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公开(公告)号:US12027656B2
公开(公告)日:2024-07-02
申请号:US17431073
申请日:2020-02-17
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Michael Zitzlsperger , Matthias Goldbach , Benjamin Höflinger
IPC: H01L27/15 , H01L23/495 , H01L25/075 , H01L33/00 , H01L33/48 , H01L33/60 , H01L33/62
CPC classification number: H01L33/62 , H01L23/495 , H01L25/0753 , H01L33/005 , H01L33/486 , H01L33/60 , H01L2933/0058 , H01L2933/0066
Abstract: In one embodiment, the optoelectronic semiconductor device comprises at least two metallic lead frame parts and a circuit chip on the lead frame parts. An electrically insulating and opaque matrix material mechanically connects the lead frame parts. The circuit chip is embedded in the matrix material, so that a carrier is formed by the matrix material together with the lead frame parts and the circuit chip. An optoelectronic semiconductor chip is provided on a carrier upper side. Furthermore, the semiconductor device comprises at least one optical component on the carrier upper side.
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2.
公开(公告)号:US11388798B2
公开(公告)日:2022-07-12
申请号:US17264241
申请日:2020-09-15
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Martin Moritz , Sebastian Stigler , Uli Hiller , Benjamin Höflinger
Abstract: A method for operating an optoelectronic semiconductor device. The semiconductor device includes a first optoelectronic semiconductor chip for generating, for example, blue light, an optional second optoelectronic semiconductor chip for generating, for example, green light, and a third optoelectronic semiconductor chip for generating, for example, red light. The semiconductor device also includes a driver unit which supplies the semiconductor chips with current during operation. The third semiconductor chip is operated on the basis of a temperature-brightness characteristic curve stored in the driver unit. The temperature-brightness characteristic curve is configured for a minimum color location deviation over an intended operating temperature range, relative to at least one reference color location.
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