公开(公告)号：US11545601B2

公开(公告)日：2023-01-03

申请号：US17052618

申请日：2019-05-02

Applicant: OSRAM OLED GmbH

Inventor： Matthias Hien

IPC: H01L33/54 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/52 ,  H01L25/075

Abstract: In an embodiment a component includes at least two component parts configured to generate electromagnetic radiation, two encapsulations and a one-piece carrier frame having a plurality of openings, each opening in form of a through-hole, wherein the component parts are arranged in different openings such that a respective component part is laterally spaced apart from inner walls of an associated opening, wherein each component part is enclosed in lateral directions by one of the encapsulations such that the component parts are mechanically connected to the carrier frame via the encapsulations thereby forming a self-supporting and mechanically stable unit, wherein the carrier frame comprises a casting material, the casting material being a castable silicone, a resin or a plastic material, and wherein the two encapsulations arranged in the two openings of the carrier frame have different materials or different fluorescents.

公开(公告)号：US11462500B2

公开(公告)日：2022-10-04

申请号：US16962175

申请日：2019-01-23

Applicant: OSRAM OLED GmbH

Inventor： Matthias Hien ,  Matthias Goldbach ,  Michael Zitzlsperger ,  Ludwig Peyker

IPC: H01L23/00 ,  H01L25/04 ,  H01L25/075 ,  H01L25/16 ,  H01L31/02 ,  H01L33/62 ,  H01L31/0203 ,  H01L33/52 ,  H01L33/60

Abstract: In one embodiment, an optoelectronic semiconductor device includes at least two lead frame parts and an optoelectronic semiconductor chip which is mounted in a mounting region on one of the lead frame parts. The lead frame parts are mechanically connected to one another via a casting body. The semiconductor chip is embedded in the cast body. In the mounting region the respective lead frame part has a reduced thickness. An electrical line is led over the cast body from the semiconductor chip to a connection region of the other of the lead frame parts. In the connection region, the respective lead frame part has the full thickness. From the connection region to the semiconductor chip the electrical line does not overcome any significant difference in height.

公开(公告)号：US20210167259A1

公开(公告)日：2021-06-03

申请号：US17052618

申请日：2019-05-02

Applicant: OSRAM OLED GmbH

Inventor： Matthias Hien

IPC: H01L33/54 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60

Abstract: In an embodiment a component includes at least two component parts configured to generate electromagnetic radiation, two encapsulations and a one-piece carrier frame having a plurality of openings, each opening in form of a through-hole, wherein the component parts are arranged in different openings such that a respective component part is laterally spaced apart from inner walls of an associated opening, wherein each component part is enclosed in lateral directions by one of the encapsulations such that the component parts are mechanically connected to the carrier frame via the encapsulations thereby forming a self-supporting and mechanically stable unit, wherein the carrier frame comprises a casting material, the casting material being a castable silicone, a resin or a plastic material, and wherein the two encapsulations arranged in the two openings of the carrier frame have different materials or different fluorescents.

公开(公告)号：US11329199B2

公开(公告)日：2022-05-10

申请号：US16762056

申请日：2019-01-24

Applicant: OSRAM OLED GmbH

Inventor： Britta Göötz ,  Matthias Hien ,  Andreas Dobner ,  Peter Brick ,  Matthias Goldbach ,  Uli Hiller ,  Sebastian Stigler

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60

Abstract: An optoelectronic semiconductor chip, a method for manufacturing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment an optoelectronic semiconductor chip includes a semiconductor layer sequence having an emission side, the emission side comprising a plurality of emission fields, partition walls on the emission side in a region between two adjacent emission fields and a conversion element on one or more emission fields, wherein the conversion element includes a matrix material with first phosphor particles incorporated therein, wherein the first phosphor particles are sedimented in the matrix material such that a mass fraction of the first phosphor particles is greater in a lower region of the conversion element facing the semiconductor layer sequence than in a remaining region of the conversion element, and wherein the partition walls are attached to the emission side without any additional connectors.

公开(公告)号：US20200343419A1

公开(公告)日：2020-10-29

申请号：US16762056

申请日：2019-01-24

Applicant: OSRAM OLED GmbH

Inventor： Britta Göötz ,  Matthias Hien ,  Andreas Dobner ,  Peter Brick ,  Matthias Goldbach ,  Uli Hiller ,  Sebastian Stigler

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60

Abstract: An optoelectronic semiconductor chip, a method for manufacturing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment an optoelectronic semiconductor chip includes a semiconductor layer sequence having an emission side, the emission side comprising a plurality of emission fields, partition walls on the emission side in a region between two adjacent emission fields and a conversion element on one or more emission fields, wherein the conversion element includes a matrix material with first phosphor particles incorporated therein, wherein the first phosphor particles are sedimented in the matrix material such that a mass fraction of the first phosphor particles is greater in a lower region of the conversion element facing the semiconductor layer sequence than in a remaining region of the conversion element, and wherein the partition walls are attached to the emission side without any additional connectors.