic structure covered by the coating, wherein the magnetic structure enables the component to be identified. Furthermore, a process for the manufacture of such an optoelectronic component is given.

公开(公告)号：US11810845B2

公开(公告)日：2023-11-07

申请号：US16758371

申请日：2018-10-30

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  Konrad Wagner ,  Michael Förster ,  Josef Hirn

IPC: H01L23/498 ,  H01L21/48 ,  H01L33/62 ,  H01L33/64 ,  H01L23/373 ,  H01L25/075 ,  H01L25/16 ,  H01L23/15

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L23/15 ,  H01L23/373 ,  H01L23/3731 ,  H01L23/3732 ,  H01L23/3733 ,  H01L23/3736 ,  H01L23/3738 ,  H01L2224/48091 ,  H01L2933/0066 ,  H01L2933/0075

Abstract: Carrier with an electrically insulating base material, electrically conductive through-connections and a thermal connection element. The through-connections and the thermal connection element are each completely surrounded by the base material in the lateral direction, the thermal connection element and the through-connections completely penetrating the base material perpendicularly to the main extension plane of the carrier, and the thermal connection element being formed with a material which has a thermal conductivity of at least 200 W/(m K).

公开(公告)号：US11538969B2

公开(公告)日：2022-12-27

申请号：US16954472

申请日：2018-12-18

Applicant: Osram OLED GmbH

Inventor： Michael Foerster ,  Konrad Wagner ,  Benjamin Schulz ,  Stefan Morgott ,  I-Hsin Lin-Lefebvre

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/50

Abstract: In one embodiment, the optoelectronic semiconductor component comprises at least one semiconductor chip for generating a primary radiation, and also an optical body disposed optically downstream of the semiconductor chip. A reflector surrounds the optical body laterally all around in a positively locking manner and is configured for reflecting the primary radiation and visible light. The optical body has a base surface facing the semiconductor chip and an exit surface facing away from the semiconductor chip. The optical body tapers in a direction away from the semiconductor chip. A quotient of the base surface and a height of the optical body is between 1 mm and 30 mm inclusive.