公开(公告)号：US10192756B2

公开(公告)日：2019-01-29

申请号：US15573651

申请日：2016-05-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Richter ,  Brendan Holland

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L33/62 ,  H01L33/48 ,  H01L25/075

Abstract: A method of processing a lead frame having at least one electrically conductive contact section includes forming a depression in the at least one electrically conductive contact section so that a first electrically conductive contact subsection and a second electrically conductive contact subsection are formed, which are delimited from one another by the depression, and forming a housing made of a housing material, which housing includes a housing frame that at least partially embeds the lead frame, formation of the housing including introduction of housing material into the depression so that a housing frame section formed by the housing material introduced into the depression is formed between the first and second electrically conductive contact subsections to mechanically stabilize the first and second electrical conductive contact subsections by the housing frame section.

公开(公告)号：US20180096861A1

公开(公告)日：2018-04-05

申请号：US15573651

申请日：2016-05-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Richter ,  Brendan Holland

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L33/62

CPC classification number: H01L21/4839 ,  H01L21/4828 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49861 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/27013 ,  H01L2933/0033

Abstract: A method of processing a lead frame having at least one electrically conductive contact section includes forming a depression in the at least one electrically conductive contact section so that a first electrically conductive contact subsection and a second electrically conductive contact subsection are formed, which are delimited from one another by the depression, and forming a housing made of a housing material, which housing includes a housing frame that at least partially embeds the lead frame, formation of the housing including introduction of housing material into the depression so that a housing frame section formed by the housing material introduced into the depression is formed between the first and second electrically conductive contact subsections to mechanically stabilize the first and second electrical conductive contact subsections by the housing frame section.

公开(公告)号：US20220336701A1

公开(公告)日：2022-10-20

申请号：US17638660

申请日：2020-07-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Brendan Holland

IPC: H01L33/20 ,  H01L33/62 ,  H01L33/10 ,  H01L33/00

Abstract: In an embodiment a semiconductor chip includes a semiconductor body having a first region, a second region, and an active region between the first region and the second region, indentations in the first region, a TCO material in the indentations and a carrier, wherein the indentations of the first region are arranged on a side of the first region facing away from the carrier, and wherein the TCO material is flush with a surface of the first region facing away from the active region.

公开(公告)号：US20190229241A1

公开(公告)日：2019-07-25

申请号：US16331121

申请日：2017-09-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Rudolf Behringer ,  Brendan Holland ,  Jana Sommerfeld ,  Sabine vom Dorp

IPC: H01L33/38 ,  H01L33/42 ,  H01L33/44

Abstract: A method for producing an electrical contact on a semiconductor layer and a semiconductor component having an electrical contact are disclosed. In an embodiment a method includes providing a semiconductor layer, forming a plurality of contact rods on the semiconductor layer, wherein the contact rods are formed by a first material and a second material, wherein the first material is applied to the semiconductor layer and the second material is applied to the first material, and wherein a lateral structure of the first material is self-organized, forming a filling layer on the contact rods and in intermediate spaces between the contact rods and exposing the contact rods.

公开(公告)号：US11763731B2

公开(公告)日：2023-09-19

申请号：US17610631

申请日：2020-04-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Brendan Holland ,  Gunnar Petersen ,  Daniel Richter

IPC: G09G3/32 ,  G09G3/20

CPC classification number: G09G3/32 ,  G09G3/2074 ,  G09G2300/0809 ,  G09G2310/066 ,  G09G2320/0242 ,  G09G2320/0653 ,  G09G2320/0686 ,  G09G2330/023

Abstract: A display apparatus includes a multiplicity of picture elements for emitting visible light in different colors in an adjustable manner by means of a plurality of semiconductor layer sequences. Each of the picture elements has a plurality of types of pixels and each type of pixels is configured for emitting light of a specific color. The pixels are each subdivided into a plurality of sub-pixel. All the sub-pixels are configured for emitting light of the same color out of the display apparatus without further color change. At least two sub-pixels within each pixel have emission areas of different sizes. An electrical control unit is assigned to each pixel. The control units are each configured to automatically control the sub-pixels of a relevant pixel depending on an energization intensity in such a way that a light-emitting area of the relevant pixel increases in stepped fashion with the energization intensity.

公开(公告)号：US10854784B2

公开(公告)日：2020-12-01

申请号：US16331121

申请日：2017-09-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Rudolf Behringer ,  Brendan Holland ,  Jana Sommerfeld ,  Sabine vom Dorp

IPC: H01L33/38 ,  H01L33/42 ,  H01L33/44 ,  H01L33/40

Abstract: A method for producing an electrical contact on a semiconductor layer and a semiconductor component having an electrical contact are disclosed. In an embodiment a method includes providing a semiconductor layer, forming a plurality of contact rods on the semiconductor layer, wherein the contact rods are formed by a first material and a second material, wherein the first material is applied to the semiconductor layer and the second material is applied to the first material, and wherein a lateral structure of the first material is self-organized, forming a filling layer on the contact rods and in intermediate spaces between the contact rods and exposing the contact rods.